Disclosed is a polishing agent for synthetic quartz glass substrates, which is characterized by containing a colloidal solution of a colloidal silica or the like having a colloid concentration of 20-50% by mass, and a polycarboxylic acid polymer, an acidic amino acid, a phenol or a glycosaminoglycan.

Polishing agent for synthetic quartz glass substrate

PROBLEM TO BE SOLVED: To prevent occurrence of convex defects due to residual magnetic polishing slurry and concave defects due to bringing magnetic polishing slurry into the next process even when local polishing using a magnetic polishing slurry is performed on a substrate. After polishing the surface of a mask blank substrate 1 using a magnetic polishing slurry 2 in which abrasive grains are contained in a magnetic fluid 21 containing iron, the mask blank is cleaned using a cleaning liquid 6 containing hydrochloric acid. This is a method for cleaning the surface of the substrate 1. [Selection] Figure 1

Mask blank substrate, mask blank, exposure mask, semiconductor device, and method for manufacturing them

The invention belongs to the technical field of diamond grinding wheels and particularly relates to a diamond grinding wheel adopting a resin and ceramic binding agent. The adopting resin and ceramic binding agent comprises, by weight, 22-27% of diamond powder, 23-28% of modified phenolic resin, 0-20% of Al2O3, 7-12% of Fe2O3, 1-5% of TiO2, 3-7% of nanometer SiO2, 4-9% of Teflon, 1-5% of graphite powder and 2-6% of rare earth oxides, and the sum of percentages of the raw materials is 100%. The diamond grinding wheel combines excellent performance of the resin binding agent and the ceramic binding agent and has the advantages of being high in grinding capacity, good in self-sharpening property, high in grinding accuracy and stable in shape, and the bonding force of the binding agent on diamond is good; in addition, the resin and ceramic binding agent is complementary and overcomes the defects of the resin binding agent and the ceramic binding agent, for example, the resin binding agent is poor in heat stability and the ceramic binding agent is large in loss; meanwhile, the storage stability of the grinding wheel is improved, the performance degradation of the grinding wheel in the storage process is delayed, and high cutting resistance performance is achieved.

Diamond grinding wheel adopting resin and ceramic binding agent

Provided is a polishing composition which contains a polishing material and water. The polishing composition contains the polishing material in an amount of 0.1% by mass or more. The polishing material contains zirconium oxide particles. Each zirconium oxide particle has a specific surface area of 1-15 m2/g. It is preferable that the zirconium oxide particles has a purity of 99% by mass or more. For example, the polishing composition is used for the purpose of polishing hard-brittle materials such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide and indium phosphide.

Polishing material and polishing composition

PROBLEM TO BE SOLVED: To reduce a polishing scratch caused by particles and increase a polishing speed by utilizing the chemical action of the particles in the polishing compound, and by reducing a mechanical action as much as possible in the polishing compound suitably used for a CMP technology for flattening a substrate surface in a semiconductor element manufacturing process or the like and a polishing method for carrying out polishing by using the polishing compound. SOLUTION: This polishing compound contains particles and a medium in which at least a part of the particles is dispersed, wherein the particle is formed of at least one of a cerium compound and a tetravalent metal hydroxide, and density ranges from 3 to 6 g/cm 3 , and the average particle diameter of the secondary particle ranges from 1 to 300 nm. COPYRIGHT: (C)2009,JPO&INPIT

Polishing compound and polishing method for substrate

PROBLEM TO BE SOLVED: To provide a polishing material slurry which achieves surface polishing with high surface evenness, small surface roughness and excellent precision hardly causing surface microscratches, surface micropits, or the like, and besides, achieves a high polishing speed. SOLUTION: The polishing material slurry comprises a cerium oxide-containing rare earth oxide as the principal component, an anionic surfactant, and a nonionic surfactant and has a pH≥11. COPYRIGHT: (C)2004,JPO

Polishing material slurry, polishing method, substrate, and producing method of the substrate

PROBLEM TO BE SOLVED: To provide an abrasive slurry and abrasive fine powder therein capable of attaining high abrasive speed while attaining such a high-accuracy surface polish as to be high in surface flatness, low in surface roughness and substantially produce neither surface microscratches nor micropits in making a precision polishing of electronics-related substrates or the like. SOLUTION: This abrasive slurry, which is preferably >pH 10, is such that the other objective abrasive fine powder has the ratio D95/D50 of 1.2-3.0 (D95 is volume-based 95% cumulative average particle diameter, and D50 is volume- based 50% cumulative average particle diameter).

Abrasive slurry and abrasive fine powder

A flowable polishing compound paste, which comprises 30 to 95 mass % in terms of a solid content of a polishing compound containing a cerium oxide as a main component, and exhibits a rate of the lightness change for the surface thereof of 10 %/hr or less. The flowable polishing compound paste has a high content of a polishing compound containing a cerium oxide as a main component, and also exhibits excellent quality stability and flowability.

Flowable polishing compound paste, method for production thereof and use thereof

PROBLEM TO BE SOLVED: To provide a grinding material powder having a good dispersibility, especially the grinding material powder capable of exhibiting a similar grinding performance with a grinding agent supplied as a slurry state on dispersing it in a liquid medium to form the slurry state, a method for producing the same and a method for using the same. SOLUTION: This grinding material powder is obtained by making the grinding material slurry 14 in contact with pulse combustion gas delivered from a pulse combustion device 5 for drying. The grinding material slurry is produced by mixing the grinding powder with the liquid medium. COPYRIGHT: (C)2006,JPO&NCIPI

Imai Fumio

Papers

Polishing material slurry, polishing method, substrate, and producing method of the substrate

Abrasive slurry and abrasive fine powder

Flowable polishing compound paste, method for production thereof and use thereof

Grinding material powder, grinding material slurry, grinding pad having fixed grinding particle, methods for producing them and method of grinding