scispace - formally typeset
Search or ask a question
Author

Jun Fan

Bio: Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Equivalent circuit & Printed circuit board. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.


Papers
More filters
Proceedings ArticleDOI
17 Nov 2009
TL;DR: In this paper, a method to calculate equivalent inductances of multiple vias in arrays has been proposed, which has been applied to the modeling of a hierarchical power bus and validated by measurements.
Abstract: A method to calculate equivalent inductances of multiple vias in arrays has been proposed. The method has been applied to the modeling of a hierarchical power bus and validated by measurements. It is accurate at the frequencies lower than the cavity resonant frequencies.

10 citations

Journal ArticleDOI
TL;DR: This paper proposes a generalized multiple-scattering (GMS) method to evaluate the current distribution on a cable harness with ground connections to a nearby metal surface to compensate the mutual interactions between the cable harness and the rest of the structure.
Abstract: This paper proposes a generalized multiple-scattering (GMS) method to evaluate the current distribution on a cable harness with ground connections to a nearby metal surface. The GMS method is a hybrid method combining the transmission line theory and the method of moments. The GMS method uses the generalized multiconductor transmission line (GMTL) solver for the cable harness part and the mixed-potential integral equation (MPIE) solver for the rest of the structure including the metal surface and the grounding wires. Neither the GMTL nor the MPIE solver alone takes into account the mutual interactions between the cable harness and the rest of the structure. Therefore, an iterative scheme is arranged in the GMS method to compensate the above-mentioned interactions. These interactions occur via not only field couplings, but also current conducting through the grounding points on the cable harness. A numerical test case is provided to benchmark the proposed GMS method.

10 citations

Proceedings ArticleDOI
21 Nov 2013
TL;DR: The detailed modeling of the BGA solder ball transition is discussed to enable the model concatenation method suitable to be used for system level channel prediction.
Abstract: High performance ASIC packages are typically mounted on the PCB using BGA solder ball technology; ASIC package to board BGA transition creates impedance discontinuity in the multi-gigabit signaling channel. It is important to understand and model this discontinuity accurately to improve end to end channel design in system level. Usually when the channel is simulated, instead of modeling the package with the PCB together in one model, also known as one piece model, separate models are built for package and PCB and the individual models are then cascaded using the circuit simulator. If the models are not setup correctly in the field solvers, i.e. port definition, it may not capture the transition behavior correctly and hence makes the cascaded channel model results differ from one piece model and/or real channel measurement. This paper discusses the detailed modeling of the BGA solder ball transition to enable the model concatenation method suitable to be used for system level channel prediction. The package only model, board only model and one piece model were simulated upto 20GHz using either lump port or wave port setup in ANSYS HFSS field solver. The cascaded model with wave port connection and one piece model are found well matched. The lump-port connection can introduce extra parasitic inductance at the BGA connection point and hence is not recommended. Hardware (package and PCB test samples) have been built to characterize this transition behavior for model to hardware correlation. The FSA (Feature Selected Validation) method is used to quantify the correlation results, both insertion loss and return loss are compared to gain confidence on the simulation results and high-speed channel prediction.

9 citations

Proceedings ArticleDOI
12 Nov 2012
TL;DR: In this article, a fast method to calculate the admittance matrix of Through Silicon Vias (TSVs) is proposed, which is validated with a full-wave 2D cross-sectional analysis tool for a typical TSV pair structure.
Abstract: A fast method to calculate the admittance matrix of Through Silicon Vias (TSVs) is proposed in this paper. The silicon dioxide layers are equivalently modelled using the bound charge on the conductor surfaces as well as on the dielectric interface between the silicon dioxide and the silicon regions. Unknown surface densities of both the free and bound charge are expanded using the axial harmonics. Galerkin's method is then applied to obtain the capacitance and conductance matrices. The proposed method is validated with a full-wave 2D cross-sectional analysis tool for a typical TSV pair structure. Comparisons with popular closed-form expressions are also discussed.

9 citations

Proceedings ArticleDOI
01 Jul 2020
TL;DR: The first time to propose the best practices and robustness-enhancement techniques for EUL crosstalk characterization and an error detection method to check for causality, passivity and reciprocity is demonstrated.
Abstract: Extend Unterminated Line (EUL) structure allows crosstalk measurements with perfect termination and halves the number of test ports required by the traditional method. Therefore, EUL is a time-efficient and convenient structure for a test vehicle design of high-speed interconnects. In this paper, the potential errors in the EUL measurement are analyzed. In addition, an error detection method to check for causality, passivity and reciprocity is demonstrated. It is the first time to propose the best practices and robustness-enhancement techniques for EUL crosstalk characterization.

9 citations


Cited by
More filters
Journal ArticleDOI

[...]

08 Dec 2001-BMJ
TL;DR: There is, I think, something ethereal about i —the square root of minus one, which seems an odd beast at that time—an intruder hovering on the edge of reality.
Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

33,785 citations

01 Jan 2016

733 citations

Journal ArticleDOI
TL;DR: In this paper, the authors proposed a wideband ultra wideband (UWB) communication protocol with a low EIRP level (−41.3dBm/MHz) for unlicensed operation between 3.1 and 10.6 GHz.
Abstract: Before the emergence of ultra-wideband (UWB) radios, widely used wireless communications were based on sinusoidal carriers, and impulse technologies were employed only in specific applications (e.g. radar). In 2002, the Federal Communication Commission (FCC) allowed unlicensed operation between 3.1–10.6 GHz for UWB communication, using a wideband signal format with a low EIRP level (−41.3dBm/MHz). UWB communication systems then emerged as an alternative to narrowband systems and significant effort in this area has been invested at the regulatory, commercial, and research levels.

452 citations