J
Jinshan Li
Researcher at Northwestern Polytechnical University
Publications - 689
Citations - 11099
Jinshan Li is an academic researcher from Northwestern Polytechnical University. The author has contributed to research in topics: Microstructure & Alloy. The author has an hindex of 42, co-authored 592 publications receiving 7630 citations. Previous affiliations of Jinshan Li include Northwestern Polytechnic University & China Academy of Engineering Physics.
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Characterization and Properties of a Novel Energetic–Energetic Cocrystal Explosive Composed of HNIW and BTF
TL;DR: In this article, a 1:1 cocrystal explosive of 2,4,6,8,10,12 hexanitrohexaazaisowurtzitane (HNIW) and benzotrifuroxan (BTF) has been prepared.
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Effect of aging temperature on microstructure and properties of AlCoCrCuFeNi high-entropy alloy
TL;DR: The microstructure and compressive properties of AlCoCrCuFeNi high-entropy alloy aged at temperatures ranging from 500 to 1000°C were investigated in this article.
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Strengthening of nanoprecipitations in an annealed Al0.5CoCrFeNi high entropy alloy
TL;DR: The tensile property of Al 0.5 CoCrFeNi high entropy alloys heat-treated at 650-°C for 834 MPa, 1220 MPa for 650-C/8-h heat-treated condition, which was attributed to the nano-sized B2 phase in the interdendritic region as mentioned in this paper.
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Characterization of hot deformation behavior of a new near beta titanium alloy: Ti-7333
TL;DR: In this article, the hot deformation behavior of Ti-7333 titanium alloy in the temperature range of 770 −970 −C and strain rate range of 10−3 −10 s−1 has been investigated by hot compressive testing on the Gleeble-3800 thermal and mechanical simulator.
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A brief review of high-entropy films
TL;DR: High-entropy films as mentioned in this paper are a new type of films which have been developed based on highentropy alloys and feature many excellent properties, such as high strength and hardness with remarkable strain hardening rate, excellent wear and corrosion resistance, thermal stability, irradiation resistance, high toughness for wide-temperature range applications, etc., which traditional films are incomparable with.