Howard L. Heck

Bio: Howard L. Heck is an academic researcher from Intel. The author has contributed to research in topics: Printed circuit board & Electromagnetic interference. The author has an hindex of 14, co-authored 74 publications receiving 1016 citations. Previous affiliations of Howard L. Heck include IBM.

Advanced Signal Integrity for High-Speed Digital Designs

Abstract: Signal integrity has become the key issue in most high-performance digital designs. Now, from the foremost experts in the field, this book leverages theory and techniques from non-related fields such as applied physics, communications, and microwave engineering and applies them to the field of high-speed digital design. This approach creates an optimal combination of theory and practice that is meaningful to practicing engineers and graduate students alike.

Monte Carlo simulation design methodology

Abstract: A two-stage Monte Carlo method of tolerancing components of an assembly is provided. Statistical measures of component features are not time invariant, but change over a production run. That is, the mean value of component feature measures and the standard distribution of the component feature measures about the time dependent mean are not invariant over a production run, but shift with time and throughput. According to the invention, these "shifted" or "adjusted" parameters are utilized in a Monte Carlo simulation to determine discrete values for the individual points of each output distribution, x(i), y(i), z(i). The individual points of the output distributions, x(i), y(i), z(i), are combined in a second Monte Carlo simulation step for individual assembly final fit F(x(i), y(i), z(i)). The statistics of the individual assembly final fits are then compared to manufacturing specifications.

A Practical Method for Modeling PCB Transmission Lines with Conductor Surface Roughness and Wideband Dielectric Properties

Abstract: This paper discusses the modeling techniques to account for transmission line high frequency effects, and proposes a method to integrate these techniques into a practical and design-worthy model generation flow. The frequency tabulated transmission line models are capable of predicting wideband dielectric characteristics and high frequency conductor losses due to skin effect and surface roughness. They can be used to accurately model high volume, low cost printed circuit board traces which often have roughened trace surfaces and pronounced frequency variation in dielectric properties. The model accuracy is verified up to 20 GHz in frequency domain, thus suitable for Multi-Gigabit signaling analysis.

Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

Abstract: This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TE/sub 10/ mode and avoidance of the excitation of the TE/sub 20/ mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45/spl deg/ and 90/spl deg/ bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.

Computational and experimental study of a microwave electromagnetic bandgap structure with waveguiding defect for potential use as a bandpass wireless interconnect

Abstract: As clock rates continue to rise, problems with signal integrity, cross-coupling, and radiation may render impractical the baseband metallic interconnects presently used in computers. A potential means to address this problem is to use bandpass wireless interconnects operating at millimeter-wave center frequencies. We have conducted experimental and finite-difference time-domain (FDTD) computational studies scaled to a 10 GHz center frequency of single-row and double-row waveguiding defects within an electromagnetic bandgap structure. Our initial experimental results scaled to 10 GHz have verified the feasibility of achieving an approximately 80% bandwidth with excellent stopband, gain flatness, and matching characteristics. When scaled to millimeter-wave center frequencies above 300 GHz, this technology appears feasible of supporting data rates in the hundreds of Gb/s.

Electromagnetic Band Gap Structures in Antenna Engineering

Abstract: Preface 1. Introduction 2. FDTD Method for periodic structure analysis 3. EBG Characterizations and classifications 4. Design and optimizations of EBG structures 5. Patch antennas with EBG structures 6. Low profile wire antennas on EBG surfaces 7. Surface wave antennas Appendix: EBG literature review.

Advanced Signal Integrity for High-Speed Digital Designs

Abstract: Signal integrity has become the key issue in most high-performance digital designs. Now, from the foremost experts in the field, this book leverages theory and techniques from non-related fields such as applied physics, communications, and microwave engineering and applies them to the field of high-speed digital design. This approach creates an optimal combination of theory and practice that is meaningful to practicing engineers and graduate students alike.

Simulation method and system for the valuation of derivative financial instruments

Abstract: A Monte Carlo system and method are presented for the pricing of financial instruments such as derivative securities. A path-integral approach is described that relies upon the probability distribution of the complete histories of an underlying security. A Metropolis algorithm is used to generate samples of a probability distribution of the paths (histories) of the security. Complete information on the derivative security is obtained in a single simulation, including parameter sensitivities. Multiple values of parameters are also obtained in a single simulation. The method is applied in a plurality of systems, including a parallel computing environment and an online real-time valuation service. The method and system also have the capability of evaluating American options using Monte Carlo methods.

Current Misuses and Future Prospects for Printed Multiple-Input, Multiple-Output Antenna Systems [Wireless Corner]

Abstract: In the past six years or so, the number of scientific articles and conference papers providing possible multiple-input, multiple-output (MIMO) antenna system solutions has noticeably increased. Flagship conferences on antennas and propagation have recently had multiple sessions addressing MIMO antenna systems and their applications. The importance of such antenna systems lies in the magnitude of their application in current wireless devices and gadgets, and this thrust will continue because fourth-generation (4G) and the upcoming fifth-generation (5G) wireless standards rely heavily on MIMO technology. But throughout the years, and up until now, a wide range of publications still suffer from some major misconceptions and unclear understanding of the fundamental aspects while designing, characterizing, and evaluating such multiantenna systems.