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Author

Jun Fu

Bio: Jun Fu is an academic researcher from Tsinghua University. The author has contributed to research in topics: Heterojunction bipolar transistor. The author has an hindex of 1, co-authored 1 publications receiving 11 citations.

Papers
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Journal ArticleDOI
TL;DR: In this paper, the influence of the pulse width on the thermal burnout effect of a low-noise amplifier (LNA) constructed by a silicon-germanium heterojunction bipolar transistor (SiGe HBT) when it is injected by microwave pulses is investigated.
Abstract: This paper presents the influence of the pulse width on the thermal burnout effect of a low-noise amplifier (LNA) constructed by a silicon–germanium heterojunction bipolar transistor (SiGe HBT) when it is injected by microwave pulses. Based on the characteristics of microwave pulses and the structure of the SiGe HBT, a theoretical model to predict the impact of the pulse width and power on the thermal burnout effect of the LNA is established by solving the heat conduction equation. The derivation of the theoretical model requires the pulse width less than a microsecond level. Using at least two groups of simulated or measured results to fit the coefficients, the proposed theoretical model can predict the other effect of the pulse width, which can greatly reduce the experimental costs and guide the rational selection of the pulse width in numerical simulations. At last, the theoretical model is verified by numerical simulations and experimental measurements. The results show that within the scope of pulse width (less than the microsecond level) the burnout power threshold can be effectively reduced by increasing the pulse width.

13 citations


Cited by
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Journal ArticleDOI
TL;DR: In this article, the thermal burnout effect of a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (PHEMT) low-noise amplifier (LNA) caused by repetitive microwave pulses is studied by theoretical analyses, simulations, and experiments.
Abstract: The thermal burnout effect of a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (PHEMT) low-noise amplifier (LNA) caused by repetitive microwave pulses is studied by theoretical analyses, simulations, and experiments. The theoretical model for thermal burnout under a single microwave pulse injection is first acquired by analyzing the power absorption in the electrical procedure and the heat distribution in the thermal procedure. By adopting two new assumptions and using the linear superposition theorem, the theoretical model for thermal burnout under a repetitive microwave pulse injection is acquired by further extension. Through derivation, the analytical relationship among the thermal burnout power threshold, the pulsewidth in a cycle, the pulse repetition frequency (PRF) and the pulse number is acquired. Because some assumptions and approximations are adopted, both the pulsewidth in a cycle and the total repetitive microwave pulselength must be between 10-ns scale and 1-μs scale. It shows that the theoretical results agree well with the simulation and experimental results. A minimum of two sets of data by experiment or simulation are needed to fit the analytical relationship. Therefore, experimental or simulation costs can be substantially reduced, and a helpful reference for

17 citations

Journal ArticleDOI
TL;DR: The theoretical relationship can be used to predict the thermal burnout power thresholds of PIN diode limiting-amplifying systems under microwave pulse injections with different pulse parameters and can greatly reduce the simulation or experimental costs and could be helpful for the design of a radio frequency receiver.

12 citations

Journal ArticleDOI
TL;DR: In this paper, the authors proposed a new definition of the power absorbed to a nonlinear element when input power to an LNA is very high by high-power electromagnetic pulses, and suggested designs to reduce the damage rate.
Abstract: To protect the RF front end from electronic warfare, many studies have focused on damage phenomena of the low-noise amplifiers (LNAs). Existing studies have focused on the damage points of semiconductor devices because the peripheral circuit elements of LNAs are less susceptible to breakdown than nonlinear elements. However, their theoretical analysis is insufficient to explain the damage mechanism of LNAs under conditions such as changes in input power, frequency, and design parameters. To analyze the relationship between damage rate and parameters of the peripheral circuit of an LNA, this paper proposes a new definition of the power absorbed to a nonlinear element when input power to an LNA is very high by high-power electromagnetic pulses. In addition, LNAs having different input impedances and output impedances are designed to verify the power absorption. From the results, this paper identified parameters that increase the damage rate of LNAs, and suggested designs to reduce the damage rate.

11 citations

Journal ArticleDOI
TL;DR: The system-level study results obtained in this paper will be helpful for the design of the radio frequency receivers and are in good agreement with the numerical simulation results obtained by the self-designed device–circuit joint simulator.

11 citations

Journal ArticleDOI
TL;DR: The results show that the proposed analytical relationship is suitable to estimate the thermal burnout power threshold for a given microwave pulses width within the limit of microwave pulse width range.

5 citations