scispace - formally typeset
J

Jack L. Skinner

Researcher at Montana Tech of the University of Montana

Publications -  65
Citations -  781

Jack L. Skinner is an academic researcher from Montana Tech of the University of Montana. The author has contributed to research in topics: Nanoimprint lithography & Electrospinning. The author has an hindex of 14, co-authored 62 publications receiving 694 citations. Previous affiliations of Jack L. Skinner include Sandia National Laboratories & University of California, Berkeley.

Papers
More filters

Detection of Spatially Distributed Damage in Fiber-Reinforced Polymer Composites.

TL;DR: In this article, a method of embedded damage detection within glass fiber-reinforced polymer composites is described by monitoring the spatially distributed electrical conductivity of a strain-sensitive multiwalled carbon nanotube thin film.
Proceedings Article

Spatial Sensing Using Electrical Impedance Tomography.

TL;DR: In this article, a sprayed conductive carbon nanotube-polymer film was applied to glass fiber-reinforced polymer composite substrates to measure changes in conductivity within the conductive films because of damage.
Journal ArticleDOI

Spatial Sensing Using Electrical Impedance Tomography

TL;DR: In this paper, a sprayed conductive carbon nanotube-polymer film was applied to glass fiber-reinforced polymer composite substrates to measure changes in conductivity within the conductive films because of damage.
Journal ArticleDOI

Detection of Spatially Distributed Damage in Fiber-Reinforced Polymer Composites

TL;DR: In this paper, a method of embedded damage detection within glass fiber-reinforced polymer composites is described, where damage detection is achieved by monitoring the spatially distributed electrical con...
Journal ArticleDOI

Electrical discharge across micrometer-scale gaps for planar MEMS structures in air at atmospheric pressure

TL;DR: In this article, electrical discharge current responses across atmospheric pressure air gaps in the 2 µm to 7 µm range between planar polysilicon microstructures were examined to determine the physical process of electrical discharge.