Lei Cheng

Bio: Lei Cheng is an academic researcher from University of Illinois at Urbana–Champaign. The author has contributed to research in topics: Floorplan & Logic synthesis. The author has an hindex of 8, co-authored 10 publications receiving 255 citations.

Floorplanning for 3-D VLSI design

Abstract: In this paper we present a floorplanning algorithm for 3-D ICs. The problem can be formulated as that of packing a given set of 3-D rectangular blocks while minimizing a suitable cost function. Our algorithm is based on a generalization of the classical 2-D slicing floorplans to 3-D slicing floorplans. A new encoding scheme of slicing floorplans (2-D/3-D) and its associated set of moves form the basis of the new simulated annealing based algorithm. The bestknown algorithm for packing 3-D rectangular blocks is based on simulated annealing using sequence-triple floorplan representation. Experimental results show that our algorithm produces packing results on average 3% better than the sequence-triple-based algorithm under the same annealing parameters, and our algorithm runs much faster (17 times for problems containing 100 blocks) than the sequence-triple. Moreover, our algorithm can be extended to consider various types of placement constraints and thermal distribution while the existing sequence-triple-based algorithm does not have such capabilities. Finally, when specializing to 2-D problems, our algorithm is a new 2-D slicing floorplanning algorithm. We are excited to report the surprising results that our new 2-D floorplanner has produced slicing floorplans for the two largest MCNC benchmarks ami33 and ami49 which have the smallest areas (among all slicing/nonslicing floorplanning algorithms) ever reported in the literature.

Floorplan Design for Multimillion Gate FPGAs

Abstract: Modern field-programmable gate arrays (FPGAs) have multimillions of gates and future generations of FPGAs will be even more complex. This means that floorplanning tools will soon be extremely important for the physical design of FPGAs. Due to the heterogeneous logic and routing resources of an FPGA, FPGA floorplanning is very different from the traditional floorplanning for application-specific integrated circuits. This paper presents the first FPGA-floorplanning algorithm targeted for FPGAs with heterogeneous resources (e.g., Xilinx's Spartan3 chips consisting of columns of configurable logic blocks, RAM blocks, and multiplier blocks). This algorithm can generate floorplans for Xilinx's XC3S5000 architecture (largest of the Spartan3 family) in a few minutes

GlitchMap: an FPGA technology mapper for low power considering glitches

Abstract: In 90-nm technology, dynamic power is still the largest power source in FPGAs [1], and signal glitches contribute a large portion of the dynamic power consumption. Previous power- aware technology mapping algorithms for FPGAs have not taken into account the glitch power reduction. In this paper, we present a dynamic power estimation model and a new technology mapping algorithm considering glitches. To the best of our knowledge, this is the first work that explicitly reduces glitch power during technology mapping for FPGAs. Experiments show that our algorithm, named GlitchMap, is able to reduce dynamic power by 18.7% compared to a previous state-of-the-art power-aware algorithm, EMap [2].

Floorplan design for multi-million gate FPGAs

Abstract: Modern FPGAs have multi-millions of gates and future generations of FPGA will be even more complex. This means floorplanning tools will soon be extremely important for the physical design of FPGAs. Due to the heterogeneous logic and routing resources on an FPGA, FPGA floorplanning is very different from the traditional floorplanning for ASICs. This work presents the first FPGA floorplanning algorithm targeted for FPGAs with heterogeneous resources (e.g., Xilinx's Spartan3 chips consisting of columns of CLBs, RAM blocks, and multiplier blocks). Our algorithm can generate floor-plans for Xilinx's XC3S5000 architecture (largest of the Spartan3 family) in a few minutes.

A fast simultaneous input vector generation and gate replacement algorithm for leakage power reduction

Abstract: Input vector control (IVC) technique is based on the observation that the leakage current in a CMOS logic gate depends on the gate input state, and a good input vector is able to minimize the leakage when the circuit is in the sleep mode. The gate replacement technique is a very effective method to further reduce the leakage current. In this paper, we propose a fast algorithm to find a low leakage input vector with simultaneous gate replacement. Results on MCNC91 benchmark circuits show that our algorithm produces $14 %$ better leakage current reduction with several orders of magnitude speedup in runtime for large circuits compared to the previous state-of-the-art algorithm. In particular, the average runtime for the ten largest combinational circuits has been dramatically reduced from 1879 seconds to 0.34 seconds.

Three-Dimensional Integrated Circuit Design

Abstract: With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance. Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to enhance dramatically chip performance and functionality, while reducing the distance among devices on a chip. They promise solutions to the current "interconnect bottleneck" challenges faced by IC designers. They also may facilitate the integration of heterogeneous materials, devices, and signals. However, before these advantages can be realized, key technology challenges of 3D ICs must be addressed. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of three-dimensional integrated circuits. * Demonstrates how to overcome "Interconnect Bottleneck" with 3D Integrated Circuit Design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers. * The FIRST book on 3D Integrated Circuit Design...provides up-to-date information that is otherwise difficult to find; * Focuses on design issues key to the product development cyle...good design plays a major role in exploiting the implementation flexibilities offered in the third dimension; * Provides broad coverage of 3D IC Design, including Interconnect Prediction Models, Thermal Management Techniques, and Timing Optimization...offers practical view of designing 3D circuits.

Thermal analysis of a 3D die-stacked high-performance microprocessor

Abstract: 3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional planar ICs, 3D ICs have shorter latencies as well as lower power consumption, due to shorter wires. The benefits of 3D ICs increase as we stack more die, due to successive reductions in wire lengths. However, as we stack more die, the power density increases due to increasing proximity of active (heat generating) devices, thus causing the temperatures to increase. Also, the topmost die on the 3D stack are located further from the heat sink and experience a longer heat dissipation path. Prior research has already identified thermal management as a critical issue in 3D technology. In this paper, we evaluate the thermal impact of building high-performance microprocessors in 3D. We estimate the temperatures of a planar IC based on the Alpha 21364 processor as well as 2-die and 4-die 3D implementations of the same. We show that, compared to the planar IC, the 2-die implementation and 4-die implementation increase the maximum temperature by 17 Kelvin and 33 Kelvin, respectively.

Implementing caches in a 3D technology for high performance processors

Abstract: 3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication involves stacking two or more die connected with a very high-density and low-latency interface. The die-to-die vias that comprise this interface can be treated like regular on-chip metal due to their small size (on the order of l/spl mu/m) and high speed (sub-F04 die-to-die communication delay). The increased device density and the ability to place and route in the third dimension provide new opportunities for microarchitecture design. In this paper, we first present a brief overview of 3D integration technology. We then focus on the design of on-chip caches using 3D integration. In particular, we show that the dense die-to-die vias enable caches that are 3D-partitioned at the level of individual wordlines or bitlines. This results in a wire length reduction within SRAM arrays, and a reduction in the footprint of individual SRAM banks, which reduces the global routing from the edge of the cache to the banks and back. The wire length reduction provides both power and performance benefits, e.g., 21.5% latency reduction and 30.9% energy reduction for a 512KB cache. We also report that implementing only the caches in 3D, without accounting for possible benefits from implementing other components of the processor in 3D, results in a 12% IPC gain. These results demonstrate some of the potential of this new technology, and motivate further research in 3D microarchitectures.

Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits

Abstract: Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for two-dimensional circuits are not sufficient to manage the added complexity caused by the third dimension. Consequently, design methodologies that efficiently handle the added complexity and inherent heterogeneity of 3-D circuits are necessary. These 3-D design methodologies should support robust and reliable 3-D circuits while considering different forms of vertical integration, such as system-in-package and 3-D ICs with fine grain vertical interconnections. Global signaling issues, such as clock and power distribution networks, are further exacerbated in vertical integration due to the limited number of package pins, the distance of these pins from other planes within the 3-D system, and the impedance characteristics of the through silicon vias (TSVs). In addition to these dedicated networks, global signaling techniques that incorporate the diverse traits of complex 3-D systems are required. One possible approach, potentially significantly reducing the complexity of interconnect issues in 3-D circuits, is 3-D networks-on-chip (NoC). Design methodologies that exploit the diversity of 3-D structures to further enhance the performance of multiplane integrated systems are necessary. The longest interconnects within a 3-D circuit are those interconnects comprising several TSVs and traversing multiple physical planes. Consequently, minimizing the delay of the interplane nets is of great importance. By considering the nonuniform impedance characteristics of the interplane interconnects while placing the TSVs, the delay of these nets is decreased. In addition, the difference in electrical behavior between the horizontal and vertical interconnects suggests that asymmetric structures can be useful candidates for distributing the clock signal within a 3-D circuit. A 3-D test circuit fabricated with a 180 nm silicon-on-insulator (SOI) technology, manufactured by MIT Lincoln Laboratories, exploring several clock distribution topologies is described. Correct operation at 1 GHz has been demonstrated. Several 3-D NoC topologies incorporating dissimilar 3-D interconnect structures are reviewed as a promising solution for communication limited systems-on-chip (SoC). Appropriate performance models are described to evaluate these topologies. Several forms of vertical integration, such as system-in-package and different candidate technologies for 3-D circuits, such as SOI, are considered. The techniques described in this paper address fundamental interconnect structures in the 3-D design process. Several interesting research problems in the design of 3-D circuits are also discussed.

Placement of defect-tolerant digital microfluidic biochips using the T-tree formulation

Abstract: Droplet-based microfluidic biochips have recently gained much attention and are expected to revolutionize the biological laboratory procedures. As biochips are adopted for the complex procedures in molecular biology, its complexity is expected to increase due to the need of multiple and concurrent assays on a chip. In this article, we formulate the placement problem of digital microfluidic biochips with a tree-based topological representation, called T-tree. To the best knowledge of the authors, this is the first work that adopts a topological representation to solve the placement problem of digital microfluidic biochips. We also consider the defect tolerant issue to avoid to use defective cells due to fabrication. Experimental results demonstrate that our approach is more efficient and effective than the previous unified synthesis and placement framework.