F
Fred Barlow
Researcher at University of Idaho
Publications - 88
Citations - 1456
Fred Barlow is an academic researcher from University of Idaho. The author has contributed to research in topics: Power module & Fourier transform. The author has an hindex of 19, co-authored 88 publications receiving 1368 citations. Previous affiliations of Fred Barlow include Virginia Tech & Metropolitan State University of Denver.
Papers
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Journal ArticleDOI
Power Conversion With SiC Devices at Extremely High Ambient Temperatures
Tsuyoshi Funaki,Juan Carlos Balda,J. Junghans,Avinash Srikrishnan Kashyap,Homer Alan Mantooth,Fred Barlow,Tsunenobu Kimoto,Takashi Hikihara +7 more
TL;DR: In this article, the capability of SiC power semiconductor devices, in particular JFET and Schottky barrier diodes (SBDs), for application in high-temperature power electronics was evaluated.
Proceedings ArticleDOI
Extending the ZVS Operating Range of Dual Active Bridge High-Power DC-DC Converters
TL;DR: A novel pulse width modulation strategy to extend the conventional soft-switching operating mode region and its analysis are presented and Experimental results are given in order to validate the theoretical analysis and practical feasibility of the proposed strategy.
Journal ArticleDOI
Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter
Fan Xu,Timothy Junghee Han,Dong Jiang,Leon M. Tolbert,Fei Wang,Jim Nagashima,Sung Joon Kim,Srikanth Kulkarni,Fred Barlow +8 more
TL;DR: In this paper, a fully integrated silicon carbide (SiC)-based six-pack power module is designed and developed for electric vehicle and hybrid electric vehicle applications, where each switching element is composed of four paralleled SiC junction gate field effect transistors (JFETs) with two antiparallel SiC Schottky barrier diodes.
Journal ArticleDOI
An overview to integrated power module design for high power electronics packaging
TL;DR: The concept of Integrated Power Modules (IPMs) was introduced in this article, in which the electronic control circuitry and the high power electronics of the converter are integrated into a single compact standardized module.
Journal ArticleDOI
Fabrication of microvias for multilayer LTCC substrates
TL;DR: In this paper, the authors used a stack and tack machine with a three-camera vision system and an adjustable precision stage to achieve less than 25/spl mu/m layer-to-layer misalignment in both X and Y directions across the substrate.