Get the phase diagram information you need at a price you can afford. Key Features: Peer reviewed by the Japanese Committee for Alloy Phase Diagrams. Updated through April 2000. Total number of diagrams = 2,332 (605 are new of greatly revised diagrams; among these 171 are not in Binary Alloy Phase Diagrams, 2nd Edition). Approximately 600 crystal structure tables of systems for which phase diagrams are unknown. You've been asking for a simple book containing just binary phase diagrams and crystal structure data. Desk Handbook: Phase Diagrams for Binary Alloys meets this need, and it presents the most current information. Updates the previous print compilation of binary phase diagrams by 10 years. Presents diagrams in consistent size. Shows the principal axis in atomic per cent, with a secondary axis in weight per cent. Includes an introductory article on phase diagrams and their use. Gives reference to the original literature source. This volume is the latest outgrowth of the phase diagram activity in which ASM International has been involved since 1978.

Desk handbook phase diagrams for binary alloys

A review of lead-free solders for electronics applications

This paper reports on glass frit wafer bonding, which is a universally usable technology for wafer level encapsulation and packaging. After explaining the principle and the process flow of glass frit bonding, experimental results are shown. Glass frit bonding technology enables bonding of surface materials commonly used in MEMS technology. It allows hermetic sealing and a high process yield. Metal lead throughs at the bond interface are possible, because of the planarizing glass interlayer. Examples of surface micromachined sensors demonstrate the potential of glass-frit bonding.

Glass frit bonding : An universal technology for wafer level encapsulation and packaging

Theoretical Structural Metallurgy By Prof. A. H. Cottrell. Second edition. Pp. viii + 251. (London: Edward Arnold (Publishers), Ltd., 1955.) 25s. net.

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Fundamentals of Physical Metallurgy

Over the 2010s technological improvements allowed metal additive manufacturing to graduate from a prototyping tool to a widespread, full-scale manufacturing process. Among the capabilities still un...

Advances in additive manufacturing of metal-based functionally graded materials

This paper presents a novel die-attach material for high-temperature applications based on transient liquid phase (TLP) bonding. Cu particles are electroless plated with Sn to achieve Cu@Sn structure, and the fabricated Cu@Sn particles are compressed into preforms for die attachment. This material can be reflowed at a low temperature ( I – V curve and breakdown voltages of the novel preform-bonded IGBTs are measured to examine the interconnection quality compared with those of Cu−Sn TLP-bonded IGBTs. This die-attach material is suitable for power devices operating under high temperatures or other harsh environments.

Hongtao Chen

Papers

Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding

Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds

Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testing

Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures

Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress