J
Judy H. Huang
Researcher at Applied Materials
Publications - 48
Citations - 1837
Judy H. Huang is an academic researcher from Applied Materials. The author has contributed to research in topics: Layer (electronics) & Anti-reflective coating. The author has an hindex of 20, co-authored 48 publications receiving 1836 citations.
Papers
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Patent
Integrated low k dielectrics and etch stops
Claes H. Bjorkman,Yu Melissa Min,Hongquing Shan,David Cheung,Wai-Fan Yau,Kuo-Wei Liu,Nasreen Gazala Chopra,Gerald Zheyao Yin,Farhad Moghadam,Judy H. Huang,Dennis J. Yost,Betty Tang,Yunsang Kim +12 more
TL;DR: In this paper, a method of depositing and etching dielectric layers has been proposed for the formation of horizontal interconnects by varying the concentration of a carbon:oxygen gas such as carbon monoxide.
Patent
Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers
TL;DR: In this paper, the authors proposed a method for improved adhesion and oxidation resistance of carbon-containing layers without the need for an additional deposited layer, which can be used in a variety of layers such as barrier layers, etch stops, ARCs, passivation layers, and dielectric layers.
Patent
Method and apparatus for depositing a planarized passivation layer
TL;DR: In this paper, a planarized passivation layer is described, which includes a fluorosilicate glass (FSG) layer and a silicon nitride layer, and the FSG layer is preferably deposited using triethoxyfluorosilane (TEFS) and tetraethoxyorthosilicates (TEOS).
Patent
Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
TL;DR: In this article, the authors present an apparatus for converting PFC gases exhausted from semiconductor processing equipment to less harmful, non-PFC gases using a silicon filter and a plasma generation system.
Patent
Gas distribution for CVD systems
TL;DR: A gas distribution faceplate includes a plurality of gas distribution holes formed therethrough, wherein the holes of at least a first set of the plurality of holes pass through the faceplate at angles other than perpendicular to the surface of substrate as mentioned in this paper.