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Author

Janusz Grzyb

Other affiliations: IBM, ETH Zurich
Bio: Janusz Grzyb is an academic researcher from University of Wuppertal. The author has contributed to research in topics: Antenna (radio) & Terahertz radiation. The author has an hindex of 30, co-authored 137 publications receiving 4436 citations. Previous affiliations of Janusz Grzyb include IBM & ETH Zurich.


Papers
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Journal ArticleDOI
TL;DR: A 0.13-mum SiGe BiCMOS double-conversion superheterodyne receiver and transmitter chipset for data communications in the 60-GHz band is presented.
Abstract: A 0.13-mum SiGe BiCMOS double-conversion superheterodyne receiver and transmitter chipset for data communications in the 60-GHz band is presented. The receiver chip includes an image-reject low-noise amplifier (LNA), RF-to-IF mixer, IF amplifier strip, quadrature IF-to-baseband mixers, phase-locked loop (PLL), and frequency tripler. It achieves a 6-dB noise figure, -30 dBm IIP3, and consumes 500 mW. The transmitter chip includes a power amplifier, image-reject driver, IF-to-RF upmixer, IF amplifier strip, quadrature baseband-to-IF mixers, PLL, and frequency tripler. It achieves output P1dB of 10 to 12dBm, Psat of 15 to 17 dBm, and consumes 800 mW. The chips have been packaged with planar antennas, and a wireless data link at 630 Mb/s over 10 m has been demonstrated

445 citations

Journal ArticleDOI
TL;DR: A 1 k-pixel camera chip for active terahertz video recording at room-temperature has been fully integrated in a 65-nm CMOS bulk process technology and includes row and column select and integrate-and-dump circuitry capable of capturing terAhertz videos up to 500 fps.
Abstract: A 1 k-pixel camera chip for active terahertz video recording at room-temperature has been fully integrated in a 65-nm CMOS bulk process technology. The 32 × 32 pixel array consists of 1024 differential on-chip ring antennas coupled to NMOS direct detectors operated well-beyond their cutoff frequency based on the principle of distributed resistive self-mixing. It includes row and column select and integrate-and-dump circuitry capable of capturing terahertz videos up to 500 fps. The camera chip has been packaged together with a 41.7-dBi silicon lens (measured at 856 GHz) in a 5 × 5 × 3 cm3 camera module. It is designed for continuous-wave illumination (no lock-in technique required). In this video-mode the camera operates up to 500 fps. At 856 GHz it achieves a responsivity Rv of about 115 kV/W (incl. a 5-dB VGA gain) and a total noise equivalent power (NEPtotal) of about 12 nW integrated over its 500-kHz video bandwidth. At a 5-kHz chopping frequency (non-video mode) a single pixel can provide a maximum responsivity Rv of 140 kV/W (incl. a 5-dB VGA gain) and a minimum noise equivalent power ( NEP) of 100 pW/√Hz at 856 GHz. The wide-band antenna and pixel design achieves a 3-dB bandwidth of at least 790-960 GHz.

347 citations

Journal ArticleDOI
01 Dec 2003
TL;DR: A look at the synergistic relationship between textiles and computing and identify the need for their "integration" using tools provided by an emerging new field of research that combines the strengths and capabilities of electronics and textiles into one: electronic textiles, or e-textiles.
Abstract: The invention of the Jacquard weaving machine led to the concept of a stored "program" and "mechanized" binary information processing. This development served as the inspiration for C. Babbage's analytical engine-the precursor to the modern-day computer. Today, more than 200 years later, the link between textiles and computing is more realistic than ever. In this paper, we look at the synergistic relationship between textiles and computing and identify the need for their "integration" using tools provided by an emerging new field of research that combines the strengths and capabilities of electronics and textiles into one: electronic textiles, or e-textiles. E-textiles, also called smart fabrics, have not only "wearable" capabilities like any other garment, but also have local monitoring and computation, as well as wireless communication capabilities. Sensors and simple computational elements are embedded in e-textiles, as well as built into yarns, with the goal of gathering sensitive information, monitoring vital statistics, and sending them remotely (possibly over a wireless channel) for further processing. The paper provides an overview of existing efforts and associated challenges in this area, while describing possible venues and opportunities for future research.

342 citations

Proceedings ArticleDOI
Brian Floyd1, Scott K. Reynolds1, U. Pfeifer1, Troy J. Beukema1, Janusz Grzyb1, C. Haymes1 
18 Sep 2006
TL;DR: An integrated SiGe superheterodyne RX/TX pair capable of Gb/s data rates in the 60GHz band is described and achieves 10% PAE in the final stage.
Abstract: An integrated SiGe superheterodyne RX/TX pair capable of Gb/s data rates in the 60GHz band is described. The 6dB NF RX includes an image-reject LNA, a multistage down-converter with on-chip IF filters, a frequency tripler, a PLL, and baseband outputs. The 10 to 12dBm P1dBTX achieves 10% PAE in the final stage. It includes a PA, image-reject driver, multistage up-converter with on-chip filters, tripler, and PLL

303 citations


Cited by
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Journal ArticleDOI
Wei Zeng1, Lin Shu1, Qiao Li1, Song Chen1, Fei Wang1, Xiaoming Tao1 
TL;DR: This article attempts to critically review the current state-of-arts with respect to materials, fabrication techniques, and structural design of devices as well as applications of the fiber-based wearable electronic products.
Abstract: Fiber-based structures are highly desirable for wearable electronics that are expected to be light-weight, long-lasting, flexible, and conformable Many fibrous structures have been manufactured by well-established lost-effective textile processing technologies, normally at ambient conditions The advancement of nanotechnology has made it feasible to build electronic devices directly on the surface or inside of single fibers, which have typical thickness of several to tens microns However, imparting electronic functions to porous, highly deformable and three-dimensional fiber assemblies and maintaining them during wear represent great challenges from both views of fundamental understanding and practical implementation This article attempts to critically review the current state-of-arts with respect to materials, fabrication techniques, and structural design of devices as well as applications of the fiber-based wearable electronic products In addition, this review elaborates the performance requirements of the fiber-based wearable electronic products, especially regarding the correlation among materials, fiber/textile structures and electronic as well as mechanical functionalities of fiber-based electronic devices Finally, discussions will be presented regarding to limitations of current materials, fabrication techniques, devices concerning manufacturability and performance as well as scientific understanding that must be improved prior to their wide adoption

1,626 citations

Journal ArticleDOI
07 Jul 2014-Sensors
TL;DR: This review focuses on recent advances in the field of Smart Textiles and pays particular attention to the materials and their manufacturing process, to highlight a possible trade-off between flexibility, ergonomics, low power consumption, integration and eventually autonomy.
Abstract: Electronic Textiles (e-textiles) are fabrics that feature electronics and interconnections woven into them, presenting physical flexibility and typical size that cannot be achieved with other existing electronic manufacturing techniques. Components and interconnections are intrinsic to the fabric and thus are less visible and not susceptible of becoming tangled or snagged by surrounding objects. E-textiles can also more easily adapt to fast changes in the computational and sensing requirements of any specific application, this one representing a useful feature for power management and context awareness. The vision behind wearable computing foresees future electronic systems to be an integral part of our everyday outfits. Such electronic devices have to meet special requirements concerning wearability. Wearable systems will be characterized by their ability to automatically recognize the activity and the behavioral status of their own user as well as of the situation around her/him, and to use this information to adjust the systems' configuration and functionality. This review focuses on recent advances in the field of Smart Textiles and pays particular attention to the materials and their manufacturing process. Each technique shows advantages and disadvantages and our aim is to highlight a possible trade-off between flexibility, ergonomics, low power consumption, integration and eventually autonomy.

1,576 citations

Journal ArticleDOI
TL;DR: An in-depth view of Terahertz Band (0.1-10 THz) communication, which is envisioned as a key technology to satisfy the increasing demand for higher speed wireless communication, is provided.

1,206 citations

Journal ArticleDOI
TL;DR: The goal of this paper is to provide a comprehensive review of wireless sub-THz and THz communications and report on the reported advantages and challenges of using sub-terahertz andTHz waves as a means to transmit data wirelessly.
Abstract: According to Edholm’s law, the demand for point-to-point bandwidth in wireless short-range communications has doubled every 18 months over the last 25 years It can be predicted that data rates of around 5–10 Gb/s will be required in ten years In order to achieve 10 Gb/s data rates, the carrier frequencies need to be increased beyond 100 GHz Over the past ten years, several groups have considered the prospects of using sub-terahertz (THz) and THz waves (100–2000 GHz) as a means to transmit data wirelessly Some of the reported advantages of THz communications links are inherently higher bandwidth compared to millimeter wave links, less susceptibility to scintillation effects than infrared wireless links, and the ability to use THz links for secure communications Our goal of this paper is to provide a comprehensive review of wireless sub-THz and THz communications

991 citations

Journal ArticleDOI
18 Jul 2011
TL;DR: An overview of the technological advances in millimeter-wave circuit components, antennas, and propagation that will soon allow 60-GHz transceivers to provide multigigabit per second (multi-Gb/s) wireless communication data transfers in the consumer marketplace is presented.
Abstract: This tutorial presents an overview of the technological advances in millimeter-wave (mm-wave) circuit components, antennas, and propagation that will soon allow 60-GHz transceivers to provide multigigabit per second (multi-Gb/s) wireless communication data transfers in the consumer marketplace. Our goal is to help engineers understand the convergence of communications, circuits, and antennas, as the emerging world of subterahertz and terahertz wireless communications will require understanding at the intersections of these areas. This paper covers trends and recent accomplishments in a wide range of circuits and systems topics that must be understood to create massively broadband wireless communication systems of the future. In this paper, we present some evolving applications of massively broadband wireless communications, and use tables and graphs to show research progress from the literature on various radio system components, including on-chip and in-package antennas, radio-frequency (RF) power amplifiers (PAs), low-noise amplifiers (LNAs), voltage-controlled oscillators (VCOs), mixers, and analog-to-digital converters (ADCs). We focus primarily on silicon-based technologies, as these provide the best means of implementing very low-cost, highly integrated 60-GHz mm-wave circuits. In addition, the paper illuminates characterization techniques that are required to competently design and fabricate mm-wave devices in silicon, and illustrates effects of the 60-GHz RF propagation channel for both in-building and outdoor use. The paper concludes with an overview of the standardization and commercialization efforts for 60-GHz multi-Gb/s devices, and presents a novel way to compare the data rate versus power efficiency for future broadband devices.

907 citations