Gordon S Macdonnell

Bio: Gordon S Macdonnell is an academic researcher. The author has contributed to research in topics: Electronic circuit. The author has an hindex of 1, co-authored 1 publications receiving 18 citations.

Three-dimensional circuit component assembly and method corresponding thereto

Abstract: A plurality of plate-like circuit component carrier packages having the same size and shape are stacked adjacent one to another with the flat faces thereof in contact to form a carrier package assembly in the form of a prismatic or cylindrically solid. Each carrier package houses one or more electrical circuit components and is provided at portions of the flat faces thereof with electrical contacts which cooperate with similarly located contacts on the flat faces of adjacent carrier packages to electrically interconnect the circuit components. The electrical contacts may take the form of a cooperating system of pins and apertures, serving also to align adjacent carrier packages. The carrier package assembly is useable in cooperation with a flexible, printed circuit board having on one side thereof an array of contact sites selectively interconnected by printed routing traces. Electrical contacts on the peripheral surfaces of the carrier packages are coupled with the circuit components housed therein and engage the contact sites on the circuit board when it is wrapped around the carrier package assembly. The ends of the carrier package assembly are fitted with connector blocks of a convenient shape which serve to support the carrier package assembly and to interconnect the electrical components therein with others exterior thereto. Several types of circuit boards and a variety of carrier package shapes are disclosed.

Electronic module using flexible printed circuit board with heat sink means

Abstract: An electronic circuit component having particular utility in multi-layer circuit board construction formed essentially of a flexible dielectric sheet of material used as the board base to which is attached circuit runs etched from copper sheets clad to the dielectric sheet prior to etching. Generally, circuitry runs are separated according to alignment with either the X or Y axis with the runs on each side of the dielectric sheet being parallel to only one of those axes. Integration of communication between X and Y runs is by means of plated through holes to which circuit elements may be attached. Flatpack integrated circuits are attached to the board oriented with their covers toward and their heat sink base portions away from the board. By placing all flatpacks on one side of the flexible board structure and looping the structure back on itself, a high circuit component density can be achieved with the heat sink portions of flatpacks exposed exteriorly of the loops of the structure facilitating placing the flatpacks in heat conducting contact with a casing.

Flexible elongate member having one or more electrical contacts

Abstract: A flexible elongate member such as a pressure guide wire (1000) includes an electrical device such as a pressure sensor (1002). The pressure sensor (1002) is electrically connected to conductive bands (304, 306 and 308) located on electrical connector (300). The electrical connector is attached to core wire (602) and shaft or hypotube (704). The use of electrical connector (300) helps minimize the assembly time of pressure guide wire (1000), as well as minimize some of the assembly problems associated with prior art designs such as pressure guide wire (100).

Portable memory module

Abstract: The portable memory module disclosed herein is constructed in a compact cylindrical form facilitating its use in oceanographic and environmental data acquisition environments. Individual integrated circuit memory components are carried and interconnected by a flexible printed circuit, the components being oriented in columns with pin lines parallel to the axis of a cylindrical battery casing to permit the circuit to be rolled around that casing. The battery casing and rolled printed circuit are then inserted in a protective outer casing, also cylindrical.

Electrical circuit package

Abstract: An electrical circuit package is disclosed that provides an electrically insulating protection cover for an integral circuit board assembly. The package includes a flexible dielectric substrate 10. A first portion 12 of the dielectric substrate has one or more electrically conductive paths 20 located thereon and one or more electrical components 30 supported thereon and electrically connected to the conductive paths. A second portion 14 of the dielectric substrate 10 is free of any paths or electrical components. The second portion is folded over and secured to the first portion to provide a protective enclosure.