Kevin Skadron

TL;DR: This characterization shows that the Rodinia benchmarks cover a wide range of parallel communication patterns, synchronization techniques and power consumption, and has led to some important architectural insight, such as the growing importance of memory-bandwidth limitations and the consequent importance of data layout.

TL;DR: Presents a collection of slides covering the following topics: CUDA parallel programming model; CUDA toolkit and libraries; performance optimization; and application development.

TL;DR: HotSpot is described, an accurate yet fast model based on an equivalent circuit of thermal resistances and capacitances that correspond to microarchitecture blocks and essential aspects of the thermal package that shows that power metrics are poor predictors of temperature, and that sensor imprecision has a substantial impact on the performance of DTM.

TL;DR: In this article, the authors present a framework to develop mainstream application software that transparently scales its parallelism to leverage the increasing number of processor cores, much as 3D graphics applications transparently scale their parallelism on manycore GPUs with widely varying numbers of cores.

TL;DR: The HotSpot compact thermal modeling approach is especially well suited for preregister transfer level (RTL) and presynthesis thermal analysis and is able to provide detailed static and transient temperature information across the die and the package, as it is also computationally efficient.