An introduction to heat transfer

Finite element methods for Maxwell's equations.

Lectures on Cauchy’s Problem in Linear Partial Differential Equations. By J. Hadamard. Pp. viii+316. 15s.net. 1923. (Per Oxford University Press.)

Introduction to heat transfer

The growing packing density and power consumption of very large scale integration (VLSI) circuits have made thermal effects one of the most important concerns of VLSI designers The increasing variability of key process parameters in nanometer CMOS technologies has resulted in larger impact of the substrate and metal line temperatures on the reliability and performance of the devices and interconnections Recent data shows that more than 50% of all integrated circuit failures are related to thermal issues This paper presents a brief discussion of key sources of power dissipation and their temperature relation in CMOS VLSI circuits, and techniques for full-chip temperature calculation with special attention to its implications on the design of high-performance, low-power VLSI circuits The paper is concluded with an overview of techniques to improve the full-chip thermal integrity by means of off-chip versus on-chip and static versus adaptive methods

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Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods

In this paper we consider the problem of approximating the large discretized thermal network that models the heat conduction phenomenon in an electrical system by means of models of reduced state-space dimensions. To this aim we present an efficient and numerically stable Arnoldi type algorithm by which a multi-point moment matching approximant of the discretized thermal network is obtained and we apply it to the electro-thermal analysis of an operational transconductance amplifier.

An Arnoldi based thermal network reduction method for electro-thermal analysis

Discretization of diffusion-equation modeling heat conduction in electrical devices, as needed for accurate electrothermal simulations, tends to produce thermal networks of very large size. This paper investigates an effective method for thermal network complexity reduction preserving high accuracy in electrothermal analysis. The method is based on a suited port-like definition of thermal network and on the use of the truncated balanced-reduction method. The strategy is practically applied to the electrothermal simulation of a power vertical double diffused MOSFET.

Compact modeling of electrical devices for electrothermal analysis

http://www.comphys.com/pdf/jcp_hodge_polyhedra.pdf

A new set of basis functions for the discrete geometric approach

This work describes a FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC), which is fully automated and relies on an enhanced version of the Multi-Point Moment Matching algorithm. The tool provides a novel equivalent network suitable for use in SPICE-like circuit simulators to perform efficient thermal and electrothermal analyses. FANTASTIC requires much less CPU time and memory storage compared to commercial simulators. The thermal behavior of a state-of-the-art four-finger GaAs HBT is investigated as a case-study.

FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC)

We examine the construction of a symmetric positive definite conductance matrix for eddy-current problems, using a discrete approach. We construct a new set of piecewise uniform basis vector functions on both the primal and the dual complex. We define these vector functions for both tetrahedra and prisms

/pdf/symmetric-positive-definite-constitutive-matrices-for-4nk3a472rh.pdf

Lorenzo Codecasa

Papers

An Arnoldi based thermal network reduction method for electro-thermal analysis

Compact modeling of electrical devices for electrothermal analysis

A new set of basis functions for the discrete geometric approach

FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC)

Symmetric Positive-Definite Constitutive Matrices for Discrete Eddy-Current Problems