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Li Shang

Researcher at University of Colorado Boulder

Publications -  164
Citations -  7105

Li Shang is an academic researcher from University of Colorado Boulder. The author has contributed to research in topics: Computer science & Algorithm design. The author has an hindex of 43, co-authored 147 publications receiving 6610 citations. Previous affiliations of Li Shang include Fudan University & Princeton University.

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Proceedings ArticleDOI

Dynamic voltage scaling with links for power optimization of interconnection networks

TL;DR: This paper proposes a history-based DVS policy that judiciously adjusts link frequencies and voltages based on past utilization that realizes up to 6.3/spl times/ power savings and is accompanied by a moderate impact on performance.

Parallel CAD: Algorithm Design and Programming Special Section Call for Papers TODAES: ACM Transactions on Design Automation of Electronic Systems

TL;DR: This journal special section will cover recent progress on parallel CAD research, including algorithm foundations, programming models, parallel architectural-specific optimization, and verification, as well as other topics relevant to the design of parallel CAD algorithms and software tools.
Proceedings ArticleDOI

Dynamic power consumption in Virtex™-II FPGA family

TL;DR: The dynamic power consumption in the fabric of Field Programmable Gate Arrays (FPGAs) is analyzed by taking advantage of both simulation and measurement, and it is concluded that dynamic power dissipation of a Virtex-II CLB is 5.9μW per MHz for typical designs, but it may vary significantly depending on the switching activity.
Journal ArticleDOI

The next generation of low-cost personal air quality sensors for quantitative exposure monitoring

TL;DR: In this article, a quantification system was developed to convert the metal oxide semiconductor (MOx) sensor signals into concentrations, and two types of sensors were used to measure CO, O3, NO2, and total VOCs.
Proceedings ArticleDOI

Accurate temperature-dependent integrated circuit leakage power estimation is easy

TL;DR: In this article, the authors show that for typical IC packages and cooling structures, a given amount of heat introduced at any position in the active layer will have similar impact on the average temperature of the layer.