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Author

Jun Fan

Bio: Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Equivalent circuit & Printed circuit board. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.


Papers
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Proceedings ArticleDOI
12 Apr 2010
TL;DR: In this paper, the physics associated with mutual inductance between vias has been analyzed, and a method has been proposed to calculate the total equivalent inductance including the effect of mutual induction, which is further simplified to an expression in a closed-form.
Abstract: The physics associated with mutual inductance between vias has been analyzed, and a method has been proposed to calculate the total equivalent inductance including the effect of mutual inductance The method has been further simplified to an expression in a closed-form The equations have also been verified and shown to be accurate by measurements

3 citations

Proceedings Article
12 May 2014
TL;DR: Practical test patterns are designed to calculate the characteristics of Through-Silicon Via pairs in a silicon interposer to provide a guide to design feasible test structures from which true response of a TSV pair can be derived.
Abstract: In this paper, practical test patterns are designed to calculate the characteristics of Through-Silicon Via (TSV) pairs in a silicon interposer. Proposed test patterns include probing pads, traces and TSVs, which are modeled by a combination of impedances and admittances. Performance of the test patterns is obtained from simulation models built in full wave simulation solver. TSV response is then obtained by de-embedding the pad and trace from the test patterns. The TSV response is also verified by analytical TSV characterization and full wave simulation results for only TSV structures. Thus the paper provides a guide to design feasible test structures from which true response of a TSV pair can be derived.

3 citations

Proceedings ArticleDOI
13 Feb 2009
TL;DR: In this article, the Cavity Model (where facing portions of power bus are considered electromagnetic resonant cavities) can be used to study the generation and propagation of noise given a real-world board's layout, one of the primary requirements for the application of this technique is the geometrical identification of all the cavities and their connectivity.
Abstract: The analysis and the design of the Power Delivery Network (PDN) is crucial in the real world of high-speed and high-performance on-board systems In this context, the Cavity Model (where facing portions of power bus are considered electromagnetic resonant cavities) can be used to study the generation and propagation of noise Given a real-world board's layout, one of the primary requirements for the application of this technique is the geometrical identification of all the cavities and their connectivity This paper is focused on the fully automatic generation of this geometrical dataset as part of an integrated tool for the analysis and design of PDN

3 citations

Proceedings ArticleDOI
22 Jul 2019
TL;DR: A workflow for simulating one case of EMI radiation from a 208 MHz single-ended I/O clock generated from the System-on-Chip (SoC) in an electronic device and mitigation techniques are proposed to reduce the EMI to acceptable levels.
Abstract: Unintended Electromagnetic interference (EMI) is a common occurrence in all consumer electronics, which can often fail compliance margins of FCC and/or CE, when best practices of grounding, shielding and overall system integration are not followed. The measurement of EMI for regulatory compliance has been studied extensively and there are standard test labs which certifies for EMI. However, predicting the EMI radiation from a consumer electronic device through simulation is very challenging due to the complexities involved in modeling the device and noise source. This paper introduces a workflow for simulating one case of EMI radiation from a 208 MHz single-ended I/O clock generated from the System-on-Chip (SoC) in an electronic device. Through a full wave 3D solver, the radiated far field transfer function of the clock is obtained. Additionally, the spectral content of clock is measured in both time and frequency domain. Then the clock spectrum is combined with transfer function to predict EMI radiation envelope. The simulated results are then compared with the measured results from an FCC compliant laboratory. Based on the simulated and measured results, mitigation techniques are proposed to reduce the EMI to acceptable levels.

3 citations

Patent
08 Dec 2004
TL;DR: In this paper, a circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the second and third power reference planes, and discrete decoupling capacitors are further provided with the assembly.
Abstract: A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.

3 citations


Cited by
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Journal ArticleDOI

[...]

08 Dec 2001-BMJ
TL;DR: There is, I think, something ethereal about i —the square root of minus one, which seems an odd beast at that time—an intruder hovering on the edge of reality.
Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

33,785 citations

01 Jan 2016

733 citations

Journal ArticleDOI
TL;DR: In this paper, the authors proposed a wideband ultra wideband (UWB) communication protocol with a low EIRP level (−41.3dBm/MHz) for unlicensed operation between 3.1 and 10.6 GHz.
Abstract: Before the emergence of ultra-wideband (UWB) radios, widely used wireless communications were based on sinusoidal carriers, and impulse technologies were employed only in specific applications (e.g. radar). In 2002, the Federal Communication Commission (FCC) allowed unlicensed operation between 3.1–10.6 GHz for UWB communication, using a wideband signal format with a low EIRP level (−41.3dBm/MHz). UWB communication systems then emerged as an alternative to narrowband systems and significant effort in this area has been invested at the regulatory, commercial, and research levels.

452 citations