J
Jun Fan
Researcher at Missouri University of Science and Technology
Publications - 505
Citations - 7033
Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Printed circuit board & Equivalent circuit. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.
Papers
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Journal ArticleDOI
An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield
Nozad Karim,Rong Zhou,Jun Fan +2 more
TL;DR: In this paper, an innovative shielding technology with sputtered metal conformal shield is investigated using a specially designed lid to prevent noise emission from a device, but the cost and complexity of the sprayed coating shield prevents it from being used for a wide range of low cost commercial applications.
Journal ArticleDOI
Photocharge-Modulated Passive Intermodulation on Ag₂O/Ag Junction in High-Power Microwave Devices
TL;DR: In this article, the photocharge-modulated passive intermodulation (PIM) effect on the Ag2O/Ag contact junction was studied and a semianalytical model for photo effect-modified contact PIM was demonstrated.
Proceedings ArticleDOI
Aperture modeling using a hybrid method for RFI analysis
Liehui Ren,Zhenwei Yu,Gang Feng,F. de Paulis,Yaojiang Zhang,Jun Fan,Xiaopeng Dong,Jason A. Mix,D. Hua,K. Lattery +9 more
TL;DR: In this article, a hybrid method is proposed for radio frequency interference prediction of a metal enclosure with an aperture on the top wall, where the structure is divided into several segments, and the fields in rectangular segments are described by cavity model, the segments with apertures are modeled by the commercial finite element solver (HFSS).
Journal ArticleDOI
Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer
Qian Wang,Jonghyun Cho,Nicholas Erickson,Chulsoon Hwang,Francesco de Paulis,Stefano Piersanti,Antonio Orlandi,Brice Achkir,Jun Fan +8 more
TL;DR: In this article, a de-embedding methodology is proposed for through silicon via (TSV) characterization by using a set of simple yet efficient test patterns, full wave models are developed and the electrical performance of the test patterns is analyzed thoroughly.
Journal ArticleDOI
Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer With On-Chip Low-Dropout (LDO) Regulator
TL;DR: In this paper, a model of ground bounce induced by a high-speed output buffer with on-chip low-dropout (LDO) regulator was proposed, based on the self-impedance of the off-chip ground network and switching current spectra.