Showing papers by "Jun Fan published in 2005"
03 Oct 2005
TL;DR: In this paper, a small cut out of the board corresponding to the BGA footprint is modelled with a 3D full wave simulation tool and the equivalent impedance network representation corresponding to this cut out is combined, by means of the segmentation method, with larger pieces of a board, whose network representations can be extracted from the closed form expression of the cavity model approach.
Abstract: The engineering of the power delivery network is becoming a fundamental issue in the design of high speed digital systems on PCB's. In fact, providing the required power to the different IC's at the specified noise-free voltage levels allows a correct functioning of the overall PCB systems. More over, the ongoing trend of replacing active devices with peripherally located I/O and PWR/GND pins with areally located I/O and PWR/GND pins (BGA packaged) increases the complexity of the models, when power delivery issues need to be studied in a larger contest, such as the overall PCB's. The employment of the powerful, but simple, concept of the segmentation method allows investigation of the power delivery network of the PCB systems in two fundamental stages. During the first stage, a small cut out of the board corresponding to the BGA footprint is modelled with a 3D full wave simulation tool. During the second stage the equivalent impedance network representation corresponding to this cut out is combined, by means of the segmentation method, with larger pieces of a board, whose network representations can be extracted from the closed form expression of the cavity model approach
14 citations
27 Dec 2005
TL;DR: In this article, the power distribution networks (PDN) analysis of multi-layer printed circuit boards is carried out in SPICE based tools with the advantage of being faster than the corresponding full-wave modeling and allowing obtaining both frequency and time domain results.
Abstract: The modeling and the analysis of the power distribution networks (PDN) within multi-layer printed circuit board is crucial for the investigation of the performance of PCB systems. Carrying out such analyses in SPICE based tools has the advantage of being faster than the corresponding full-wave modeling and it allows obtaining both frequency and time domain results.
3 citations
27 Dec 2005
TL;DR: In this paper, a plated through-hole (PTH) via transmission-line model was used in the design of a thick printed circuit board, such as a backpanel.
Abstract: This paper introduces an approach of using a plated through-hole (PTH) via transmission-line model in the design of a thick printed circuit board, such as a backpanel. Full wave FEM modeling of a section of backpanel containing a differential via pair was compared with a transmission model. Computed values of the differential transmission loss agreed within an acceptable range for engineering studies, yet the transmission line model results required less than 2% of the computation time that the full wave model required. Effects of via spacing, via diameter and trace thickness were also examined.
2 citations