Gabriel Paul Kniffin

Bio: Gabriel Paul Kniffin is an academic researcher. The author has contributed to research in topics: Terahertz nondestructive evaluation & Electromagnetics. The author has an hindex of 1, co-authored 1 publications receiving 3 citations.

Physics-Based Imaging Methods for Terahertz Nondestructive Evaluation Applications

Abstract: Lying between the microwave and far infrared (IR) regions, the “terahertz gap” is a relatively unexplored frequency band in the electromagnetic spectrum that exhibits a unique combination of properties from its neighbors. Like in IR, many materials have characteristic absorption spectra in the terahertz (THz) band, facilitating the spectroscopic “fingerprinting” of compounds such as drugs and explosives. In addition, non-polar dielectric materials such as clothing, paper, and plastic are transparent to THz, just as they are to microwaves and millimeter waves. These factors, combined with sub-millimeter wavelengths and non-ionizing energy levels, makes sensing in the THz band uniquely suited for many NDE applications. In a typical nondestructive test, the objective is to detect a feature of interest within the object and provide an accurate estimate of some geometrical property of the feature. Notable examples include the thickness of a pharmaceutical tablet coating layer or the 3D location, size, and shape of a flaw or defect in an integrated circuit. While the material properties of the object under test are often tightly controlled and are generally known a priori, many objects of interest exhibit irregular surface topographies such as varying degrees of curvature over the extent of their surfaces. Common THz pulsed imaging (TPI) methods originally developed for objects with planar surfaces have been adapted for objects with curved surfaces through use of mechanical scanning procedures in which measurements are taken at normal incidence over the extent of the surface [1]. While effective, these methods often require expensive robotic arm assemblies, the cost and complexity of which would likely be prohibitive should a large volume of tests be needed to be carried out on a production line.

Development of laser-terahertz emission microscope for inspecting the electrical faults in semiconductor devices

Abstract: We have developed a laser-terahertz emission microscope for inspecting the electrical faults in integrated circuits. By improving the spatial resolution of the system, we successfully observed the THz emission image in a microprocessor chip on standby.