Holger Moench

Bio: Holger Moench is an academic researcher from Philips. The author has contributed to research in topics: Laser & Vertical-cavity surface-emitting laser. The author has an hindex of 20, co-authored 147 publications receiving 1665 citations.

System for and method of heating objects in a production line

Abstract: A system and method (10) for heating objects (O) during a thermal treatment process in a production line (P) is described. The system (10) comprises a transport system (11), a mirror arrangement (201, 202, 203, 204, 205, 206) comprising a first mirror surface (21, 21', 21'') and a second mirror surface (22, 22', 22'') arranged at opposite sides, so that the objects (0) may be transported between the mirror surfaces (21, 22, 21', 22', 21'', 22'') along the production line and a radiation device (30) comprising a number of lasers for generating light (L). The radiation device (30) and the mirror arrangement (201, 202, 203, 204, 205, 206) are constructed such that the main direction (R) of light (L) that enters the mirror arrangement (201, 202, 203, 204, 205, 206) is directed towards the first mirror surface (21, 21', 21'') at an angle to the production line (P), and the light (L) subsequently undergoes multiple reflections between the mirror surfaces (21, 22, 21', 22', 21'', 22'') so that a series of multiple reflections of the light (L) travels in the transport direction (OT) along at least a section of the mirror surface (21, 22, 21', 22', 21'', 22'') or travels against the transport direction (OT) along at least a section of the mirror surface (21, 22, 21', 22', 21'', 22'') and heats the objects (0) being transported between the mirror surfaces (21, 22, 21', 22', 21'', 22'').

Heating system comprising semiconductor light sources

Abstract: The invention describes a heating system ( 100 ) and a corresponding method of heating a heating surface ( 180 ) of an object ( 150, 950 ) to a processing temperature of at least 100° C., wherein the heating system ( 100 ) comprises semiconductor light sources ( 115 ), and wherein the heating system ( 100 ) is adapted to heat an area element of the heating surface ( 180 ) with at least 50 semiconductor light sources ( 115 ) at the same time. The heating system ( 100 ) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources ( 115 ) overlaps at the heating surface ( 180 ). Differences of the characteristic of one single semiconductor light source ( 115 ) may be blurred at the heating surface ( 180 ) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.

Laser device with configurable intensity distribution

Abstract: The present invention relates to a laser device comprising an array of several large area VCSELs (101) and one or several optics (201, 202) designed and arranged to image the active layers of the VCSELs (101) of said array to a working plane (501) such that the laser radiation emitted by the active layers of all VCSELs (101) or of subgroups of VCSELs (101) of the array superimposes in the working plane (501). The proposed laser device allows the generation of a desired intensity distribution in the working plane without the need of an optics specially designed for this intensity distribution or beam profile.

UHP lamp systems for projection applications

Abstract: Projection systems have found widespread use in conference rooms and other professional applications during the last decade and are now entering the home TV market at a considerable pace. Projectors as small as about one litre are able to deliver several thousand screen lumens and are, with a system efficacy of over 10 lm W −1 , the most efficient display systems realized today. Short arc lamps are a key component for projection systems of the highest efficiency for small-size projection displays. The introduction of the ultra high performance (UHP) lamp system by Philips in 1995 can be identified as one of the key enablers of the commercial success of projection systems. The UHP lamp concept features outstanding arc luminance, a well suited spectrum, long life and excellent lumen maintenance. For the first time it combines a very high pressure mercury discharge lamp with extremely short and stable arc gap with a regenerative chemical cycle keeping the discharge walls free from blackening, leading to lifetimes of over 10 000 h. Since the introduction of the UHP lamp system, many important new technology improvements have been realized: burner designs for higher lamp power, advanced ignition systems, miniaturized electronic drivers and innovative reflector concepts. These achievements enabled the impressive increase of projector light output, a remarkable reduction in projector size and even higher optical efficiency in projection systems during the last years. In this paper the concept of the UHP lamp system is described, followed by a discussion of the technological evolution the UHP lamp has undergone so far. Last, but not least, the important improvements of the UHP lamp system including the electronic driver and the reflector are discussed. (Some figures in this article are in colour only in the electronic version)

Laser device for projecting a structured light pattern onto a scene

Abstract: The present invention relates to a laser device (10) for projecting a structured light pattern (9) onto a scene (15). The device is formed of several arrays (1) of semiconductor lasers (2), each array (1) comprising an irregular distribution of emission areas (2a) of the semiconductor lasers (2). One or several imaging optics (4) image said arrays (1) to an imaging space and superpose the images of said arrays (1) in the imaging space to form said light pattern (9). The proposed laser device generates a light pattern with high contrast and efficiency which may be used for 3D imaging systems, e. g. in automotive applications.

Status and Future of High-Power Light-Emitting Diodes for Solid-State Lighting

Abstract: Status and future outlook of III-V compound semiconductor visible-spectrum light-emitting diodes (LEDs) are presented. Light extraction techniques are reviewed and extraction efficiencies are quantified in the 60%+ (AlGaInP) and ~80% (InGaN) regimes for state-of-the-art devices. The phosphor-based white LED concept is reviewed and recent performance discussed, showing that high-power white LEDs now approach the 100-lm/W regime. Devices employing multiple phosphors for "warm" white color temperatures (~3000-4000 K) and high color rendering (CRI>80), which provide properties critical for many illumination applications, are discussed. Recent developments in chip design, packaging, and high current performance lead to very high luminance devices (~50 Mcd/m2 white at 1 A forward current in 1times1 mm2 chip) that are suitable for application to automotive forward lighting. A prognosis for future LED performance levels is considered given further improvements in internal quantum efficiency, which to date lag achievements in light extraction efficiency for InGaN LEDs

Semiconductor device, and manufacturing method thereof

Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Mobile terminal and method for controlling the same

Abstract: A mobile terminal including a body; a touchscreen provided to a front and extending to side of the body and configured to display content; and a controller configured to detect one side of the body comes into contact with one side of an external terminal, display a first area on the touchscreen corresponding to a contact area of the body and the external terminal and a second area including the content, receive an input of moving the content displayed in the second area to the first area, display the content in the first area, and share the content in the first area with the external terminal.

Measuring object dimensions using mobile computer

Abstract: Devices, methods, and software are disclosed for determining dimensions of a physical object using a mobile computer equipped with a motion sensing device. In an illustrative embodiment, the mobile computer can comprise a microprocessor, a memory, a user interface, a motion sensing device, and a dimensioning program executable by the microprocessor. The processor can be in communicative connection with executable instructions for enabling the processor for various steps. One step includes initiating a trajectory tracking mode responsive to receiving a first user interface action. Another step includes tracking the mobile computer's trajectory along a surface of a physical object by storing in the memory a plurality of motion sensing data items outputted by the motion sensing device. Another step includes exiting the trajectory tracking mode responsive to receiving a second user interface action. Another step includes calculating three dimensions of a minimum bounding box corresponding to the physical object.

Volume dimensioning systems and methods

Abstract: Systems and methods for volume dimensioning packages are provided. A method of operating a volume dimensioning system may include the receipt of image data of an area at least a first three-dimensional object to be dimensioned from a first point of view as captured using at least one image sensor. The system can determine from the received image data a number of features in three dimensions of the first three-dimensional object. Based at least on part on the determined features of the first three-dimensional object, the system can fit a first three-dimensional packaging wireframe model about the first three-dimensional object. The system can display of an image of the first three-dimensional packaging wireframe model fitted about an image of the first three-dimensional object on a display device.