J
Jun Fan
Researcher at Missouri University of Science and Technology
Publications - 505
Citations - 7033
Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Printed circuit board & Equivalent circuit. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.
Papers
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Proceedings ArticleDOI
Radio frequency interference estimation using transfer function based dipole moment model
TL;DR: A transfer function based dipole moment model is proposed that only needs one-time full wave simulation and can be reused for other cases if the same antenna structure is used.
Journal ArticleDOI
Coaxial cable Bragg grating assisted microwave coupler
TL;DR: A microwave coupler based on two parallel coaxial cable Bragg gratings fabricated by drilling U-grooves across the cables at periodic distance along the cable direction that can be precisely controlled by varying the grating period and length.
Journal ArticleDOI
Coupling Analysis for Wires in a Cable Tray Using Circuit Extraction Based on Mixed-Potential Integral Equation Formulation
TL;DR: In this article, a lumped circuit model was built using admittance blocks extracted from a mixedpotential integral equation (MPIE) formulation to simplify coupling analysis for cables going through a cable tray.
Proceedings ArticleDOI
Differential vias transition modeling in a multilayer printed circuit board
Matteo Cocchini,Wheling Cheng,Jianmin Zhang,J. Fisher,Jun Fan,James L. Drewniak,Yaojiang Zhang +6 more
TL;DR: In this article, a 26-layer printed circuit board including several test sites has been analyzed and a physics-based circuit model has been assembled in a spice-based simulation tool.
Proceedings ArticleDOI
Power integrity investigation of BGA footprints by means of the segmentation method
Giuseppe Selli,James L. Drewniak,R.F. Dubroff,Jun Fan,James L. Knighten,N.W. Smith,D. McCoy,Bruce Archambeault +7 more
TL;DR: In this paper, a small cut out of the board corresponding to the BGA footprint is modelled with a 3D full wave simulation tool and the equivalent impedance network representation corresponding to this cut out is combined, by means of the segmentation method, with larger pieces of a board, whose network representations can be extracted from the closed form expression of the cavity model approach.