Jun Ho Lee

Bio: Jun Ho Lee is an academic researcher from Samsung Medical Center. The author has contributed to research in topics: Medicine & Cancer. The author has an hindex of 38, co-authored 242 publications receiving 5437 citations. Previous affiliations of Jun Ho Lee include The Breast Cancer Research Foundation & National Cancer Research Institute.

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Abstract: We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic RLGC equations derived from the physical configuration. Each analytic equation is proposed as a function of design parameters of the TSV, bump, and RDL, and is therefore, scalable. The scalability of the proposed model is verified by simulation from the 3-D field solver with parameter variations, such as TSV diameter, pitch between TSVs, and TSV height. The proposed model is experimentally validated through measurements up to 20 GHz with fabricated test vehicles of a TSV channel, which includes TSVs, bumps, and RDLs. Based on the proposed scalable model, we analyze the electrical behaviors of a TSV channel with design parameter variations in the frequency domain. According to the frequency-domain analysis, the capacitive effect of a TSV is dominant under 2 GHz. On the other hand, as frequency increases over 2 GHz, the inductive effect from the RDLs becomes significant. The frequency dependent loss of a TSV channel, which is capacitive and resistive, is also analyzed in the time domain by eye-diagram measurements. Due to the frequency dependent loss, the voltage and timing margins decrease as the data rate increases.

Phase III Trial to Compare Adjuvant Chemotherapy With Capecitabine and Cisplatin Versus Concurrent Chemoradiotherapy in Gastric Cancer: Final Report of the Adjuvant Chemoradiotherapy in Stomach Tumors Trial, Including Survival and Subset Analyses

Abstract: Purpose The Adjuvant Chemoradiotherapy in Stomach Tumors (ARTIST) trial tested whether the addition of radiotherapy to adjuvant chemotherapy improved disease-free survival (DFS) in patients with D2-resected gastric cancer (GC).

Epigenetic silencing of the intronic microRNA hsa-miR-342 and its host gene EVL in colorectal cancer.

Abstract: MicroRNAs are small, non-coding RNAs that influence gene regulatory networks by post-transcriptional regulation of specific messenger RNA targets. MicroRNA expression is dysregulated in human malignancies, frequently leading to loss of expression of certain microRNAs. We report that expression of hsa-miR-342, a microRNA encoded in an intron of the gene EVL, is commonly suppressed in human colorectal cancer. The expression of hsa-miR-342 is coordinated with that of EVL and our results indicate that the mechanism of silencing is CpG island methylation upstream of EVL. We found methylation at the EVL/hsa-miR-342 locus in 86% of colorectal adenocarcinomas and in 67% of adenomas, indicating that it is an early event in colorectal carcinogenesis. In addition, we observed a higher frequency of methylation (56%) in histologically normal colorectal mucosa from individuals with concurrent cancer compared to mucosa from individuals without colorectal cancer (12%), suggesting the existence of a 'field defect' involving methylated EVL/hsa-miR-342. Furthermore, reconstitution of hsa-miR-342 in the colorectal cancer cell line HT-29 induced apoptosis, suggesting that this microRNA could function as a proapoptotic tumor suppressor. In aggregate, these results support a novel mechanism for silencing intronic microRNAs in cancer by epigenetic alterations of cognate host genes.

Ultra-high strength WNbMoTaV high-entropy alloys with fine grain structure fabricated by powder metallurgical process

Abstract: An equi-atomic WNbMoTaV high entropy alloy (HEA) with a single body-centered cubic structure (BCC) was firstly fabricated by the powder metallurgical process of mechanical alloying (MA) and spark plasma sintering (SPS). Mechanical alloying behavior, microstructure and mechanical properties of the WNbMoTaV HEA were studied systematically. During MA, a single BCC phase was formed and the average particle size and crystallite size was refined to 1.83 µm and 66.1 nm, respectively, after 6 h of MA. Afterward, the as-milled powders were subsequently sintered in the temperature range of 1500–1700 °C. The microstructure of the sintered sample exhibits a few micrometer-scale grain size and a homogeneous BCC matrix with a small amount of oxide inclusion originated from oxidation during the powder metallurgical process. The bulk sample of the WNbMoTaV HEA sintered at 1500 °C shows an ultra-high compressive yield strength of 2612 MPa with a failure strain of 8.8% at room temperature, respectively. These mechanical properties of the WNbMoTaV HEA fabricated by the powder metallurgical process were attributed to the combined effects of grain boundary strengthening, substitutional solid solution strengthening, interstitial solid solution strengthening and Orowan strengthening by the oxide inclusions. Through a Hall-Petch analysis, the Hall-Petch coefficient of the WNbMoTaV HEA was derived. The WNbMoTaV HEA fabricated via the powder metallurgical process showed the best compressive yield strength when compared with the other reported refractory HEAs processed with arc-melting and casting.

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Abstract: In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from a TSV. It is important to estimate the TSV noise transfer function and manage the noise-tolerance budget in the design of a reliable 3D-IC system. In this paper, a TSV noise coupling model is proposed based on a three-dimensional transmission line matrix method (3D-TLM). Using the proposed TSV noise coupling model, the noise transfer functions from TSV to TSV and TSV to the active circuit can be precisely estimated in complicated 3D structures, including TSVs, active circuits, and shielding structures such as guard rings. To validate the proposed model, a test vehicle was fabricated using the Hynix via-last TSV process. The proposed model was successfully verified by frequency- and time-domain measurements. Additionally, a noise isolation technique in 3D-IC using a guard ring structure is proposed. The proposed noise isolation technique was also experimentally demonstrated; it provided -17 dB and -10dB of noise isolation between the TSV and an active circuit at 100 MHz and 1 GHz, respectively.

Clinical practice guidelines in oncology

Abstract: Ductal carcinoma in situ (DCIS) of the breast represents a heterogeneous group of neoplastic lesions in the breast ducts. The goal for management of DCIS is to prevent the development of invasive breast cancer. This manuscript focuses on the NCCN Guidelines Panel recommendations for the workup, primary treatment, risk reduction strategies, and surveillance specific to DCIS.

Development and exploration of refractory high entropy alloys—A review

Abstract: Open literature publications, in the period from 2010 to the end of January 2018, on refractory high entropy alloys (RHEAs) and refractory complex concentrated alloys (RCCAs) are reviewed. While RHEAs, by original definition, are alloys consisting of five or more principal elements with the concentration of each of these elements between 5 and 35 at.%, RCCAs can contain three or more principal elements and the element concentration can be greater than 35%. The 151 reported RHEAs/RCCAs are analyzed based on their composition, processing methods, microstructures, and phases. Mechanical properties, strengthening and deformation mechanisms, oxidation, and corrosion behavior, as well as tribology, of RHEA/RCCAs are summarized. Unique properties of some of these alloys make them promising candidates for high temperature applications beyond Ni-based superalloys and/or conventional refractory alloys. Methods of development and exploration, future directions of research and development, and potential applications of RHEAs are discussed.