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Author

Gaurav Sharma

Other affiliations: Northeastern University, D. E. Shaw & Co., Hewlett-Packard  ...read more
Bio: Gaurav Sharma is an academic researcher from Shenzhen University. The author has contributed to research in topics: Medicine & Photocatalysis. The author has an hindex of 82, co-authored 1244 publications receiving 31482 citations. Previous affiliations of Gaurav Sharma include Northeastern University & D. E. Shaw & Co..


Papers
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Journal ArticleDOI
TL;DR: In this article, the optical, electrical, and morphological properties of photoactive films are discussed based on the experimental results along with the associated effect on device performances, and a substantial improvement in power conversion efficiencies (PCE) were observed as high as 68% and 31% for PTB7:PCBM and P3HT-PCBM blend with ZnO:CNT, respectively.

54 citations

01 Jan 2012
TL;DR: The Ad-hoc On-Demand Distance Vector (AODV) routing protocol is designed for use in ad-Hoc mobile networks and uses traditional routing tables, one entry per destination, and sequence numbers to determine whether routing information is up- to-date and to prevent routing loops.
Abstract: The Ad-hoc On-Demand Distance Vector (AODV) routing protocol is designed for use in ad-hoc mobile networks. AODV is a reactive protocol: the routes are created only when they are needed. It uses traditional routing tables, one entry per destination, and sequence numbers to determine whether routing information is up- to-date and to prevent routing loops. An important feature of AODV is the maintenance of time-based states in each node: a routing-entry not recently used is expired. In case of a route is broken the neighbors can be notified. Route discovery is based on query and reply cycles, and route information is stored in all intermediate nodes along the route in the form of route table entries. The following control packets are used: routing request message (RREQ) is broadcasted by a node requiring a route to another node, routing reply message (RREP) is unicasted back to the source of RREQ, and route error message (RERR) is sent to notify other nodes of the loss of the link. HELLO messages are used for detecting and monitoring links to neighbors.

53 citations

Journal ArticleDOI
TL;DR: In this paper, the role of secondary flows in the transport and dispersion of particles suspended in a turbulent square duct flow was investigated, and it was found that lateral mixing is enhanced for passive tracers and low-inertia particles due to the lateral advective transport that is absent in straight pipe and channels flows.

53 citations

Proceedings ArticleDOI
27 May 2008
TL;DR: In this paper, a detailed mechanical and structural analysis of the package in terms of the die thickness, wafer size and warpage is presented, and the package format is suitable for stacking multiple die in 3D format and 2D format.
Abstract: The primary trend in electronics industry is product miniaturization Both design and manufacturing engineers are looking for ways to make products lighter, smaller, less expensive, and at the same time faster, more powerful, reliable, user-friendly, and functional A partial list of today's "shrinking" products would include cellular phones, personal and sub-notebook computers, pagers, PCMCIA cards, camcorders, palmtop organizers, telecommunications equipment, and automotive components With silicon chips continue integrating more functionality as per Moore's law, the packaging is challenged to integrate and shrink Chips first or embedded chip packaging is a revolutionary way to overcome these recent packaging integration challenges Packaging researchers have worked on embedded packaging and developed newer way of embedding the chip The PBGA replaced the lead frame based peripheral array packages, in which the die is electrically connected to circuit board (PCB) substrate by wire bonding or flip chip technology, before covering with molding compound Embedded Wafer level packaging takes the next step, eliminating the PCB, as well as the need to use wire bonding or flip-chip bumps to establish electrical connection This paper deals with the development embedding multiple dies at wafer level A detailed mechanical and structural analysis of the package in terms of the die thickness, wafer size and warpage is presented The package format is suitable for stacking multiple die in 3D format and 2D format The paper also deals with characterization of the materials and the process integration of the multidie wafer level packaging Initial reliability results of the package are also presented

52 citations

Journal ArticleDOI
TL;DR: In this article, the algal biochar reinforced trimetallic nanocomposite (AlBc TNC) was fabricated by employing facile greener microwave technique and explored as a promising adsorbent/photocatalyst designed for the exclusion of malachite green (MG).

52 citations


Cited by
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[...]

08 Dec 2001-BMJ
TL;DR: There is, I think, something ethereal about i —the square root of minus one, which seems an odd beast at that time—an intruder hovering on the edge of reality.
Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

33,785 citations

01 Jun 2012
TL;DR: SPAdes as mentioned in this paper is a new assembler for both single-cell and standard (multicell) assembly, and demonstrate that it improves on the recently released E+V-SC assembler and on popular assemblers Velvet and SoapDeNovo (for multicell data).
Abstract: The lion's share of bacteria in various environments cannot be cloned in the laboratory and thus cannot be sequenced using existing technologies. A major goal of single-cell genomics is to complement gene-centric metagenomic data with whole-genome assemblies of uncultivated organisms. Assembly of single-cell data is challenging because of highly non-uniform read coverage as well as elevated levels of sequencing errors and chimeric reads. We describe SPAdes, a new assembler for both single-cell and standard (multicell) assembly, and demonstrate that it improves on the recently released E+V-SC assembler (specialized for single-cell data) and on popular assemblers Velvet and SoapDeNovo (for multicell data). SPAdes generates single-cell assemblies, providing information about genomes of uncultivatable bacteria that vastly exceeds what may be obtained via traditional metagenomics studies. SPAdes is available online ( http://bioinf.spbau.ru/spades ). It is distributed as open source software.

10,124 citations

Journal ArticleDOI

7,335 citations

Journal ArticleDOI

6,278 citations