Jan Hendrik Mannak

Bio: Jan Hendrik Mannak is an academic researcher from Thales (Netherlands). The author has contributed to research in topics: Printed circuit board & Heat pipe. The author has an hindex of 4, co-authored 9 publications receiving 73 citations.

Planar heat pipe for cooling

Abstract: There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13) The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being grooved (9) on its metal clad side, the panels (1, 2) being assembled by their metal clad sides to form a sealed cavity (8), the cavity (8) being filled with a fluid (10), the fluid (10) circulating by capillary action along the grooves (9) towards zones exposed to heat where it vaporizes

Directly injected forced convection cooling for electronics

Abstract: Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).

Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology

Abstract: A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.

Novel cooling strategy for electronic packages: Directly injected cooling

Abstract: This publication describes the development of a novel cooling strategy for electronic packages. During the conceptual design phase, the engineering disciplines involved are considered simultaneously. Through a case study, it is demonstrated that this integrative approach is an effective methodology leading to an innovative design. A novel, improved and highly integrated cooling strategy for electronic packages is presented. Standardized package types, as for instance ball grid array packages, are equipped with a directly injected cooling support. The developed concept is a new and very cost effective concept, as fewer productions steps and fewer procured parts are required compared to traditional cooling concepts. The new concept is also easily scalable, as multiple components on an electronic product can be cooled both uniformly across the product and simultaneously. This increases design flexibility and results in electronic products with advantages in terms of performance, compactness, weight and production efficiency.

The Development of Polymer-Based Flat Heat Pipes

Abstract: In this paper, polymer-based flat heat pipes (PFHPs) with a thickness on the order of 1 mm have been successfully developed and tested. Liquid-crystal polymer (LCP) films with copper-filled thermal vias are employed as the case material. A copper micropillar/woven mesh hybrid wicking structure was designed and fabricated to promote evaporation/condensation heat transfer and the liquid supply to the evaporator of the PFHP. Water was selected as the working fluid because of its superior thermophysical properties. An experimental study was conducted to examine the PFHP performance. The test data demonstrated that the PFHP can operate with a heat flux of 11.94 W/cm2 and results in effective thermal conductivity ranging from 650 to 830 W/m · K, with the value varying with the input heat flux and the tilt angle. With the employment of flexible LCP as casing material, the PFHP could potentially be directly integrated into a printed circuit board or flexible circuits for thermal management of heat-generating components.

Contact cooled electronic enclosure

Abstract: Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

Flat flexible polymer heat pipes

Abstract: Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the casing. A triple-layer sintered copper woven mesh served as a liquid wicking structure, and water was the working fluid. A coarse nylon woven mesh provided space for vapor transport and mechanical rigidity. Thermal power ranging from 5 to 30 W was supplied to the evaporator while the device was flexed at 0°, 45° and 90°. The thermal resistance of the FPHP ranged from 1.2 to 3.0 K W−1 depending on the operating conditions while the thermal resistance for a similar-sized solid copper reference was a constant at 4.6 K W−1. With 25 W power input, the thermal resistance of the liquid–vapor core of the FPHP was 23% of a copper reference sample with identical laminated polymer material. This work shows a promising combination of technologies that has the potential to usher in a new generation of highly flexible, lightweight, low-cost, high-performance thermal management solutions.

Electronic control unit

Abstract: In an electronic control unit, a semiconductor device that is installed to a circuit board includes a semiconductor chip, multiple leads and a resin body The semiconductor chip is electrically connected to the circuit board through the leads and is molded in the resin body A case receives the semiconductor device A heat releasing gel contacts the semiconductor device, and conducts heat generated from the semiconductor device to a first cover of the case located on one side of the semiconductor device, which is opposite from the circuit board A groove portion as a movement limiting means is placed at a location between the circuit board and the first cover Therefore, movement of the heat releasing gel is limited, and heat can be released to a side of the case through the heat releasing gel with high efficiency

Thermal performance of a flat polymer heat pipe heat spreader under high acceleration

Abstract: This paper presents the fabrication and application of a micro-scale hybrid wicking structure in a flat polymer-based heat pipe heat spreader, which improves the heat transfer performance under high adverse acceleration. The hybrid wicking structure which enhances evaporation and condensation heat transfer under adverse acceleration consists of 100 µm high, 200 µm wide square electroplated copper micro-pillars with 31 µm wide grooves for liquid flow and a woven copper mesh with 51 µm diameter wires and 76 µm spacing. The interior vapor chamber of the heat pipe heat spreader was 30×30×1.0 mm3. The casing of the heat spreader is a 100 µm thick liquid crystal polymer which contains a two-dimensional array of copper-filled vias to reduce the overall thermal resistance. The device performance was assessed under 0–10 g acceleration with 20, 30 and 40 W power input on an evaporator area of 8×8 mm2. The effective thermal conductivity of the device was determined to range from 1653 W (m K)−1 at 0 g to 541 W (m K)−1 at 10 g using finite element analysis in conjunction with a copper reference sample. In all cases, the effective thermal conductivity remained higher than that of the copper reference sample. This work illustrates the possibility of fabricating flexible, polymer-based heat pipe heat spreaders compatible with standardized printed circuit board technologies that are capable of efficiently extracting heat at relatively high dynamic acceleration levels.