scispace - formally typeset
Search or ask a question
Author

H. Rahimi

Bio: H. Rahimi is an academic researcher from University of Kurdistan. The author has contributed to research in topics: Logic gate & Field-programmable gate array. The author has co-authored 1 publications.

Papers
More filters
Journal ArticleDOI
TL;DR: A complete Computer Aided Design (CAD) flow to implement an arbitrary logic circuit on 3D FPGA is proposed and simulation results show more than 60%, 65%, and 23% reduction in TSV count, heat transfer performance, and area respectively, along with 4% increase in critical path delay.
Abstract: Three Dimensional Field Programmable Gate Arrays (3D FPGAs) recently are presented as the next generation of the FPGA family to continue the integration of more transistors on a single chip seamlessly. The 3D FPGA are fabricated by stacking several layers of semiconductor substrates and the interconnection among layers are realized using Through Silicon Vias (TSVs). Despite their benefits regarding less area and higher speed, 3D FPGAs encounter two major problems; huge size of single TSV and trapping generated heat in inner layers. To handle these problems, we propose a complete Computer Aided Design (CAD) flow to implement an arbitrary logic circuit on 3D FPGA. Prtitioning, Placement, and Routing are primary stages of the proposed CAD flow. The partitioning and placement stages of the flow are based on Simulated Annealing algorithm. Furthermore, the routing stage is a modified version of the Pathfinder algorithm. Unbalanced SA based partitioning tremendously reduces the required TSVs along with distribution of highly active circuit’s modules on the bottom layers and constructing thermal channels facilitate transferring the generated heat in intermediate layers. Simulation results show more than 60%, 65%, and 23% reduction in TSV count, heat transfer performance, and area respectively, along with 4% increase in critical path delay. In addition, comparison between 2D FPGA and 3D FPGA with our proposed architecture (including 2 tier), shows that the circuit speed increases by 28.61%, and minimum channel width decreases by 30.47%. Finally, the results of comparison between 2-tier and 4-tier in 3D FPGA show that circuit speed and minimum channel width increase by 15.95% and 15.92% in 4-tier, respectively.

3 citations


Cited by
More filters
Journal ArticleDOI
TL;DR: The Quaternary Carry Increment Adder (CIA) as mentioned in this paper is a carry-lookahead adder that replaces the adder circuit in the array multiplier to reduce the multipliers' power consumption.
Abstract: Multiplication is one of the most basic processes, in digital signal processing applications. To process the instructions, most processors require multiplication. Because multipliers are employed in almost all arithmetic operations, they consume the majority of time and power. As a nutshell, the multiplier's efficiency is critical in terms of enhancing processor performance. The array multiplier is one of the most efficient multipliers since it is both quick and simple. However, power consumption is high. The basic components of an array multiplier are adders. The multiplier's efficiency will improve if the adders are much more efficient. The prior study used Complementary Metal Oxide Semiconductor (CMOS) to construct a Quaternary Carry-Lookahead Adder (CLA) that substitutes the adder circuit in the array multiplier. Quaternary number system circuits are quicker than binary number system circuits and can execute arithmetic operations without carry. However, Quaternary circuits take up more space. As a solution, the Quaternary Carry Increment Adder (CIA) is proposed. The proposed adder consumes less power and occupies less area than the existing Quaternary CLA. In the array multiplier, the Quaternary CIA substitutes the Quaternary CLA. This helps to lower the multiplier's power and area consumption. Tanner EDA tool is used to designing the circuits and were simulated with 180 nm technology. Various parameters such as delay, power and power-delay product of the existing and the proposed are measured and compared.
Journal ArticleDOI
TL;DR: In this article , the authors proposed a power-efficient architecture for static random access memory (SRAM) based FPGAs, in which two modes (active mode and sleep mode) are defined for each module.
Abstract: Field programmable gate array (FPGA) devices have become widespread in electronic systems due to their low design costs and reconfigurability. In battery-restricted applications such as handheld electronics systems, low-power FPGAs are in great demand. Leakage power almost equals dynamic power in modern integrated circuit technologies, so the reduction of leakage power leads to significant energy savings. We propose a power-efficient architecture for static random access memory (SRAM) based FPGAs, in which two modes (active mode and sleep mode) are defined for each module. In sleep mode, ultra-low leakage power is consumed by the module. The module mode changes dynamically from sleep mode to active mode when module outputs evaluate for new input vectors. After producing the correct outputs, the module returns to sleep mode. The proposed circuit design reduces the leakage power consumption in both active and sleep modes. The proposed low-leakage FPGA architecture is compared with state-of-the-art architectures by implementing Microelectronics Center of North Carolina (MCNC) benchmark circuits on FPGA-SPICE software. Simulation results show an approximately 95% reduction in leakage power consumption in sleep mode. Moreover, the total power consumption (leakage+dynamic power consumption) is reduced by more than 15% compared with that of the best previous design. The average area overhead (4.26%) is less than those of other power-gating designs.