scispace - formally typeset
Search or ask a question
Author

Leszek Wojtan

Bio: Leszek Wojtan is an academic researcher from École Polytechnique Fédérale de Lausanne. The author has contributed to research in topics: Heat transfer & Two-phase flow. The author has an hindex of 12, co-authored 14 publications receiving 2193 citations.

Papers
More filters
Journal ArticleDOI
TL;DR: In this paper, a literature review is presented to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips.
Abstract: The purpose of this literature review is to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips. Today, most development efforts are focused on three technologies: liquid cooling in copper or silicon micro-geometry heat dissipation elements, impingement of liquid jets directly on the silicon surface of the chip, and two-phase flow boiling in copper heat dissipation elements or plates with numerous microchannels. The principal challenge is to dissipate the high heat fluxes (current objective is 300 W/cm2) while maintaining the chip temperature below the targeted temperature of 85°C, while of second importance is how to predict the heat transfer coefficients and pressure drops of the cooling process. In this study, the state of the art of these three technologies from recent experimental articles (since 2003) is analyzed and a comparison of the respective merits and ...

511 citations

Journal ArticleDOI
TL;DR: In this paper, a new version of the Kattan-thome-favrat flow pattern map is presented, which is based on the dynamic void fraction measurements described in [Int. J. Multiphase Flow 30 (2004) 125,137], the stratified-wavy region has been subdivided into three subzones: slug, slug/stratifiedwavy and stratified wavy.

464 citations

Journal Article
TL;DR: Reference LTCM-ARTICLE-2005-004View record in Web of Science Record created on 2005-07-06, modified on 2017-05-10 as discussed by the authors.
Abstract: Reference LTCM-ARTICLE-2005-004View record in Web of Science Record created on 2005-07-06, modified on 2017-05-10

320 citations

Journal ArticleDOI
TL;DR: In this paper, a new version of the flow pattern map presented in Part I of this paper has been used to modify the dry angle in the heat transfer model of Kattan-Thome-Favrat.

286 citations

Journal ArticleDOI
TL;DR: In this paper, a new microscale version of the Katto-Ohno correlation for the prediction of saturated critical heat flux (CHF) during forced convective boiling in microchannels has been proposed.

211 citations


Cited by
More filters
Journal ArticleDOI
K. Aamodt1, N. Abel2, A. Abrahantes Quintana, A. Acero  +989 moreInstitutions (76)
TL;DR: In this paper, the production of mesons containing strange quarks (KS, φ) and both singly and doubly strange baryons (,, and − + +) are measured at mid-rapidity in pp collisions at √ s = 0.9 TeV with the ALICE experiment at the LHC.

1,176 citations

Journal ArticleDOI
TL;DR: In this paper, a literature review is presented to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips.
Abstract: The purpose of this literature review is to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips. Today, most development efforts are focused on three technologies: liquid cooling in copper or silicon micro-geometry heat dissipation elements, impingement of liquid jets directly on the silicon surface of the chip, and two-phase flow boiling in copper heat dissipation elements or plates with numerous microchannels. The principal challenge is to dissipate the high heat fluxes (current objective is 300 W/cm2) while maintaining the chip temperature below the targeted temperature of 85°C, while of second importance is how to predict the heat transfer coefficients and pressure drops of the cooling process. In this study, the state of the art of these three technologies from recent experimental articles (since 2003) is analyzed and a comparison of the respective merits and ...

511 citations

Journal ArticleDOI
TL;DR: In this paper, a new version of the Kattan-thome-favrat flow pattern map is presented, which is based on the dynamic void fraction measurements described in [Int. J. Multiphase Flow 30 (2004) 125,137], the stratified-wavy region has been subdivided into three subzones: slug, slug/stratifiedwavy and stratified wavy.

464 citations

Journal ArticleDOI
TL;DR: In this paper, a critical review of traditional and emerging cooling methods as well as coolants for electronics is provided, summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed.
Abstract: Continued miniaturization and demand for high-end performance of electronic devices and appliances have led to dramatic increase in their heat flux generation. Consequently, conventional coolants and cooling approaches are increasingly falling short in meeting the ever-increasing cooling needs and challenges of those high heat generating electronic devices. This study provides a critical review of traditional and emerging cooling methods as well as coolants for electronics. In addition to summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed. With superior thermal properties and numerous benefits nanofluids show great promises in fulfilling the cooling demands of high heat generating electronic devices. It is believed that applications of such novel coolants in emerging techniques like micro-channels and micro-heat pipes can revolutionize cooling technologies for electronics in the future.

441 citations

Journal ArticleDOI
TL;DR: In this paper, the state-of-the-art knowledge and research results of thermal transport in open celled cellular metal foams, which covers the effective thermal conductivity, forced convection, natural convection and thermal radiation, pool boiling and flow boiling heat transfer, solid/liquid phase change heat transfer and catalytic reactor were provided.

374 citations