Kazutoshi Nishimoto

Bio: Kazutoshi Nishimoto is an academic researcher from Osaka University. The author has contributed to research in topics: Welding & Filler metal. The author has an hindex of 17, co-authored 199 publications receiving 1232 citations. Previous affiliations of Kazutoshi Nishimoto include Fukui University of Technology & Sumitomo Metal Industries.

Diode laser brazing of aluminium alloy to steels with aluminium filler metal

Abstract: Diode laser brazing of aluminium alloy (A5052) to interstitial free steel (IF steel) or type 304 stainless steel (SUS304) was conducted using aluminium filler metal (BA4047) with Nocolock flux. The processing parameters of laser power, wire feed rate and travel speed were varied. The strength of lap joints of A5052 on steels was evaluated by tensile shear test. The joint strength of A5052/steels was increased with increasing laser power and reached the maximum strength, more than approximately 80% of the A5052 base metal strength, at a laser power of 1300 W. Voids and incomplete penetration of filler metal were observed at the A5052/braze layer interface when the laser power was below 1100 W. The Fe–Al intermetallic compounds were formed at the steel/braze layer interfaces and grew drastically when the laser power exceeded 1300 W. Superior brazability of A5052/steels was found at brazing conditions corresponding to a temperature of filler metal droplet of 1050–1250 K.

Transient liquid phase bonding of Ni-base single crystal superalloy, CMSX-2

Abstract: This study investigated bonding and the crystallization behavior of Ni-base single crystal superalloy, CMSX-2, base material during transient liquid phase (TLP) bonding using MBF-80 insert metal. Joint strength was evaluated using tensile and creep rupture testing at elevated temperature. TLP-bonding of CMSX-2 was carried out at 1373-1548 K for 0-19.6 ks in vacuum and the (001) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width at the bonding temperature increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. Electron back scattering patterns of completed joints revealed that the bonded layer had single-crystallized during the TLP-bonding process and matched the crystallographic orientation of the bonded substrates. The elevated temperature tensile strength and creep rupture strength of the joints were the identical ones of the base metal.

Microcracking in multipass weld metal of alloy 690 Part 1 - Microcracking susceptibility in reheated weld metal

Abstract: Microcracking behaviour in the gas tungsten arc multipass weld metal of alloy 690 was investigated. The majority of microcracks occurred within about 300 μm from the fusion line of the subsequent weld bead and propagated along the solidification boundaries in the multipass weld metal. The morphology of the crack surface indicated the characteristic texture of ductility dip cracking. The microcracking susceptibility of the reheated weld metal was evaluated via the spot Varestraint test using three different filler metals having varying contents of impurity elements such as P and S. Microcracking occurring in the spot Varestraint tests consisted predominantly of ductility dip cracking, with a small amount of liquation cracking. The ductility dip cracking temperature range was about 1350–1600 K in the weld metal FF1, and narrowed in the order of weld metals FF1>FF3>FF5. The ductility dip cracking susceptibility was reduced with decreasing contents of impurity elements in the filler metal. It was conc...

Microcracking in multipass weld metal of alloy 690 Part 2 – Microcracking mechanism in reheated weld metal

Abstract: To elucidate the microcracking (ductility dip cracking) mechanism in the multipass weld metal of alloy 690, the hot ductility of the reheated weld metal was evaluated using three different filler metals with varying contents of impurity elements such as P and S. Hot ductility of the weld metal decreased at temperatures over 1400 K, and the weld metal containing a low quantity of impurity elements showed much higher ductility than that containing a high quantity of impurity elements. Local deformability at high temperature of the alloy 690 reheated weld metal was compared with that of Invar alloy. Grain boundary sliding in alloy 690 occurred not in the intermediate temperature range (800–1000 K), where grain boundary sliding was activated in Invar alloy, but at high temperatures just below the melting temperature of alloy 690. The computer simulation of microsegregation suggested that the deterioration of hot ductility is caused by the grain boundary segregation of impurity elements during the mult...

Hot cracking behaviour and susceptibility of extra high purity type 310 stainless steels

Abstract: Recent progress in the refining technology has enabled the production of highly pure commercial stainless steels. The hot cracking behaviour of these stainless steels was investigated with respect to type 310 stainless steel. For comparison, four types of 310 stainless steels with various amounts of minor and impurity elements such as C, P and S were used. The purity of type 310 stainless steels used was enhanced in the order of type 310

Overview of transient liquid phase and partial transient liquid phase bonding

Abstract: Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

Neutron diffraction methods for the study of residual stress fields

Abstract: A technique is described for the measurement of the residual stress tensor averaged over a specified volume within a component. The method involves measurement of small changes in lattice spacing using high resolution neutron diffraction. The stress is inferred from these measurements of the strain, and the theory of the relationship between the two quantities is described, including the effects of crystalline anisotropy. The various types of high resolution neutron diffractometer suitable for the work are described. Experimental results validating the method are given for a simple bent bar of mild steel of known strain, a plastically strained mild steel bar, and a mild steel tube of known torsional strain. Examples of the method in practical use are given by a cracked fatigue test specimen, a double-V test weld and a weld joining a tube to a plate. A more detailed example is the anisotropic response of a polycrystalline sample under elastic and plastic strain; this is illustrated by measurements...