Francesca Iacopi

Bio: Francesca Iacopi is an academic researcher from University of Technology, Sydney. The author has contributed to research in topics: Graphene & Silicon carbide. The author has an hindex of 29, co-authored 168 publications receiving 2733 citations. Previous affiliations of Francesca Iacopi include Katholieke Universiteit Leuven & Vrije Universiteit Brussel.

Graphene growth on silicon carbide: A review

Abstract: Graphene has been widely heralded over the last decade as one of the most promising nanomaterials for integrated, miniaturized applications spanning from nanoelectronics, interconnections, thermal management, sensing, to optoelectronics. Graphene grown on silicon carbide is currently the most likely candidate to fulfill this promise. As a matter of fact, the capability to synthesize high-quality graphene over large areas using processes and substrates compatible as much as possible with the well-established semiconductor manufacturing technologies is one crucial requirement. We review here, the enormous scientific and technological advances achieved in terms of epitaxial growth of graphene from thermal decomposition of bulk silicon carbide and the fine control of the graphene electronic properties through intercalation. Finally, we discuss perspectives on epitaxial graphene growth from silicon carbide on silicon, a particularly challenging area that could result in maximum benefit for the integration of graphene with silicon technologies.

Plasma-enhanced chemical vapour deposition growth of Si nanowires with low melting point metal catalysts: an effective alternative to Au-mediated growth

Abstract: Au nanoparticles are efficient catalysts for the vapour?solid?liquid (VLS) growth of semiconductor nanowires, but Au poses fundamental reliability concerns for applications in Si semiconductor technology. In this work we show that the choice of catalysts for Si nanowire growth can be broadened when the need for catalytic precursor dissociation is eliminated through the use of plasma enhancement. However, in this regime the incubation time for the activation of VLS growth must be minimized to avoid burying the catalyst particles underneath an amorphous Si layer. We show that the combined use of plasma enhancement and the use of a catalyst such as In, already in a liquid form at the growth temperature, is a powerful method for obtaining Si nanowire growth with high yield. Si nanowires grown by this method are monocrystalline and generally oriented in the direction.

Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation

Abstract: The short-ranged bonding structure of organosilicate glasses can vary to a great extent and is directly linked to the mechanical properties of the thin film material. The combined action of ultraviolet (UV) radiation and thermal activation is shown to generate a pronounced rearrangement in the bonding structure of thin organosilicate glass films involving no significant compositional change or film densification. Nuclear magnetic resonance spectroscopy indicates loss of –OH groups and an increase of the degree of cross-linking of the organosilicate matrix for UV-treated films. Fourier transform infrared spectroscopy shows a pronounced enhancement of the Si–O–Si network bond structure, indicating the formation of more energetically stable silica bonds. Investigation with x-ray reflectivity and ellipsometric porosimetry indicated only minor film densification. As a consequence, the mechanical properties of microporous organosilicate dielectric films are substantially enhanced while preserving the organosilicate nature and pristine porosity of the films. UV-treated films show an increase in elastic modulus and hardness of more than 40%, and a similar improvement in fracture energy compared to untreated films. A minor increase in material dielectric constant from 3.0 to 3.15 was observed after UV treatment. This mechanism is of high relevance for the application of organosilicate glasses as dielectric materials for microelectronics interconnects, for which a high mechanical stability and a low dielectric constant are both essential film requirements.

I and i

Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

The path towards sustainable energy

Abstract: Civilization continues to be transformed by our ability to harness energy beyond human and animal power. A series of industrial and agricultural revolutions have allowed an increasing fraction of the world population to heat and light their homes, fertilize and irrigate their crops, connect to one another and travel around the world. All of this progress is fuelled by our ability to find, extract and use energy with ever increasing dexterity. Research in materials science is contributing to progress towards a sustainable future based on clean energy generation, transmission and distribution, the storage of electrical and chemical energy, energy efficiency, and better energy management systems.

Silica-based mesoporous organic-inorganic hybrid materials.

Abstract: Mesoporous organic-inorganic hybrid materials, a new class of materials characterized by large specific surface areas and pore sizes between 2 and 15 nm, have been obtained through the coupling of inorganic and organic components by template synthesis. The incorporation of functionalities can be achieved in three ways: by subsequent attachment of organic components onto a pure silica matrix (grafting), by simultaneous reaction of condensable inorganic silica species and silylated organic compounds (co-condensation, one-pot synthesis), and by the use of bissilylated organic precursors that lead to periodic mesoporous organosilicas (PMOs). This Review gives an overview of the preparation, properties, and potential applications of these materials in the areas of catalysis, sorption, chromatography, and the construction of systems for controlled release of active compounds, as well as molecular switches, with the main focus being on PMOs.

Low dielectric constant materials for microelectronics

Abstract: The ever increasing requirements for electrical performance of on-chip wiring has driven three major technological advances in recent years. First, copper has replaced Aluminum as the new interconnect metal of choice, forcing also the introduction of damascene processing. Second, alternatives for SiO2 with a lower dielectric constant are being developed and introduced in main stream processing. The many new resulting materials needs to be classified in terms of their materials characteristics, evaluated in terms of their properties, and tested for process compatibility. Third, in an attempt to lower the dielectric constant even more, porosity is being introduced into these new materials. The study of processes such as plasma interactions and swelling in liquid media now becomes critical. Furthermore, pore sealing and the deposition of a thin continuous copper diffusion barrier on a porous dielectric are of prime importance. This review is an attempt to give an overview of the classification, the character...

Nonlinear analyses of wrinkles in a film bonded to a compliant substrate

Abstract: Subject to a compressive membrane force, a film bonded to a compliant substrate often forms a pattern of wrinkles. This paper studies such wrinkles in a layered structure used in several recent experiments. The structure comprises a stiff film bonded to a compliant substrate, which in turn is bonded to a rigid support. Two types of analyses are performed. First, for sinusoidal wrinkles, by minimizing energy, we obtain the wavelength and the amplitude of the wrinkles for substrates of various moduli and thicknesses. Second, we develop a method to simultaneously evolve the two-dimensional pattern in the film and the three-dimensional elastic field in the substrate. The simulations show that the wrinkles can evolve into stripes, labyrinths, or herringbones, depending on the anisotropy of the membrane forces. Statistical averages of the amplitude and wavelength of wrinkles of various patterns correlate well with the analytical solution of the sinusoidal wrinkles.