An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

Electroosmotic microchannel cooling system

A semiconductor device package comprises a substrate (10), a flip-chip (16), an underfill adhesive (25), and a thermally and electrically conductive plastic material (20). A leadless circuit carrying substrate has a metallization pattern (13) on a first side (15), one portion of the metallization pattern being a circuit ground (17). The second side has an array of surface mount solder pads (24) electrically connected to the metallization pattern by means of at least one conductive via (26) through the substrate. A semiconductor device (16) is flip-chip mounted to the metallization pattern by means of metal bumps (22). An underfill adhesive (25) fills the gap between the semiconductor device and the substrate. A thermally and electrically conductive plastic material (20) containing metal particles is transfer molded to encapsulate the semiconductor device, the underfill adhesive, and a portion of the first side of the leadless circuit carrying substrate, forming a cover. The conductive plastic material is electrically connected to the circuit ground to shield the semiconductor device from radio frequency energy, and is mechanically attached to the semiconductor device to dissipate heat. Fins (28) may be molded into the conductive plastic material to further enhance the ability to dissipate heat.

Thermally conductive integrated circuit package with radio frequency shielding

Provided are a method, system, and program for managing multiple resources in a system at a service level, including at least one host, network, and a storage space comprised of at least one storage system that each host is capable of accessing over the network. A plurality of service level parameters are measured and monitored indicating a state of the resources in the system. A determination is made of values for the service level parameters and whether the service level parameter values satisfy predetermined service level thresholds. Indication is made as to whether the service level parameter values satisfy the predetermined service thresholds. A determination is made of a modification to one or more resource deployments or configurations if the value for the service level parameter for the resource does not satisfy the predetermined service level thresholds.

Method, system, and program for determining a modification of a system resource configuration

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Probe card assembly and kit, and methods of making same

A semiconductor chip carrier, an electronic module having the semiconductor chip carrier mounted therein, and an electronic device incorporating the electronic module. A semiconductor chip carrier comprises a multi-layer wiring substrate including a multi-layer ceramic board, and a thin film circuit mounted on said multi-layer ceramic board, and a semiconductor chip mounted and connected to the thin film circuit, wherein a low-resistance conductor path is provided on the surface of or in the multi-layer wiring substrate to connect between signal terminals which need to be connected with a low-resistance wire in the semiconductor chip, thereby realizing signal transmission at low resistance between the signal terminals of the semiconductor chip by this conductor path. This arrangement makes it possible to shorten the signal delay time of a semiconductor chip, and achieve higher speed signal processing in modules and electronic equipment in which a thus-improved semiconductor chip is used.

Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module

A semiconductor resin package structure formed according to the flip-chip connection method and permitting to cool the rear surface of semiconductor chips, comprising semiconductor chip and carrier substrate which is soldered on one surface thereof to electrodes of the semiconductor chip according to the flip-chip connection method, the gap between the semiconductor chip and the carrier substrate being filled with resin having a thermal expansion coefficient, which is approximately equal to that of used solder, the electrodes of the semiconductor chip being electrically connected with terminals on the other surface of the carrier substrate through the soldered portions and a through-hole conductor disposed on the carrier substrate, the thermal expansion coefficient of the carrier substrate being approximately equal to that of a multi-layer substrate, with which the substrate is connected by soldering with the terminals.

Semiconductor resin package structure

In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved quick couplers are used for the connection to the supply duct and the return duct, and valveless quick couplers are used for the connection to the cold plates. When a circuit module is to be serviced, a desired string of cold plates is disconnected from the supply duct and the return duct by disjoining the valved quick couplers for the connection thereto. The disconnected string of cold plates is drained of the coolant, and then the cold plate attached to the desired circuit module is disconnected from the hoses. Subsequently the desired circuit module and the cold plate attached thereto can be detached as one body from an associated connector.

Electronic apparatus cooling system

This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.

Cooling module for integrated circuit chips

A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

Fumiyuki Kobayashi

Papers

Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module

Semiconductor resin package structure

Electronic apparatus cooling system

Cooling module for integrated circuit chips

Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system