J.M. Bustillo

Bio: J.M. Bustillo is an academic researcher from University of California, Berkeley. The author has contributed to research in topics: Microelectromechanical systems & Fabrication. The author has an hindex of 2, co-authored 2 publications receiving 770 citations.

Surface micromachining for microelectromechanical systems

Abstract: Surface micromachining is characterized by the fabrication of micromechanical structures from deposited thin films. Originally employed for integrated circuits, films composed of materials such as low-pressure chemical-vapor-deposition polycrystalline silicon, silicon nitride, and silicon dioxides can be sequentially deposited and selectively removed to build or "machine" three-dimensional structures whose functionality typically requires that they be freed from the planar substrate. Although the process to accomplish this fabrication dates from the 1960's, its rapid extension over the past few years and its application to batch fabrication of micromechanisms and of monolithic microelectromechanical systems (MEMS) make a thorough review of surface micromachining appropriate at this time. Four central issues of consequence to the MEMS technologist are: (i) the understanding and control of the material properties of microstructural films, such as polycrystalline silicon, (ii) the release of the microstructure, for example, by wet etching silicon dioxide sacrificial films, followed by its drying and surface passivation, (iii) the constraints defined by the combination of micromachining and integrated-circuit technologies when fabricating monolithic sensor devices, and (iv) the methods, materials, and practices used when packaging the completed device. Last, recent developments of hinged structures for postrelease assembly, high-aspect-ratio fabrication of molded parts from deposited thin films, and the advent of deep anisotropic silicon etching hold promise to extend markedly the capabilities of surface-micromachining technologies.

Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments

Abstract: A new technique for providing both electrical isolation and embedded interconnect to SOI-based, single crystal silicon, inertial sensors is described. This technology allows fabrication of high-aspect-ratio, in-plane, capacitive sensors with improved sensitivity suitable for integration with on-chip electronics. Various 45 /spl mu/m-tall MEMS devices with electrical isolation from the silicon substrate and embedded interconnect have been fabricated and tested. The embedded interconnect and electrical isolation enable truly integrated high-aspect-ratio MEMS sensors, and alternatively simplifies packaging in monolithic two-chip approaches. By extending the demonstrated technique to aluminum interconnect, only two additional masks are required to convert a CMOS process into a fully integrated MEMS technology at the incremental cost of an SOI starting material.

Two-photon polymerization initiators for three-dimensional optical data storage and microfabrication

Abstract: Two-photon excitation provides a means of activating chemical or physical processes with high spatial resolution in three dimensions and has made possible the development of three-dimensional fluorescence imaging1, optical data storage2,3 and lithographic microfabrication4,5,6. These applications take advantage of the fact that the two-photon absorption probability depends quadratically on intensity, so under tight-focusing conditions, the absorption is confined at the focus to a volume of order λ3 (where λ is the laser wavelength). Any subsequent process, such as fluorescence or a photoinduced chemical reaction, is also localized in this small volume. Although three-dimensional data storage and microfabrication have been illustrated using two-photon-initiated polymerization of resins incorporating conventional ultraviolet-absorbing initiators, such photopolymer systems exhibit low photosensitivity as the initiators have small two-photon absorption cross-sections (δ). Consequently, this approach requires high laser power, and its widespread use remains impractical. Here we report on a class of π;-conjugated compounds that exhibit large δ (as high as 1, 250 × 10−50 cm4 s per photon) and enhanced two-photon sensitivity relative to ultraviolet initiators. Two-photon excitable resins based on these new initiators have been developed and used to demonstrate a scheme for three-dimensional data storage which permits fluorescent and refractive read-out, and the fabrication of three-dimensional micro-optical and micromechanical structures, including photonic-bandgap-type structures7.

Two-photon polymerization initiators for three-dimensional optical data storage and microfabrication

Abstract: Two-photon excitation provides a means of activating chemical or physical processes with high spatial resolution in three dimensions and has made possible the development of three-dimensional fluorescence imaging, optical data storage, and lithographic microfabrication. These applications take advantage of the fact that the two-photon absorption probability depends quadratically on intensity, so under tight-focusing conditions, the absorption is confined at the focus to a volume of order λ3 (where λ is the laser wavelength). Any subsequent process, such as fluorescence or a photoinduced chemical reaction, is also localized in this small volume. Although three-dimensional data storage and microfabrication have been illustrated using two-photon-initiated polymerization of resins incorporating conventional ultraviolet-absorbing initiators, such photopolymer systems exhibit low photosensitivity as the initiators have small two-photon absorption cross-sections (δ). Consequently, this approach requires high laser power, and its widespread use remains impractical. Here we report on a class of π;-conjugated compounds that exhibit large δ (as high as 1, 250 × 10−50 cm4 s per photon) and enhanced two-photon sensitivity relative to ultraviolet initiators. Two-photon excitable resins based on these new initiators have been developed and used to demonstrate a scheme for three-dimensional data storage which permits fluorescent and refractive read-out, and the fabrication of three-dimensional micro-optical and micromechanical structures, including photonic-bandgap-type structures.

An Introduction to Microelectromechanical Systems Engineering

Abstract: If you've not been involved in MEMS (MicroElectroMechanical Systems) technology or had the cause to use MEMS devices, then you may wonder what all the fuss is about. What are MEMS anyway? What's the difference between MEMS and MST (MicroSystems Technology)? What are the advantages over existing technologies? If you have ever found yourself pondering over such questions, then this book may be for you. As the title suggests, the main aim is to provide an introduction to MEMS by describing the processes and materials available and by using examples of commercially available devices. The intended readership are those technical managers, engineers, scientists and graduate students who are keen to learn about MEMS but have little or no experience of the technology. I was particularly pleased to note that Maluf has dedicated a whole chapter to the important (and often difficult) area of packaging. The first three chapters provide a general overview of the technology. Within the first three pages we are introduced to the MEMS versus MST question, only to discover that the difference depends on where you live! The United States prefer MEMS, while the Europeans use the handle MST. (Note to self: tell colleagues in MEMS group at Southampton). A good account is given of the basic materials used in the technology, including silicon, silicon oxide/nitride/carbide, metals, polymers, quartz and gallium arsenide. The various processes involved in the creation of MEMS devices are also described. A good treatment is given to etching and bonding in addition to the various deposition techniques. It was interesting to note that the author doesn't make a big issue of the differences between bulk and surface micromachined devices; the approach seems to be `here's your toolbag - get on with it'. One of the great strengths of this book is the coverage of commercial MEMS structures. Arising as they have, from essentially a planar technology, MEMS devices are often elaborate three-dimensional creations, and 2D drawings don't do them much justice. I have to say that I was extremely impressed with the many aesthetic isometric views of some of these wonderful structures. Pressure sensors, inkjet print nozzles, mass flow sensors, accelerometers, valves and micromirrors are all given sufficient treatment to describe the fundamental behaviour and design philosophy, but without the mathematical rigour expected for a traditional journal paper. Chapter 5 addresses the promise of the technology as a means of enabling a new range of applications. The concept of using MEMS devices as key elements within complex systems (or even microsystems!) is explored. The so-called `lab-on-a-chip' approach is described, whereby complex analytical systems are integrated onto a single chip together with the associated micropumps and microvalves. The design and fabrication of MEMS devices are important issues by themselves. A key area, often overlooked, is that of packaging. Painstaking modelling and intricate fabrication methodologies can produce resonator structures oscillating at precisely, say, 125 kHz. The device is then mounted in a dual-in-line carrier and the frequency shifts by 10 kHz because of the additional internal stresses produced. Packaging issues can't be decoupled from those of the micromachined components. Many of these issues, such as protective coatings, thermal management, calibration etc, are covered briefly in the final chapter. Overall, I found this book informative and interesting. It has a broad appeal and gives a good insight into this fascinating and exciting subject area. Neil White

Microelectromechanical systems (MEMS):fabrication, design and applications

Abstract: Micromachining and micro-electromechanical system (MEMS) technologies can be used to produce complex structures, devices and systems on the scale of micrometers. Initially micromachining techniques were borrowed directly from the integrated circuit (IC) industry, but now many unique MEMS-specific micromachining processes are being developed. In MEMS, a wide variety of transduction mechanisms can be used to convert real-world signals from one form of energy to another, thereby enabling many different microsensors, microactuators and microsystems. Despite only partial standardization and a maturing MEMS CAD technology foundation, complex and sophisticated MEMS are being produced. The integration of ICs with MEMS can improve performance, but at the price of higher development costs, greater complexity and a longer development time. A growing appreciation for the potential impact of MEMS has prompted many efforts to commercialize a wide variety of novel MEMS products. In addition, MEMS are well suited for the needs of space exploration and thus will play an increasingly large role in future missions to the space station, Mars and beyond. (Some figures in this article are in colour only in the electronic version)

Surface micromachining for microelectromechanical systems

Abstract: Surface micromachining is characterized by the fabrication of micromechanical structures from deposited thin films. Originally employed for integrated circuits, films composed of materials such as low-pressure chemical-vapor-deposition polycrystalline silicon, silicon nitride, and silicon dioxides can be sequentially deposited and selectively removed to build or "machine" three-dimensional structures whose functionality typically requires that they be freed from the planar substrate. Although the process to accomplish this fabrication dates from the 1960's, its rapid extension over the past few years and its application to batch fabrication of micromechanisms and of monolithic microelectromechanical systems (MEMS) make a thorough review of surface micromachining appropriate at this time. Four central issues of consequence to the MEMS technologist are: (i) the understanding and control of the material properties of microstructural films, such as polycrystalline silicon, (ii) the release of the microstructure, for example, by wet etching silicon dioxide sacrificial films, followed by its drying and surface passivation, (iii) the constraints defined by the combination of micromachining and integrated-circuit technologies when fabricating monolithic sensor devices, and (iv) the methods, materials, and practices used when packaging the completed device. Last, recent developments of hinged structures for postrelease assembly, high-aspect-ratio fabrication of molded parts from deposited thin films, and the advent of deep anisotropic silicon etching hold promise to extend markedly the capabilities of surface-micromachining technologies.