Jozef Petrus Henricus Benschop

Bio: Jozef Petrus Henricus Benschop is an academic researcher from ASML Holding. The author has contributed to research in topics: Substrate (printing) & Extreme ultraviolet lithography. The author has an hindex of 10, co-authored 23 publications receiving 350 citations. Previous affiliations of Jozef Petrus Henricus Benschop include MESA+ Institute for Nanotechnology.

Lithographic apparatus, programmable patterning device and lithographic method

Abstract: In an embodiment, a lithographic apparatus is disclosed that includes a modulator configured to expose an exposure area of the substrate to a plurality of beams modulated according to a desired pattern and a projection system configured to project the modulated beams onto the substrate. The modulator may be moveable with respect the exposure area and/or the projection system may have an array of lenses to receive the plurality of beams, the array of lenses moveable with respect to the exposure area.

Dual stage lithographic apparatus and device manufacturing method

Abstract: The invention relates to a dual stage lithographic apparatus, wherein two substrate stages are constructed and arranged for mutual cooperation in order to perform a joint scan movement. The joint scan movement brings the lithographic apparatus from a first configuration, wherein immersion liquid is confined between a first substrate held by the first stage of the stages and a projection system of the apparatus, to a second configuration, wherein the immersion liquid is confined between a second substrate held by the second stage of the two stages and the projection system, such that during the joint scan movement the liquid is essentially confined within the space with respect to the projection system.

Level sensor arrangement for lithographic apparatus and device manufacturing method

Abstract: A level sensor arrangement is useable for measuring a height of a surface of a substrate in a lithographic apparatus. The level sensor arrangement is provided with a light source emitting detection radiation towards the substrate, and a detector unit for measuring radiation reflected from the substrate in operation. The light source is arranged to emit detection radiation in a wavelength range in which a resist to be used for processing the substrate in the lithographic apparatus is sensitive.

Blister formation in Mo/Si multilayered structures induced by hydrogen ions

Abstract: We report on blister formation in nanometer thick Mo/Si multilayer structures due to exposure to hydrogen ion fluxes The influence of hydrogen flux and ion energy for blister formation have been measured and compared to a blister model The blister number density increases significantly around 100 eV when increasing the ion energy from 50 to 200 eV This stepwise behavior could be explained by the fact that for energies >100 eV hydrogen ions could directly penetrate to the depth where delamination takes place From the blister model also the blisters internal pressure and surface energy was calculated to be around 100–800 MPa and respectively

Principles of Lithography

Abstract: Lithography is a field in which advances proceed at a swift pace. This book was written to address several needs, and the revisions for the second edition were made with those original objectives in mind. Many new topics have been included in this text commensurate with the progress that has taken place during the past few years, and several subjects are discussed in more detail. This book is intended to serve as an introduction to the science of microlithography for people who are unfamiliar with the subject. Topics directly related to the tools used to manufacture integrated circuits are addressed in depth, including such topics as overlay, the stages of exposure, tools, and light sources. This text also contains numerous references for students who want to investigate particular topics in more detail, and they provide the experienced lithographer with lists of references by topic as well. It is expected that the reader of this book will have a foundation in basic physics and chemistry. No topics will require knowledge of mathematics beyond elementary calculus.

Lithographic apparatus, and device manufacturing method

Abstract: A lithographic apparatus configured to project a patterned beam of radiation onto a target portion of a substrate is disclosed. The apparatus includes a first radiation dose detector and a second radiation dose detector, each detector comprising a secondary electron emission surface configured to receive a radiation flux and to emit secondary electrons due to the receipt of the radiation flux, the first radiation dose detector located upstream with respect to the second radiation dose detector viewed with respect to a direction of radiation transmission, and a meter, connected to each detector, to detect a current or voltage resulting from the secondary electron emission from the respective electron emission surface.

Guided self-assembly of block copolymer films on interferometrically nanopatterned substrates

Abstract: Copolymer structures are formed by exposing a substrate with an imaging layer thereon to two or more beams of selected wavelengths to form interference patterns at the imaging layer to change the wettability of the imaging layer in accordance with the interference patterns. A layer of a selected block copolymer is deposited onto the exposed imaging layer and annealed to separate the components of the copolymer in accordance with the pattern of wettability and to replicate the pattern of the imaging layer in the copolymer layer. Stripes or isolated regions of the separated components may be formed with periodic dimensions in the range of 100 nm or less.

Exposure apparatus, exposure method and device manufacturing method

Abstract: An exposure apparatus (EX) fills an optical path space of an exposure light (EL) with a liquid (LQ), and exposes a substrate (P) by irradiating the substrate (P) with the exposure light (EL) through a projection optical system (PL) and the liquid (LQ). A first optical element (LS1) of the projection optical system (PL) is provided with a recessed surface part (2) which is brought into contact with the liquid (LQ). The exposure apparatus (EX) is provided with a removing apparatus (40) for removing foreign materials on the inner side the recessed surface part (2). Immersion exposure is performed by permitting the exposure light to excellently reach an image plane through the projection optical system and the liquid.

Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method

Abstract: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.