Jung Kyu Dong

Bio: Jung Kyu Dong is an academic researcher from Samsung. The author has contributed to research in topics: Wafer & Aperture. The author has an hindex of 8, co-authored 34 publications receiving 328 citations. Previous affiliations of Jung Kyu Dong include Samsung Electro-Mechanics.

Wafer-level lens module and image pickup module including the same

Abstract: Provided are a wafer-level lens module and an image pickup module including the same The wafer lens module includes a plurality wafer-scale lenses At least one of the plurality of wafer-scale lenses, such as a wafer-scale lens positioned toward an object side, includes a substrate and a glass lens element formed on one side of the substrate The glass lens element may be a one-sided lens or a double-sided lens When the glass lens is a double-sided lens, the substrate may have a through hole The remaining wafer-scale lenses each include a substrate and polymer lens elements made of UV curable polymer and formed on both sides of the substrate Also, spacers are interposed between the wafer-scale lenses, along the edge portions of the substrates, so as to maintain predetermined intervals between the wafer-scale lenses

Imaging device including a plurality of imaging units

Abstract: An imaging device with a plurality of imaging units is provided. The imaging device includes a supporting substrate, a flexible substrate and a movable unit. The supporting substrate is formed with a hard material, and the flexible substrate includes a plurality of imaging units positioned at least in a width direction. The flexible substrate is fixed at a first edge portion with the supporting substrate, while an opposite second edge portion of the flexible substrate is connected with the movable unit. The movable unit moves the opposite second edge portion of the flexible substrate in the width direction and bends or flattens the flexible substrate. A degree of curvature at which the flexible substrate is bent may vary based on a distance by which the movable unit moves in the width direction, so that a field of view (FOV) of the plurality of imaging units may be adjusted.

Numerical aperture (na) controlling unit, variable optical probe including the na controlling unit, and depth scanning method using the na controlling unit

Abstract: A numerical aperture (NA) controlling unit and a variable optical probe including the same are provided. The NA controlling unit includes: an aperture adjustment unit which controls an aperture through which light is transmitted; and a focus control unit that is disposed in a predetermined position with respect to the aperture adjustment unit, that focuses light transmitted through the aperture, and that has an adjustable focal length. The variable optical probe includes: a light transmission unit; a collimator that collimates light transmitted through the light transmission unit into parallel light; an NA controlling unit that focuses light on a sample to be inspected; and a scanner that varies a path of light transmitted through the light transmission unit such that a predetermined region of the sample is scanned by light that passes through the NA controlling unit.

Image pickup device and manufacturing method thereof

Abstract: An image pickup device and a manufacturing method thereof are disclosed. The image pickup device includes a printed circuit board (PCB), an image sensor module, an optical lens module, a fluidic lens module, and a shutter module. The image sensor module is disposed over the printed circuit board and electrically connected to interconnection pads on the PCB. The optical lens module is disposed over the image sensor module and includes one or more lenses. The fluidic lens module is disposed over the optical lens module, has a variable focus and is electrically connected to interconnection pads on the PCB. The shutter module is disposed over the fluidic lens module, and is electrically connected to remaining interconnection pads on the PCB. The fluidic lens module and the shutter module may be connected to the interconnection pads through bumped plate springs.

Multi stack packaging chip and method of manufacturing the same

Abstract: A multi stack packaging chip and a method of manufacturing the chip are provided. The method includes forming at least one second circuit element on a first wafer; forming a second wafer having a cavity and a one third circuit element formed opposite to the cavity; forming a solder on the second wafer; and combining the second wafer with the first wafer so that the second circuit element and the cavity correspond. The chip includes a flip-chip packaged chip in which a first circuit element is packaged using a first wafer; a second circuit element formed on the first wafer; a second wafer having a cavity and combined with the first wafer so that the cavity and the second circuit element correspond; a third circuit element formed on the second wafer; and a solder formed on the second wafer, the solder electrically coupling the second wafer to a packaging substrate.

Systems and Methods for Synthesizing Images from Image Data Captured by an Array Camera Using Restricted Depth of Field Depth Maps in which Depth Estimation Precision Varies

Abstract: Systems and methods are described for generating restricted depth of field depth maps. In one embodiment, an image processing pipeline application configures a processor to: determine a desired focal plane distance and a range of distances corresponding to a restricted depth of field for an image rendered from a reference viewpoint; generate a restricted depth of field depth map from the reference viewpoint using the set of images captured from different viewpoints, where depth estimation precision is higher for pixels with depth estimates within the range of distances corresponding to the restricted depth of field and lower for pixels with depth estimates outside of the range of distances corresponding to the restricted depth of field; and render a restricted depth of field image from the reference viewpoint using the set of images captured from different viewpoints and the restricted depth of field depth map.

Through-wafer interconnects for photoimager and memory wafers

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Methods and apparatus for capturing and/or processing images

Abstract: Methods and apparatus for capturing or generating images using multiple optical chains operating in parallel are described. Pixel values captured by individual optical chains corresponding to the same scene area are combined to provide an image with at least some of the benefits which would have been provided by capturing an image of the scene using a larger lens than that of the individual lenses of the optical chain modules. By using multiple optical chains in parallel at least some benefits normally obtained from using a large lens can be obtained without the need for a large lens. Furthermore in at least some embodiments, a wide dynamic range can be supported through the use of multiple sensors with the overall supported dynamic range being potentially larger than that of the individual sensors. Some lens and/or optical chain configurations are designed for use in small handheld devices, e.g., cell phones.

Systems and methods for decoding light field image files

Abstract: Systems and methods in accordance with embodiments of the invention are configured to render images using light field image files containing an image synthesized from light field image data and metadata describing the image that includes a depth map. One embodiment of the invention includes a processor and memory containing a rendering application and a light field image file including an encoded image and metadata describing the encoded image, where the metadata comprises a depth map that specifies depths from the reference viewpoint for pixels in the encoded image. In addition, the rendering application configures the processor to: locate the encoded image within the light field image file; decode the encoded image; locate the metadata within the light field image file; and post process the decoded image by modifying the pixels based on the depths indicated within the depth map to create a rendered image.