Motivated by emerging battery-operated applications that demand intensive computation in portable environments, techniques are investigated which reduce power consumption in CMOS digital circuits while maintaining computational throughput. Techniques for low-power operation are shown which use the lowest possible supply voltage coupled with architectural, logic style, circuit, and technology optimizations. An architecturally based scaling strategy is presented which indicates that the optimum voltage is much lower than that determined by other scaling considerations. This optimum is achieved by trading increased silicon area for reduced power consumption. >

/pdf/low-power-cmos-digital-design-52v6aautu5.pdf

Low-power CMOS digital design

Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally-renowned authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model, and SiGe-base bipolar devices.

/pdf/fundamentals-of-modern-vlsi-devices-471xd7l9pf.pdf

Fundamentals of Modern VLSI Devices

The most exciting development in parallel computer architecture is the convergence of traditionally disparate approaches on a common machine structure. This book explains the forces behind this convergence of shared-memory, message-passing, data parallel, and data-driven computing architectures. It then examines the design issues that are critical to all parallel architecture across the full range of modern design, covering data access, communication performance, coordination of cooperative work, and correct implementation of useful semantics. It not only describes the hardware and software techniques for addressing each of these issues but also explores how these techniques interact in the same system. Examining architecture from an application-driven perspective, it provides comprehensive discussions of parallel programming for high performance and of workload-driven evaluation, based on understanding hardware-software interactions.


* synthesizes a decade of research and development for practicing engineers, graduate students, and researchers in parallel computer architecture, system software, and applications development

* presents in-depth application case studies from computer graphics, computational science and engineering, and data mining to demonstrate sound quantitative evaluation of design trade-offs 

* describes the process of programming for performance, including both the architecture-independent and architecture-dependent aspects, with examples and case-studies

* illustrates bus-based and network-based parallel systems with case studies of more than a dozen important commercial designs

Table of Contents

1 Introduction 
2 Parallel Programs 
3 Programming for Performance 
4 Workload-Driven Evaluation 
5 Shared Memory Multiprocessors 
6 Snoop-based Multiprocessor Design 
7 Scalable Multiprocessors
8 Directory-based Cache Coherence
9 Hardware-Software Tradeoffs 
10 Interconnection Network Design 
11 Latency Tolerance 
12 Future Directions 
APPENDIX A Parallel Benchmark Suites

Parallel Computer Architecture: A Hardware/Software Approach

Concern about the performance of wires wires in scaled technologies has led to research exploring other communication methods. This paper examines wire and gate delays as technologies migrate from 0.18-/spl mu/m to 0.035-/spl mu/m feature sizes to better understand the magnitude of the the wiring problem. Wires that shorten in length as technologies scale have delays that either track gate delays or grow slowly relative to gate delays. This result is good news since these "local" wires dominate chip wiring. Despite this scaling of local wire performance, computer-aided design (CAD) tools must still become move sophisticated in dealing with these wires. Under scaling, the total number of wires grows exponentially, so CAD tools will need to handle an ever-growing percentage of all the wires in order to keep designer workloads constant. Global wires present a more serious problem to designers. These are wires that do not scale in length since they communicate signals across the chip. The delay of these wives will remain constant if repeaters are used meaning that relative to gate delays, their delays scale upwards. These increased delays for global communication will drive architectures toward modular designs with explicit global latency mechanisms.

The future of wires

The various arguments for introducing optical interconnections to silicon CMOS chips are summarized, and the challenges for optical, optoelectronic, and integration technologies are discussed. Optics could solve many physical problems of interconnects, including precise clock distribution, system synchronization (allowing larger synchronous zones, both on-chip and between chips), bandwidth and density of long interconnections, and reduction of power dissipation. Optics may relieve a broad range of design problems, such as crosstalk, voltage isolation, wave reflection, impedence matching, and pin inductance. It may allow continued scaling of existing architectures and enable novel highly interconnected or high-bandwidth architectures. No physical breakthrough is required to implement dense optical interconnects to silicon chips, though substantial technological work remains. Cost is a significant barrier to practical introduction, though revolutionary approaches exist that might achieve economies of scale. An Appendix analyzes scaling of on-chop global electrical interconnects, including line inductance and the skin effect, both of which impose significant additional constraints on future interconnects.

/pdf/rationale-and-challenges-for-optical-interconnects-to-5clh2238g9.pdf

H. B. Bakoglu

Papers

Circuits, interconnections, and packaging for VLSI