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Jun Fan

Researcher at Missouri University of Science and Technology

Publications -  505
Citations -  7033

Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Printed circuit board & Equivalent circuit. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.

Papers
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Proceedings ArticleDOI

A time domain approach to estimate current draw from SMT decoupling capacitors

TL;DR: In this paper, a time domain approach to investigate and predict impedances and scattering parameters of a DC power bus is proposed based on a cavity model and is achieved using a circuit simulation tool -SPICE.
Proceedings ArticleDOI

Predictive Modeling of the Effects of Skew and Imbalance on Radiated EMI from Cables

TL;DR: In this paper, the effects of skew and imbalance on radiated emission of cables inside a commercial 19-inch rack-based cabinet are predicted using a four-port vector network analyzer.
Proceedings ArticleDOI

Estimation of crosstalk among multiple stripline traces crossing a split by compressed sensing

TL;DR: In this article, an empirical model based on the compressed sensing technique is developed to characterize the crosstalk among traces as a function of geometric parameters, and a good agreement between the empirical model and full-wave simulations is observed for various test examples, with an exceptionally small number of samples.
Journal ArticleDOI

Compact Intermodulation Modulator for Phase Reference in Passive Intermodulation Measurements

TL;DR: The work proves a solution to generate an IM phase and magnitude tunable reference for IM measurement, which also proves that IM can be used to carry some information.
Proceedings ArticleDOI

The Simulated TDR Impedance In PCB Material Characterization

TL;DR: In this article, a step-by-step investigation is performed and demonstrated to disclose the root causes of the TDR impedance discrepancy, which is contributed by multiple factors which need to be taken into consideration during material characterization.