/pdf/micro-total-analysis-systems-1-introduction-theory-and-27f7corp18.pdf

Micro Total Analysis Systems. 1. Introduction, Theory, and Technology

This paper describes a fabrication technique for building three-dimensional (3-D) micro-channels in polydimethylsiloxane (PDMS) elastomer. The process allows for the stacking of many thin (less than 100-/spl mu/m thick) patterned PDMS layers to realize complex 3-D channel paths. The master for each layer is formed on a silicon wafer using an epoxy-based photoresist (SU 8). PDMS is cast against the master producing molded layers containing channels and openings. To realize thin layers with openings, a sandwich molding configuration was developed that allows precise control of the PDMS thickness. The master wafer is clamped within a sandwich that includes flat aluminum plates, a flexible polyester film layer, a rigid Pyrex wafer, and a rubber sheet. A parametric study is performed on PDMS surface activation in a reactive-ion-etching system and the subsequent methanol treatment for bonding and aligning very thin individual components to a substrate. Low RF power and short treatment times are better than high RF power and long treatment times, respectively, for instant bonding. Layer-to-layer alignment of less then 15 /spl mu/m is achieved with manual alignment techniques that utilize surface tension driven self-alignment methods. A coring procedure is used to realize off-chip fluidic connections via the bottom PDMS layer, allowing the top layer to remain smooth and flat for complete optical access.

Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer

New microproducts need the utilization of a diversity of materials and have complicated three-dimensional (3D) microstructures with high aspect ratios. To date, many micromanufacturing processes have been developed but specific class of such processes are applicable for fabrication of functional and true 3D microcomponents/assemblies. The aptitude to process a broad range of materials and the ability to fabricate functional and geometrically complicated 3D microstructures provides the additive manufacturing (AM) processes some profits over traditional methods, such as lithography-based or micromachining approaches investigated widely in the past. In this paper, 3D micro-AM processes have been classified into three main groups, including scalable micro-AM systems, 3D direct writing, and hybrid processes, and the key processes have been reviewed comprehensively. Principle and recent progress of each 3D micro-AM process has been described, and the advantages and disadvantages of each process have been presented.

/pdf/a-review-on-3d-micro-additive-manufacturing-technologies-1kbpeb2xb5.pdf

A review on 3D micro-additive manufacturing technologies

Greener approaches to organic synthesis using microreactor technology.

A growing number of microsystem technology (MST) applications, particularly in the field of microfluidics with its applications in the life sciences, have a need for novel fabrication methods which account for substrates other than silicon or glass. We present in this paper an overview of existing polymer microfabrication technologies for microfluidic applications, namely replication methods such as hot embossing, injection molding and casting, and the technologies necessary to fabricate the molding masters. In addition, techniques such as laser ablation and layering techniques are examined. Methods for bonding and dicing of polymer materials, which are necessary for complete systems, are evaluated.

Polymer microfabrication methods for microfluidic analytical applications

This paper describes the characterization of a home-made negative photoresist developed by IBM. This resist, called SU-8, can be produced with commercially available materials. Three blends were prepared for this article and some of its optical and mechanical properties are presented. One of its numerous advantages is the broad range of thicknesses which can be obtained in one spin: from 750 nm to with a conventional spin coater. The resist is exposed with a standard UV aligner and has an outstanding aspect ratio near 15 for lines and 10 for trenches. These ratios combined with the electroplating of copper allow the fabrication of highly integrated electromagnetic coils.

https://iopscience.iop.org/article/10.1088/0960-1317/7/3/010/pdf

SU-8: a low-cost negative resist for MEMS

Detailed investigations of the limits of a new negative-tone near-UV resist (IBM SU-8) have been performed. SU-8 is an epoxy-based resist designed specifically for ultrathick, high-aspect-ratio MEMS-type applications. We have demonstrated that with single-layer coatings, thicknesses of more than 500 μm can be achieved reproducibly. Thicker resist layers can be made by applying multiple coatings, and we have achieved exposures in 1200 μm thick, double-coated SU-8 resist layers. We have found that the aspect ratio for near-UV (400 nm) exposed and developed structures can be greater than 18 and remains constant in the thickness range between 80 and 1200 μm. Vertical sidewall profiles result in good dimensional control over the entire resist thickness. To our knowledge, this is the highest aspect ratio reported for near-UV exposures and the given range of resist thicknesses. These results will open up new possibilities for low-cost LIGA-type processes for MEMS applications. The application potential of SU-8 is demonstrated by several examples of devices and structures fabricated by electroplating and photoplastic techniques. The latter is especially interesting as SU-8 has attractive mechanical properties.

/pdf/high-aspect-ratio-ultrathick-negative-tone-near-uv-5e74sx2q34.pdf

High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS

Mechanical characterization of a new high-aspect-ratio near UV-photoresist

A new approach for the realization of true 3D polymer structures is presented in this paper. It consists in adding, in a post-processing microstereolithography step, 3D polymer microstructures on top of a micropart patterned by means of planar processes such as thin films, bulk silicon etching or high aspect ratio structuration (LIGA, RIE, thick resist). In this way, some shape limitations of the planar technologies can be overcome for new functional applications. Moreover, the direct processing of microstereolithography on predefined structures eliminates manipulations which are associated with micro-assembly of separated parts. To demonstrate this combination of microstructuration processes, an example showing a conical axle added by microstereolithography on a SU-8 piece of gearing is presented.

3D microfabrication by combining microstereolithography and thick resist UV lithography

Detailed investigations of the limits of a new negative-tone near-UV resist (IBM SU-8) have been performed. SU-8 is an epoxy-based resist designed specifically for ultrathick, high-aspect-ratio MEMS-type applications. We have demonstrated that with single-layer coatings, thicknesses of more than 500 /spl mu/m can be achieved reproducibly. Thicker resist layers can be made by multiple coatings, and we have achieved exposures in 1200-/spl mu/m-thick, double coated SU-8 resist layers. We have found that the aspect ratio for near-UV (400 nm) exposed and developed structures can be greater than 18 and remains constant in the thickness range between 80 and 1200 /spl mu/m. Vertical sidewall profiles result in good dimensional control over the entire resist thickness. To our knowledge, this is the highest aspect ratio reported for near-UV exposures and resist thicknesses. These results will open up new possibilities for low-cost LIGA-type processes for MEMS applications. In addition, the SU-8 material has interesting mechanical properties which also makes it attractive for photoplastic device fabrication.

Hubert Lorenz

Papers

SU-8: a low-cost negative resist for MEMS

High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS

Mechanical characterization of a new high-aspect-ratio near UV-photoresist

3D microfabrication by combining microstereolithography and thick resist UV lithography

High-aspect-ratio, ultrathick, negative-tone near-uv photoresist for MEMS applications