G
Gerard Mourou
Researcher at École Polytechnique
Publications - 664
Citations - 36215
Gerard Mourou is an academic researcher from École Polytechnique. The author has contributed to research in topics: Laser & Ultrashort pulse. The author has an hindex of 82, co-authored 653 publications receiving 34147 citations. Previous affiliations of Gerard Mourou include University of Michigan & San Diego State University.
Papers
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Journal ArticleDOI
Short-pulse laser damage in transparent materials as a function of pulse duration
TL;DR: In this article, a single-shot damage threshold measurement and modeling for fused silica at 800 nm as a function of pulse duration down to 20 fs was presented, and the respective roles of multiphoton ionization, tunnel ionization and impact ionization in laser damage were examined.
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Time-resolved observation of electron-phonon relaxation in copper.
TL;DR: In this paper, the process of electron-phonon energy transfer was time resolved and was observed to be 1--4 ps increasing with the laser fluence, and non-equilibrium electron-lattice temperatures were observed.
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Ultrahigh‐Intensity Lasers: Physics of the Extreme on a Tabletop
TL;DR: In this paper, it was shown that at these intensities, the light pressure, P = I/c, is extreme, on the order of giga-to-terabars.
Patent
Method for controlling configuration of laser induced breakdown and ablation
Gerard Mourou,D. Du,Subrata Dutta,Victor M. Elner,Ron M. Kurtz,Paul R. Lichter,Xinbing Liu,P.P. Pronko,Jeff Squier +8 more
TL;DR: In this article, the authors proposed a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable change in slope at a predetermined laser pulse width value.
Journal ArticleDOI
Machining of sub-micron holes using a femtosecond laser at 800 nm
TL;DR: In this article, a Ti:sapphire laser was used to ablate holes with a diameter of 300 nm and a depth of 52 nm to produce very small features in materials.