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John W. Hutchinson

Bio: John W. Hutchinson is an academic researcher from Harvard University. The author has contributed to research in topics: Fracture mechanics & Plasticity. The author has an hindex of 129, co-authored 419 publications receiving 74747 citations. Previous affiliations of John W. Hutchinson include Technical University of Denmark & Ohio State University.


Papers
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Book ChapterDOI
TL;DR: In this article, the authors describe the mixed mode cracking in layered materials and elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness, showing that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip.
Abstract: Publisher Summary This chapter describes the mixed mode cracking in layered materials. There is ample experimental evidence that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip. An unloaded crack subsequently subject to a combination of modes I and II will initiate growth by kinking in such a direction that the advancing tip is in mode I. The chapter also elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness. The competition between crack advance within the interface and kinking out of the interface depends on the relative toughness of the interface to that of the adjoining material. The interface stress intensity factors play precisely the same role as their counterparts in elastic fracture mechanics for homogeneous, isotropic solids. When an interface between a bimaterial system is actually a very thin layer of a third phase, the details of the cracking morphology in the thin interface layer can also play a role in determining the mixed mode toughness. The elasticity solutions for cracks in multilayers are also elaborated.

3,828 citations

Journal ArticleDOI
TL;DR: In this paper, a deformation theory of plasticity is introduced to represent in a phenomenological manner the relative roles of strain hardening and strain gradient hardening, which is a non-linear generalization of Cosserat couple stress theory.
Abstract: Dislocation theory is used to invoke a strain gradient theory of rate independent plasticity. Hardening is assumed to result from the accumulation of both randomly stored and geometrically necessary dislocation. The density of the geometrically necessary dislocations scales with the gradient of plastic strain. A deformation theory of plasticity is introduced to represent in a phenomenological manner the relative roles of strain hardening and strain gradient hardening. The theory is a non-linear generalization of Cosserat couple stress theory. Tension and torsion experiments on thin copper wires confirm the presence of strain gradient hardening. The experiments are interpreted in the light of the new theory.

3,266 citations

Journal ArticleDOI
TL;DR: In this paper, a total deformation theory of plasticity, in conjunction with two hardening stress-strain relations, is used to determine the dominant singularity at the tip of a crack in a tension field.
Abstract: D istributions of stress occurring at the tip of a crack in a tension field are presented for both plane stress and plane strain. A total deformation theory of plasticity, in conjunction with two hardening stress-strain relations, is used. For applied stress sufficiently low such that the plastic zone is very small relative to the crack length, the dominant singularity can be completely determined with the aid of a path-independent line integral recently given by rice (1967). The amplitude of the tensile stress singularity ahead of the crack is found to be larger in plane strain than in plane stress.

2,667 citations

Book
01 Jan 2000
TL;DR: In this paper, the authors present a model for making metal foams characterisation methods and properties of metal foam, and a constitutive model for metal foam design for Creep with Metal Foams Sandwich Structures Energy Management: Packaging and Blast Protection Sound Absorption and Vibration Suppression Thermal Management and Heat Transfer Electrical Properties of metal Foams Cutting, Finishing and Joining Cost Estimation and Viability Case Studies Suppliers of Metal Foam Web Sites Index
Abstract: Introduction Making Metal Foams Characterization Methods Properties of Metal Foams Design Analysis for Material Selection Design Formulae for Simple Structures A Constitutive Model for Metal Foams Design for Creep with Metal Foams Sandwich Structures Energy Management: Packaging and Blast Protection Sound Absorption and Vibration Suppression Thermal Management and Heat Transfer Electrical Properties of Metal Foams Cutting, Finishing and Joining Cost Estimation and Viability Case Studies Suppliers of Metal Foams Web Sites Index .

2,527 citations

Journal ArticleDOI
14 May 1998-Nature
TL;DR: In this paper, the authors describe the appearance of complex, ordered structures induced by the buckling of thin metal films owing to thermal contraction of an underlying substrate, and account qualitatively for the size and form of the patterned features in terms of the nonuniform stresses developed in the film near steps on the polymer substrate.
Abstract: Spontaneous generation of complex order in apparently simple systems is both arresting and potentially useful1,2,3,4,5,6,7,8,9,10,11. Here we describe the appearance of complex, ordered structures induced by the buckling of thin metal films owing to thermal contraction of an underlying substrate. We deposit the films from the vapour phase on a thermally expanded polymer (polydimethylsiloxane, PDMS). Subsequent cooling of the polymer creates compressive stress in the metal film that is relieved by buckling with a uniform wavelength of 20–50 micrometres. The waves can be controlled and orientated by relief structures in the surface of the polymer, which can set up intricate, ordered patterns over large areas. We can account qualitatively for the size and form of the patterned features in terms of the non-uniform stresses developed in the film near steps on the polymer substrate. This patterning process may find applications in optical devices such as diffraction gratings and optical sensors, and as the basis for methods of strain analysis in materials.

2,158 citations


Cited by
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28 Jul 2005
TL;DR: PfPMP1)与感染红细胞、树突状组胞以及胎盘的单个或多个受体作用,在黏附及免疫逃避中起关键的作�ly.
Abstract: 抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1(PfPMP1)与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用,在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员,通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

18,940 citations

Journal ArticleDOI
TL;DR: A comprehensive review of the main 3D printing methods, materials and their development in trending applications was carried out in this paper, where the revolutionary applications of AM in biomedical, aerospace, buildings and protective structures were discussed.
Abstract: Freedom of design, mass customisation, waste minimisation and the ability to manufacture complex structures, as well as fast prototyping, are the main benefits of additive manufacturing (AM) or 3D printing. A comprehensive review of the main 3D printing methods, materials and their development in trending applications was carried out. In particular, the revolutionary applications of AM in biomedical, aerospace, buildings and protective structures were discussed. The current state of materials development, including metal alloys, polymer composites, ceramics and concrete, was presented. In addition, this paper discussed the main processing challenges with void formation, anisotropic behaviour, the limitation of computer design and layer-by-layer appearance. Overall, this paper gives an overview of 3D printing, including a survey on its benefits and drawbacks as a benchmark for future research and development.

4,159 citations

Journal ArticleDOI
26 Mar 2010-Science
TL;DR: Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated with elastomeric substrates, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments, and applications in systems ranging from electronic eyeball cameras to deformable light-emitting displays are described.
Abstract: Recent advances in mechanics and materials provide routes to integrated circuits that can offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent, and deformed into arbitrary shapes. Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated with elastomeric substrates, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments. Here, we review these strategies and describe applications of them in systems ranging from electronic eyeball cameras to deformable light-emitting displays. We conclude with some perspectives on routes to commercialization, new device opportunities, and remaining challenges for research.

4,127 citations

Book ChapterDOI
TL;DR: In this article, the authors describe the mixed mode cracking in layered materials and elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness, showing that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip.
Abstract: Publisher Summary This chapter describes the mixed mode cracking in layered materials. There is ample experimental evidence that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip. An unloaded crack subsequently subject to a combination of modes I and II will initiate growth by kinking in such a direction that the advancing tip is in mode I. The chapter also elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness. The competition between crack advance within the interface and kinking out of the interface depends on the relative toughness of the interface to that of the adjoining material. The interface stress intensity factors play precisely the same role as their counterparts in elastic fracture mechanics for homogeneous, isotropic solids. When an interface between a bimaterial system is actually a very thin layer of a third phase, the details of the cracking morphology in the thin interface layer can also play a role in determining the mixed mode toughness. The elasticity solutions for cracks in multilayers are also elaborated.

3,828 citations