Transparent electronics is today one of the most advanced topics for a wide range of device applications. The key components are wide bandgap semiconductors, where oxides of different origins play an important role, not only as passive component but also as active component, similar to what is observed in conventional semiconductors like silicon. Transparent electronics has gained special attention during the last few years and is today established as one of the most promising technologies for leading the next generation of flat panel display due to its excellent electronic performance. In this paper the recent progress in n- and p-type oxide based thin-film transistors (TFT) is reviewed, with special emphasis on solution-processed and p-type, and the major milestones already achieved with this emerging and very promising technology are summarizeed. After a short introduction where the main advantages of these semiconductors are presented, as well as the industry expectations, the beautiful history of TFTs is revisited, including the main landmarks in the last 80 years, finishing by referring to some papers that have played an important role in shaping transparent electronics. Then, an overview is presented of state of the art n-type TFTs processed by physical vapour deposition methods, and finally one of the most exciting, promising, and low cost but powerful technologies is discussed: solution-processed oxide TFTs. Moreover, a more detailed focus analysis will be given concerning p-type oxide TFTs, mainly centred on two of the most promising semiconductor candidates: copper oxide and tin oxide. The most recent data related to the production of complementary metal oxide semiconductor (CMOS) devices based on n- and p-type oxide TFT is also be presented. The last topic of this review is devoted to some emerging applications, finalizing with the main conclusions. Related work that originated at CENIMAT|I3N during the last six years is included in more detail, which has led to the fabrication of high performance n- and p-type oxide transistors as well as the fabrication of CMOS devices with and on paper.

Oxide Semiconductor Thin‐Film Transistors: A Review of Recent Advances

Steep subthreshold swing transistors based on interband tunneling are examined toward extending the performance of electronics systems. In particular, this review introduces and summarizes progress in the development of the tunnel field-effect transistors (TFETs) including its origin, current experimental and theoretical performance relative to the metal-oxide-semiconductor field-effect transistor (MOSFET), basic current-transport theory, design tradeoffs, and fundamental challenges. The promise of the TFET is in its ability to provide higher drive current than the MOSFET as supply voltages approach 0.1 V.

/pdf/low-voltage-tunnel-transistors-for-beyond-cmos-logic-3w5c8knrc5.pdf

Low-Voltage Tunnel Transistors for Beyond CMOS Logic

Biosensors based on field-effect transistors (FETs) have attracted much attention, as they offer rapid, inexpensive, and label-free detection. While the low sensitivity of FET biosensors based on bulk 3D structures has been overcome by using 1D structures (nanotubes/nanowires), the latter face severe fabrication challenges, impairing their practical applications. In this paper, we introduce and demonstrate FET biosensors based on molybdenum disulfide (MoS2), which provides extremely high sensitivity and at the same time offers easy patternability and device fabrication, due to its 2D atomically layered structure. A MoS2-based pH sensor achieving sensitivity as high as 713 for a pH change by 1 unit along with efficient operation over a wide pH range (3–9) is demonstrated. Ultrasensitive and specific protein sensing is also achieved with a sensitivity of 196 even at 100 femtomolar concentration. While graphene is also a 2D material, we show here that it cannot compete with a MoS2-based FET biosensor, which ...

MoS2 Field-Effect Transistor for Next-Generation Label-Free Biosensors

A review of recent MOSFET threshold voltage extraction methods

With the advent of devices based on single crystals, the performance of organic field-effect transistors has experienced a significant leap, with mobility now in excess of 10 cm2 V−1 s−1. The purpose of this review is to give an overview of the state-of-the-art of these high-performance organic transistors. The paper focuses on the problem of parameter extraction, limitations of the performance by the interfaces, which include the dielectric–semiconductor interface, and the injection and retrieval of charge carriers at the source and drain electrodes. High-performance devices also constitute tools of choice for investigating charge transport phenomena in organic materials. It is shown how the combination of field-effect measurements with other electrical characterizations helps in elucidating this still unresolved issue.

High-Performance Organic Field-Effect Transistors

Revisiting MOSFET threshold voltage extraction methods

Electrostatic discharge (ESD) is an event that sends current through an integrated circuit (IC). This paper reviews the impact of ESD on the IC industry and details the four stages of an ESD event: (1) charge generation, (2) charge transfer, (3) device response, and (4) device failure. Topics reviewed are charge generation mechanisms, models for ESD charge transfer, electrical conduction mechanisms, and device damage mechanisms leading to circuit failure.

Electrostatic discharge in semiconductor devices: an overview

Preface. Background on Microwave Transistors. Basic Semiconductor Physics. Heterostructure Physics. MESFETs. High Electron Mobility Transistors. MOSFETs. Silicon Bipolar Junction Transistors. Heterojunction Bipolar Transistors. Appendix A.1: Frequently Used Symbols. Appendix A.2: Physical Constants and Unit Conversions. Appendix A.3: Microwave Frequency Bands. Appendix A.4: Two-Port Calculations. Appendix A.5: Important Material Properties of Selected Materials. Index.

Modern Microwave Transistors: Theory, Design, and Performance

In this paper, we review the compact-modeling framework for undoped double-gate (DG) silicon-on-insulator (SOI) MOSFETs. The use of multiple gates has emerged as a new technology to possibly replace the conventional planar MOSFET when its feature size is scaled to the sub-50-nm regime. MOSFET technology has been the choice for mainstream digital circuits for very large scale integration as well as for other high-frequency applications in the low-gigahertz range. But the continuing scaling of MOSFET presents many challenges, and multiple-gate, particularly DG, SOI devices seem to be attractive alternatives as they can effectively reduce the short-channel effects and yield higher current drive. Core compact models, including the analysis for surface potential and drain-current, for both the symmetric and asymmetric DG SOI MOSFETs, are discussed and compared. Numerical simulations are also included in order to assess the validity of the models reviewed

Juin J. Liou

Papers

A review of recent MOSFET threshold voltage extraction methods

Revisiting MOSFET threshold voltage extraction methods

Electrostatic discharge in semiconductor devices: an overview

Modern Microwave Transistors: Theory, Design, and Performance

A Review of Core Compact Models for Undoped Double-Gate SOI MOSFETs