Hao Lu

Bio: Hao Lu is an academic researcher from University of Notre Dame. The author has contributed to research in topics: Circuit design & Logic gate. The author has an hindex of 10, co-authored 15 publications receiving 730 citations.

Tunnel Field-Effect Transistors: State-of-the-Art

Abstract: Progress in the development of tunnel field-effect transistors (TFETs) is reviewed by comparing experimental results and theoretical predictions against 16-nm FinFET CMOS technology. Experiments lag the projections, but sub-threshold swings less than 60 mV/decade are now reported in 14 TFETs. The lowest measured sub-threshold swings approaches 20 mV/decade, however, the measurements at these lowest values are not based on many points. The highest current at which sub-threshold swing below 60 mV/decade is observed is in the range 1–10 nA/ \({{\mu }}\) m. A common approach to TFET characterization is proposed to facilitate future comparisons.

Universal analytic model for tunnel FET circuit simulation

Abstract: A simple analytic model based on the Kane–Sze formula is used to describe the current–voltage characteristics of tunnel field-effect transistors (TFETs). This model captures the unique features of the TFET including the decrease in subthreshold swing with drain current and the superlinear onset of the output characteristic. The model also captures the ambipolar current characteristic at negative gate–source bias and the negative differential resistance for negative drain–source biases. A simple empirical capacitance model is also included to enable circuit simulation. The model has fairly general validity and is not specific to a particular TFET geometry. Good agreement is shown with published atomistic simulations of an InAs double-gate TFET with gate perpendicular to the tunnel junction and with numerical simulations of a broken-gap AlGaSb/InAs TFET with gate in parallel with the tunnel junction.

Monolayer Solid-State Electrolyte for Electric Double Layer Gating of Graphene Field-Effect Transistors.

Abstract: The electrostatic gating of graphene field-effect transistors is demonstrated using a monolayer electrolyte The electrolyte, cobalt crown ether phthalocyanine (CoCrPc) and LiClO4, is deposited as a monolayer on the graphene channel, essentially creating an additional two-dimensional layer on top of graphene The crown ethers on the CoCrPc solvate lithium ions and the ion location is modulated by a backgate without requiring liquid solvent Ions dope the channel by inducing image charges; the doping level (ie, induced charge density) can be modulated by the backgate bias with the extent of the surface potential change being controlled by the magnitude and polarity of the backgate bias With a crown ether to Li+ ratio of 5:1, programming tests for which the backgate is held at −VBG shift the Dirac point by ∼15 V, corresponding to a sheet carrier density on the order of 1012 cm–2 This charge carrier density agrees with the packing density of monolayer CoCrPc on graphene that would be expected with one Li

Continuous semiempirical model for the current-voltage characteristics of tunnel fets

Abstract: A simple analytic model based on the Kane-Sze formula is proposed to describe the current-voltage characteristics of tunnel field-effect transistors (TFETs). This model captures the unique features of the TFET including the decrease in subthreshold swing with drain current and the superlinear onset of the output characteristic. The model has fairly general validity and is not specific to a particular TFET geometry. Good agreement is shown with published atomistic simulations of an InAs double-gate TFET with gate perpendicular to the tunnel junction and with numerical simulations of a broken-gap AlGaSb/InAs TFET with gate in parallel with the tunnel junction.

Steep subthreshold swing tunnel FETs: GaN/InN/GaN and transition metal dichalcogenide channels

Abstract: As the understanding of tunnel field-effect transistors (TFET) advances, new approaches are emerging to lower off-currents, lower defect density in tunnel junctions, and to increase the highest current at which the subthreshold swing of 60 mV/decade (I60) appears. III-N heterojunctions and transition-metal-dichalcogenide (TMD) materials are forcing some new thinking in junction design and doping.

Electronics based on two-dimensional materials

Abstract: The compelling demand for higher performance and lower power consumption in electronic systems is the main driving force of the electronics industry's quest for devices and/or architectures based on new materials. Here, we provide a review of electronic devices based on two-dimensional materials, outlining their potential as a technological option beyond scaled complementary metal-oxide-semiconductor switches. We focus on the performance limits and advantages of these materials and associated technologies, when exploited for both digital and analog applications, focusing on the main figures of merit needed to meet industry requirements. We also discuss the use of two-dimensional materials as an enabling factor for flexible electronics and provide our perspectives on future developments.

Two-dimensional semiconductors for transistors

Abstract: In the quest for higher performance, the dimensions of field-effect transistors (FETs) continue to decrease. However, the reduction in size of FETs comprising 3D semiconductors is limited by the rate at which heat, generated from static power, is dissipated. The increase in static power and the leakage of current between the source and drain electrodes that causes this increase, are referred to as short-channel effects. In FETs with channels made from 2D semiconductors, leakage current is almost eliminated because all electrons are confined in atomically thin channels and, hence, are uniformly influenced by the gate voltage. In this Review, we provide a mathematical framework to evaluate the performance of FETs and describe the challenges for improving the performances of short-channel FETs in relation to the properties of 2D materials, including graphene, transition metal dichalcogenides, phosphorene and silicene. We also describe tunnelling FETs that possess extremely low-power switching behaviour and explain how they can be realized using heterostructures of 2D semiconductors. Field-effect transistors (FETs) with semiconducting channels made from 2D materials are known to have fewer problems with short-channel effects than devices comprising 3D semiconductors. In this Review, a mathematical framework to evaluate the performance of FETs is outlined with a focus on the properties of 2D materials, such as graphene, transition metal dichalcogenides, phosphorene and silicene.

Dual-gated MoS2/WSe2 van der Waals tunnel diodes and transistors.

Abstract: Two-dimensional layered semiconductors present a promising material platform for band-to-band-tunneling devices given their homogeneous band edge steepness due to their atomically flat thickness. Here, we experimentally demonstrate interlayer band-to-band tunneling in vertical MoS2/WSe2 van der Waals (vdW) heterostructures using a dual-gate device architecture. The electric potential and carrier concentration of MoS2 and WSe2 layers are independently controlled by the two symmetric gates. The same device can be gate modulated to behave as either an Esaki diode with negative differential resistance, a backward diode with large reverse bias tunneling current, or a forward rectifying diode with low reverse bias current. Notably, a high gate coupling efficiency of ∼80% is obtained for tuning the interlayer band alignments, arising from weak electrostatic screening by the atomically thin layers. This work presents an advance in the fundamental understanding of the interlayer coupling and electron tunneling in ...

Scalable energy-efficient magnetoelectric spin-orbit logic.

Abstract: Since the early 1980s, most electronics have relied on the use of complementary metal–oxide–semiconductor (CMOS) transistors. However, the principles of CMOS operation, involving a switchable semiconductor conductance controlled by an insulating gate, have remained largely unchanged, even as transistors are miniaturized to sizes of 10 nanometres. We investigated what dimensionally scalable logic technology beyond CMOS could provide improvements in efficiency and performance for von Neumann architectures and enable growth in emerging computing such as artifical intelligence. Such a computing technology needs to allow progressive miniaturization, reduce switching energy, improve device interconnection and provide a complete logic and memory family. Here we propose a scalable spintronic logic device that operates via spin–orbit transduction (the coupling of an electron’s angular momentum with its linear momentum) combined with magnetoelectric switching. The device uses advanced quantum materials, especially correlated oxides and topological states of matter, for collective switching and detection. We describe progress in magnetoelectric switching and spin–orbit detection of state, and show that in comparison with CMOS technology our device has superior switching energy (by a factor of 10 to 30), lower switching voltage (by a factor of 5) and enhanced logic density (by a factor of 5). In addition, its non-volatility enables ultralow standby power, which is critical to modern computing. The properties of our device indicate that the proposed technology could enable the development of multi-generational computing. A scalable spintronic device operating via spin–orbit transduction and magnetoelectric switching and using advanced quantum materials shows non-volatility and improved performance and energy efficiency compared with CMOS devices.

Two-dimensional materials for next-generation computing technologies.

Abstract: Rapid digital technology advancement has resulted in a tremendous increase in computing tasks imposing stringent energy efficiency and area efficiency requirements on next-generation computing. To meet the growing data-driven demand, in-memory computing and transistor-based computing have emerged as potent technologies for the implementation of matrix and logic computing. However, to fulfil the future computing requirements new materials are urgently needed to complement the existing Si complementary metal–oxide–semiconductor technology and new technologies must be developed to enable further diversification of electronics and their applications. The abundance and rich variety of electronic properties of two-dimensional materials have endowed them with the potential to enhance computing energy efficiency while enabling continued device downscaling to a feature size below 5 nm. In this Review, from the perspective of matrix and logic computing, we discuss the opportunities, progress and challenges of integrating two-dimensional materials with in-memory computing and transistor-based computing technologies. This Review discusses the recent progress and future prospects of two-dimensional materials for next-generation nanoelectronics.