Gary L. Solbrekken

Bio: Gary L. Solbrekken is an academic researcher from University of Missouri. The author has contributed to research in topics: Thermoelectric effect & Heat sink. The author has an hindex of 11, co-authored 35 publications receiving 447 citations. Previous affiliations of Gary L. Solbrekken include University of Minnesota.

Comprehensive system-level optimization of thermoelectric devices for electronic cooling applications

Abstract: Advanced cooling solutions are needed to address the growing challenges posed by future generations of microprocessors. This paper outlines an optimization methodology for electronic system based thermoelectric (TE) cooling. This study stresses that an optimum TE cooling system should keep the electronic device below a critical junction temperature while utilizing the smallest possible heat sink. The methodology considers the electric current and TE geometry that will minimize the junction temperature. A comparison is made between the junction temperature minimization scheme and the more conventional coefficient of performance (COP) maximization scheme. It is found that it is possible to design a TE solution that will both maximize the COP and minimize the junction temperature. Experimental measurements that validate the modeling are also presented.

Analytical modeling of silicon thermoelectric microcooler

Abstract: Due to its inherently favorable properties, doped single-crystal silicon has potential application as an on-chip thermoelectric microcooler for advanced integrated circuits. In this paper, an analytical thermal model for silicon microcooler, which couples Peltier cooling with heat conduction and heat generation in the silicon substrate, and which includes heat conduction and heat generation in the metal lead, is derived and used to study the thermal characteristics of silicon thermoelectric microcoolers. The analytical modeling results are shown to be in good agreement with the experimental data and the results from electrothermal numerical simulations. The effects of metal lead, electric contact resistance, silicon doping concentrations, and microcooler sizes on the cooling performance are investigated. The cooling potential of such thermoelectric devices, represented by peak cooling and maximum cooling heat flux on the microcooler surface, is addressed.

Thermoelectric-powered convective cooling of microprocessors

Abstract: Forced convection cooling of a personal computer microprocessor, using power generated by thermoelectric (TE) conversion, has been modeled, analyzed, and demonstrated. This study was motivated by the desire to meet the demanding cooling requirements of notebook computers without consuming valuable battery power. The modest power generated by the TE necessitated a careful match between the TE device and the fan/heat-sink sub-system. The models and methodology used to maximize the cooling capability of TE-powered convection are presented and experimentally validated using a notebook computer prototype. In the experimental study described herein, a commercial fan was successfully driven by electricity generated from the heat of the microprocessor. It was determined that, at a junction temperature of 95 /spl deg/C, thermoelectric-powered cooling could perform nearly four times better than the best natural convection design.

Thermoelectric Micro-Cooler for Hot-Spot Thermal Management

Abstract: Driven by shrinking feature sizes, microprocessor “hot-spots” — with their associated high heat flux and sharp temperature gradients — have emerged as the primary “driver” for on-chip thermal management of today’s IC technology. Solid state thermoelectric micro-coolers offer great promise for reducing the severity of on-chip “hot-spots”, but the theoretical cooling potential of these devices, fabricated on the back of the silicon die in an IC package, has yet to be determined. The results of a three-dimensional electro-thermal finite-element modeling study of such a micro-cooler are presented. Attention is focused on the hot-spot temperature reductions associated with variations in micro-cooler geometry, chip thickness, and chip doping concentration, along with the parasitic Joule heating effects from the electrical contact resistance and current flow through the silicon. The modeling results help to define the optimum solid-state cooling configuration and reveal that, for the conditions examined, nearly 80% of the hot-spot temperature rise of 2.5°C can be removed from a 70μm × 70μm, 680W/cm2 hot-spot on a 50μm thick silicon die with a single micro-cooler.Copyright © 2005 by ASME

Thermal management of portable electronic equipment using thermoelectric energy conversion

Abstract: It has been well established that thermal management of electronic equipment is critical for the continued success of the microelectronics industry. Portable electronic devices, such as notebook computers and cellular telephones, require that the thermal solution be small, light, and energy efficient. Small-scale thermoelectric (TE) technology used to generate electricity from the waste heat of the microprocessor provides an opportunity to de-couple the thermal solution of electronic equipment from battery power. Suski proposed the concept of using a TE module to generate electricity from the waste heat of a microprocessor in a patent. The configuration shown in the patent, referred to here as the 'direct attach' configuration, does not lend itself to higher power microprocessors, as the thermal resistance for state-of-the-art TE modules is on the order of 15 K/W. This paper proposes an alternate configuration, referred to as the 'shunt attach' configuration, as a viable solution for using TE generation in the thermal management of portable electronic equipment. The new concept uses an alternate heat path to shunt excess heat away from the TE module. By managing the heat flow paths, sufficient electricity can be generated by using today's off-the-shelf TE technology to drive a cooling fan.