The long-standing popularity of thermoelectric materials has contributed to the creation of various thermoelectric devices and stimulated the development of strategies to improve their thermoelectric performance. In this review, we aim to comprehensively summarize the state-of-the-art strategies for the realization of high-performance thermoelectric materials and devices by establishing the links between synthesis, structural characteristics, properties, underlying chemistry and physics, including structural design (point defects, dislocations, interfaces, inclusions, and pores), multidimensional design (quantum dots/wires, nanoparticles, nanowires, nano- or microbelts, few-layered nanosheets, nano- or microplates, thin films, single crystals, and polycrystalline bulks), and advanced device design (thermoelectric modules, miniature generators and coolers, and flexible thermoelectric generators). The outline of each strategy starts with a concise presentation of their fundamentals and carefully selected examples. In the end, we point out the controversies, challenges, and outlooks toward the future development of thermoelectric materials and devices. Overall, this review will serve to help materials scientists, chemists, and physicists, particularly students and young researchers, in selecting suitable strategies for the improvement of thermoelectrics and potentially other relevant energy conversion technologies.

Advanced Thermoelectric Design: From Materials and Structures to Devices

The limitation of hot spot cooling in microchips represents an important hurdle for the electronics industry to overcome with coolers yet to exceed the efficiencies required. Nanotechnology-enabled heat sinks that can be magnetophoretically formed onto the hot spots within a microfluidic environment are presented. CrO2 nanoparticles, which are dynamically chained and docked onto the hot spots, establish tuneable high-aspect-ratio nanofins for the heat exchange between these hot spots and the liquid coolant. These nanofins can also be grown and released on demand, absorbing and releasing the heat from the hot spots into the microfluidic system. It is shown that both high aspect ratio and flexibility of the fins have a dramatic effect on increasing the heat sinking efficiency. The system has the potential to offer a practical cooling solution for future electronics.

Dynamic nanofin heat sinks

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Nanostructured thermoelectric materials: current research and future challenge

We study the photoresponse of single-layer MoS(2) field-effect transistors by scanning photocurrent microscopy. We find that, unlike in many other semiconductors, the photocurrent generation in single-layer MoS(2) is dominated by the photothermoelectric effect and not by the separation of photoexcited electron-hole pairs across the Schottky barriers at the MoS(2)/electrode interfaces. We observe a large value for the Seebeck coefficient for single-layer MoS(2) that by an external electric field can be tuned between -4 × 10(2) and -1 × 10(5) μV K(-1). This large and tunable Seebeck coefficient of the single-layer MoS(2) paves the way to new applications of this material such as on-chip thermopower generation and waste thermal energy harvesting.

Large and Tunable Photothermoelectric Effect in Single-Layer MoS2

We study the photoresponse of single-layer MoS2 field- effect transistors by scanning photocurrent microscopy. We find that, unlike in many other semiconductors, the photocurrent generation in single-layer MoS2 is dominated by the photothermoelectric effect and not by the separation of photoexcited electron−hole pairs across the Schottky barriers at the MoS2/electrode interfaces. We observe a large value for the Seebeck coefficient for single-layer MoS2 that by an external electric field can be tuned between −4 × 10 2 and −1 × 10 5 μ VK −1 . This large and tunable Seebeck coefficient of the single-layer MoS2 paves the way to new applications of this material such as on- chip thermopower generation and waste thermal energy harvesting.

Large and Tunable Photothermoelectric Effect in Single-Layer MoS 2

There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.

On-chip cooling by superlattice-based thin-film thermoelectrics

We have recently reported the first ever demonstration of active cooling of hot-spots of >1 kW/cm2 in a packaged electronic chip using thin-film superlattice thermoelectric cooler (TEC) cooling technology [1]. In this paper, we provide a detailed account of both experimental and theoretical aspects of this technological demonstration and progress. We have achieved cooling of as much as 15°C at a location on the chip where the heat-flux is as high as ∼1300 W/cm2 , with the help of a thin-film TEC integrated into the package. To our knowledge, this is the first demonstration of high heat-flux cooling with a thin-film thermoelectric device made from superlattices when it is fully integrated into a usable electronic package. Our results, which validate the concept of site-specific micro-scale cooling of electronics in general, will have significant potential for thermal management of future generations of microprocessors. Similar active thermal management could also be relevant for high-performance solid-state lasers and power electronic chips.Copyright © 2009 by ASME

Ihtesham Chowdhury

Papers

On-chip cooling by superlattice-based thin-film thermoelectrics

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics