J. F. Gibbons

Bio: J. F. Gibbons is an academic researcher from Stanford University. The author has contributed to research in topics: Silicon & Ion implantation. The author has an hindex of 36, co-authored 121 publications receiving 5794 citations.

Ion implantation in semiconductors—Part II: Damage production and annealing

Abstract: Radiation damage is produced in a crystalline target whenever a moving ion transfers sufficient energy to a target atom to displace it from its lattice site. For conditions of practical importance in ion implantation, the radiation damage produced by the injected ions is severe, and the crystal must be carefully Annealed if the chemical effects of the implanted ions are to dominate the residual damage. The purpose of this paper is to review work that has been performed over the past several years in an effort to understand implantation-produced damage and its annealing characteristics, especially in silicon. The subject is developed as follows. A qualitative description of the damage produced by an implanted ion is presented in Section I, followed by a partial inventory of the basic defects that are found in ion-implanted silicon (Section II). The structure of individual damage clusters produced by both heavy and light ions is then described in Section III, where theoretical predictions are compared to a variety of experimental data. This is followed with a section on the depth distribution of defects and damage clusters (Section IV); and the paper is then concluded with a section on the annealing characteristics of implantation-produced damage (Section V). The development is organized to give primary emphasis to those facts and ideas that are essential for applications of ion implantation in the fabrication of MOS and junction devices in silicon. A future paper will review the state of the art in compound semiconductors.

Electron mobility enhancement in strained-Si n-type metal-oxide-semiconductor field-effect transistors

Abstract: Enhanced performance is demonstrated in n-type metal-oxide-semiconductor field-effect transistors with channel regions formed by pseudomorphic growth of strained Si on relaxed Si/sub 1/spl minus/x/Ge/sub x/ Standard MOS fabrication techniques were utilized, including thermal oxidation of the strained Si Surface channel devices show low-field mobility enhancements of 80% at room temperature and 12% at 10 K, when compared to control devices fabricated in Czochralski Si Similar enhancements are observed in the device transconductance In addition, buried channel devices show peak room temperature mobilities about three times that of control devices >

Temperature distributions produced in semiconductors by a scanning elliptical or circular cw laser beam

Abstract: Temperature profiles induced by a cw laser beam in a semiconductor are calculated. The calculation is done for an elliptical scanning beam and covers a wide range of experimental conditions. The limiting case of a circular beam is also studied. This calculation is developed in the particular cases of silicon and gallium arsenide, where the temperature dependence of the thermal conductivity has been taken into consideration. Using a cylindrical lens to produce an elliptical beam with an aspect ratio of 20, a 1‐mm‐wide area of an ion‐implanted silicon wafer was annealed in a single scan. The experimental data are consistent with the extrapolation of solid‐phase epitaxial regrowth rates to the calculated laser‐induced temperatures.

Ion implantation in semiconductors—Part I: Range distribution theory and experiments

Abstract: Ion implantation in semiconductors provides a doping technique with several potential advantages over more conventional doping methods. Among the most important of these are: 1) the ability to introduce into a variety of substrates precise amounts of nearly any impurity element desired; 2) the ability to control doping profiles in three dimensions by modulating the energy, current, and position of the ion beam; and 3) the possibility of avoiding certain undesirable effects that accompany the high-temperature diffusion process. Ion implantation can also be used in conjunction with other fabrication techniques to produce device structures that no one process can produce simply by itself. Current research in the field is directed toward several problems that must be solved before the full impact of ion implantation on semiconductor technology can be soundly predicted. In particular, it is necessary to be able to predict the distribution profiles of the implanted ions accurately, to know which crystalline sites the implanted ions occupy, to know the nature of the damage centers that are introduced by the implantation process, and to determine the extent to which these defects can he removed by appropriate annealing procedures. Theoretical and experimental work pertinent to the problem of predicting impurity distribution profiles in ion-implanted material are reviewed here. A review of current research on the other problems listed will be given in Part II, together with the characteristics of a number of interesting semiconductor devices that have already been fabricated by ion implantation.

Limited reaction processing: Silicon epitaxy

Abstract: We introduce a new technique, limited reaction processing, in which radiant heating is used to provide rapid, precise changes in the temperature of a substrate to control surface reactions. This process was used to fabricate thin layers of high quality epitaxial silicon. Abrupt transitions in doping concentration at the epitaxial layer/substrate interface were achieved for undoped films deposited on heavily doped substrates.

Electronics based on two-dimensional materials

Abstract: The compelling demand for higher performance and lower power consumption in electronic systems is the main driving force of the electronics industry's quest for devices and/or architectures based on new materials. Here, we provide a review of electronic devices based on two-dimensional materials, outlining their potential as a technological option beyond scaled complementary metal-oxide-semiconductor switches. We focus on the performance limits and advantages of these materials and associated technologies, when exploited for both digital and analog applications, focusing on the main figures of merit needed to meet industry requirements. We also discuss the use of two-dimensional materials as an enabling factor for flexible electronics and provide our perspectives on future developments.

Semiconductor device, and manufacturing method thereof

Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Ion implantation in semiconductors

Abstract: Ion implantation is being applied extensively to silicon device technology. Two principle features are utilized- 1) charge control in MOS structures for threshold shift, autoregistration, and complementary wells and 2) distribution control in microwave and bipolar structures. Another feature that has not been extensively exploited is to combine the advantages of the high resolution capabilities of electric beam pattern delineation with the low lateral spread inherent in the implantation process. This talk reviews some of the general features of the characteristics of implanted layers in terms of depth distribution, radiation damage and electron activity. Implantation processes in silicon are reasonably well understood. There remain areas which require further clarification. For compound semiconductors, particularly GaAs, implantation techniques offer attractive possibilities for the fabrication of high frequency devices. In these materials, the substrate temperature during implantation and the dielectric coating required to prevent dissociation during thermal anneal play major roles.

Ion Implantation in Semiconductors

Abstract: Ion implantation is being applied extensively to silicon device technology. Two principle features are utilized- 1) charge control in MOS structures for threshold shift, autoregistration, and complementary wells and 2) distribution control in microwave and bipolar structures. Another feature that has not been extensively exploited is to combine the advantages of the high resolution capabilities of electric beam pattern delineation with the low lateral spread inherent in the implantation process. This talk reviews some of the general features of the characteristics of implanted layers in terms of depth distribution, radiation damage and electron activity. Implantation processes in silicon are reasonably well understood. There remain areas which require further clarification. For compound semiconductors, particularly GaAs, implantation techniques offer attractive possibilities for the fabrication of high frequency devices. In these materials, the substrate temperature during implantation and the dielectric coating required to prevent dissociation during thermal anneal play major roles.