K. Noda

Bio: K. Noda is an academic researcher from University of California, Berkeley. The author has contributed to research in topics: Short-channel effect & Power semiconductor device. The author has an hindex of 3, co-authored 3 publications receiving 225 citations. Previous affiliations of K. Noda include Fujitsu.

A comparative study of advanced MOSFET concepts

Abstract: Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) has been the major device for integrated circuits over the past two decades. With technology advancement, there have been numerous MOSFET structures for channel length of 0.1 /spl mu/m and below reported in industrial research. A side-by-side comparison of these advanced device structures can provide useful understanding in device physics and the design tradeoffs among MOSFET's parameters. In this work we employ experimental data, device simulation, and analytical modeling for device comparison. The devices were developed at several different research laboratories. Guided by experimental data and simulations, analytical models for topics such as threshold voltage, short-channel effect, and saturation current for these different MOSFET structures are developed. These analytical models are then used for optimizing each device structure and comparing the devices under the same set of constraints for a fair comparison. The key design parameters are highlighted and the strength and weakness of each device structure in various performance categories are discussed.

Reverse short-channel effects and channel-engineering in deep-submicron MOSFETs: modeling and optimization

Abstract: For the first time, a theoretical model is presented, taking into account all the physical effects of T/sub OX/, X/sub j/, N/sub sub/, V/sub BS/, and channel engineering PTS scheme, to predict the Reverse-Short-Channel Effect (RSCE) in deep-submicron devices of several technology generations. The /spl Delta/V/sub th/ is found to follow the superposition principle. The worst case L/sub min/ is also modelled and its ultimate lower bound is exploited via optimum channel engineering.

A comparative study of advanced MOSFET structures

Abstract: This work presents a comparative study of advanced MOSFET structures that have been proposed for around 0.1 /spl mu/m generation in the subjects of short-channel effect, drain saturation current, and relative gate delay. Our approach differs from other studies in that we emphasize compact analytical models and parametric comparison. These heuristic and analytic models are guided by experimental and simulational data. Based on these models, key device design parameters are extracted and compared. This approach provides good insight for device design, quick figure-of-merit, and a framework for analyzing a wide variety of MOSFETs. The devices in this study are : (a) uniformly-doped MOSFET, (b) delta-doped MOSFET, (c) pocket-implanted MOSFET, (d) SOI MOSFET, and (e) double-gated MOSFET. Their generic extensions cover almost every advanced MOSFET.

CMOS scaling into the nanometer regime

Abstract: Starting with a brief review on 0.1-/spl mu/m (100 nm) CMOS status, this paper addresses the key challenges in further scaling of CMOS technology into the nanometer (sub-100 nm) regime in light of fundamental physical effects and practical considerations. Among the issues discussed are: lithography, power supply and threshold voltage, short-channel effect, gate oxide, high-field effects, dopant number fluctuations and interconnect delays. The last part of the paper discusses several alternative or unconventional device structures, including silicon-on-insulator (SOI), SiGe MOSFET's, low-temperature CMOS, and double-gate MOSFET's, which may lead to the outermost limits of silicon scaling.

Considerations for Ultimate CMOS Scaling

Abstract: This review paper explores considerations for ultimate CMOS transistor scaling Transistor architectures such as extremely thin silicon-on-insulator and FinFET (and related architectures such as TriGate, Omega-FET, Pi-Gate), as well as nanowire device architectures, are compared and contrasted Key technology challenges (such as advanced gate stacks, mobility, resistance, and capacitance) shared by all of the architectures will be discussed in relation to recent research results

Sub 50-nm FinFET: PMOS

Abstract: High performance PMOSFETs with gate length as short as 18-nm are reported. A self-aligned double-gate MOSFET structure (FinFET) is used to suppress the short channel effect. A 45 nm gate-length PMOS FinEET has an I/sub dsat/ of 410 /spl mu/A//spl mu/m (or 820 /spl mu/A//spl mu/m depending on the definition of the width of a double-gate device) at Vd=Vg=1.2 V and Tox=2.5 nm. The quasi-planar nature of this variant of the double-gate MOSFETs makes device fabrication relatively easy using the conventional planar MOSFET process technologies. Simulation shows possible scaling to 10-nm gate length.

Sub-50 nm P-channel FinFET

Abstract: High-performance PMOSFETs with sub-50-nm gate-length are reported. A self-aligned double-gate MOSFET structure (FinFET) is used to suppress the short-channel effects. This vertical double-gate SOI MOSFET features: 1) a transistor channel which is formed on the vertical surfaces of an ultrathin Si fin and controlled by gate electrodes formed on both sides of the fin; 2) two gates which are self-aligned to each other and to the source/drain (S/D) regions; 3) raised S/D regions; and 4) a short (50 nm) Si fin to maintain quasi-planar topology for ease of fabrication. The 45-nm gate-length p-channel FinFET showed an I/sub dsat/ of 820 /spl mu/A//spl mu/m at V/sub ds/=V/sub gs/=1.2 V and T/sub ox/=2.5 mm. Devices showed good performance down to a gate-length of 18 nm. Excellent short-channel behavior was observed. The fin thickness (corresponding to twice the body thickness) is found to be critical for suppressing the short-channel effects. Simulations indicate that the FinFET structure can work down to 10 nm gate length. Thus, the FinFET is a very promising structure for scaling CMOS beyond 50 nm.

Nanoscale CMOS

Abstract: This paper examines the apparent limits, possible extensions, and applications of CMOS technology in the nanometer regime. Starting from device scaling theory and current industry projections, we analyze the achievable performance and possible limits of CMOS technology from the point of view of device physics, device technology, and power consumption. Various possible extensions to the basic logic and memory devices are reviewed, with emphasis on novel devices that are structurally distinct front conventional bulk CMOS logic and memory devices. Possible applications of nanoscale CMOS are examined, with a view to better defining the likely capabilities of future microelectronic systems. This analysis covers both data processing applications and nondata processing applications such as RF and imaging. Finally, we speculate on the future of CMOS for the coming 15-20 years.