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Hongyang Jing

Bio: Hongyang Jing is an academic researcher from Tianjin University. The author has contributed to research in topics: Creep & Corrosion. The author has an hindex of 26, co-authored 163 publications receiving 2134 citations. Previous affiliations of Hongyang Jing include Tianjin University of Technology.


Papers
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Journal ArticleDOI
TL;DR: In this article, the influence of microstructure and elemental partitioning on pitting corrosion resistance of duplex stainless steel joints welded by gas tungsten arc welding (GTAW) and flux-cored arc welding with different shielding gas compositions were studied by optical microscopy, electron backscatter diffraction, scanning electron microscopy (SEM) and electron probe microanalysis.

106 citations

Journal ArticleDOI
Zhiqiang Zhang1, Hongyang Jing1, Lianyong Xu1, Yongdian Han1, Lei Zhao1 
TL;DR: In this paper, the microstructure, impact toughness, and pitting corrosion resistance of duplex stainless steel (DSS) welding joints fabricated by using gas tungsten arc welding (GTAW) and flux-cored arc welding with different shielding gas compositions were investigated.

89 citations

Journal ArticleDOI
TL;DR: In this article, the microstructure, residual stress, and mechanical properties of the as-printed specimen and specimens annealed at 773-1573 K for 2'h were compared.
Abstract: To widen the applications of FeCoCrNi high-entropy alloys (HEAs) fabricated via selective laser melting, their mechanical properties must be improved, and annealing plays an important role in this regard. In this study, the microstructure, residual stress, and mechanical properties of the as-printed specimen and specimens annealed at 773–1573 K for 2 h were compared. As the annealing temperature increased, the specimen structure recrystallized from all columnar grains to equiaxial grains containing numerous annealing twins. The dislocation network, which formed during the solidification process under considerable shrinkage strain, decomposed into dislocations. The residual stress, yield strength, and hardness decreased, while the plasticity and impact toughness increased. During the deformation of as-printed and low-temperature-annealed specimens, the dislocation network remained unchanged and provided resistance to the dislocations moving within it, thus strengthening the specimen. The tensile strength remained largely unchanged owing to the reduction in the residual stress during low-temperature annealing, as well as the formation of the twinning network and dislocation wall under large deformation upon high-temperature annealing. Meanwhile, the ductility greatly increased, thus increasing the potential for industrial application of HEAs.

85 citations

Journal ArticleDOI
TL;DR: In this paper, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the 95.8Sn-3.5Ag-0.7Cu solder alloy using the powder metallurgy route.
Abstract: In this study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the 95.8Sn-3.5Ag-0.7Cu solder alloy using the powder metallurgy route. Up to 0.3 wt% of Ni-CNTs were successfully incorporated. The effects of Ni-CNTs on the physical, thermal and mechanical properties of Sn–Ag–Cu solder alloy were investigated. With the addition of increasing weight percentages of Ni-CNTs, the composite solders showed a corresponding decrease in density values and improved wetting properties. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Mechanical characterization revealed an improvement in ultimate tensile strength (up to 12%) and 0.2% yield strength (up to 8%) with the addition of 0.05 wt% Ni-CNTs in the solder.

79 citations

Journal ArticleDOI
TL;DR: In this paper, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solders.

72 citations


Cited by
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01 May 1993
TL;DR: Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems.
Abstract: Three parallel algorithms for classical molecular dynamics are presented. The first assigns each processor a fixed subset of atoms; the second assigns each a fixed subset of inter-atomic forces to compute; the third assigns each a fixed spatial region. The algorithms are suitable for molecular dynamics models which can be difficult to parallelize efficiently—those with short-range forces where the neighbors of each atom change rapidly. They can be implemented on any distributed-memory parallel machine which allows for message-passing of data between independently executing processors. The algorithms are tested on a standard Lennard-Jones benchmark problem for system sizes ranging from 500 to 100,000,000 atoms on several parallel supercomputers--the nCUBE 2, Intel iPSC/860 and Paragon, and Cray T3D. Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems. For large problems, the spatial algorithm achieves parallel efficiencies of 90% and a 1840-node Intel Paragon performs up to 165 faster than a single Cray C9O processor. Trade-offs between the three algorithms and guidelines for adapting them to more complex molecular dynamics simulations are also discussed.

29,323 citations

01 Jan 1987

991 citations

Journal ArticleDOI
TL;DR: The likely temperature dependence of the thermoelectric parameters and the means by which the composition may be optimized for applications above room temperature are discussed.
Abstract: Bismuth telluride and its alloys are widely used as materials for thermoelectric refrigeration. They are also the best materials for use in thermoelectric generators when the temperature of the heat source is moderate. The dimensionless figure of merit, ZT, usually rises with temperature, as long as there is only one type of charge carrier. Eventually, though, minority carrier conduction becomes significant and ZT decreases above a certain temperature. There is also the possibility of chemical decomposition due to the vaporization of tellurium. Here we discuss the likely temperature dependence of the thermoelectric parameters and the means by which the composition may be optimized for applications above room temperature. The results of these theoretical predictions are compared with the observed properties of bismuth telluride-based thermoelements at elevated temperatures. Compositional changes are suggested for materials that are destined for generator modules.

439 citations

Journal ArticleDOI
TL;DR: In this paper, a systematic review of the development of these lead-free composite solders is given, which hopefully may find applications in microbumps to be used in the future 3D IC technology.
Abstract: Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu6Sn5, Ag3Sn intermetallic compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology.

260 citations