Lorenzo Colace

Bio: Lorenzo Colace is an academic researcher from Roma Tre University. The author has contributed to research in topics: Photodetector & Germanium. The author has an hindex of 23, co-authored 140 publications receiving 2473 citations. Previous affiliations of Lorenzo Colace include University of Cassino & Daimler AG.

Efficient high-speed near-infrared Ge photodetectors integrated on Si substrates

Abstract: We have fabricated Ge/Si heterojunction photodetectors with high responsivities of 550 mA/W at 1.32 μm and 250 mA/W at 1.55 μm and time responses shorter than 850 ps. High quality Ge was epitaxially grown on Si using ultrahigh vacuum/chemical vapor deposition followed by cyclic thermal annealing. The beneficial effect of the post-growth thermal annealing on the electrical properties of Ge epilayers, due to the reduction of threading-dislocation densities, is confirmed by the dramatic enhancement of the performance of the photodetectors.

Metal–semiconductor–metal near-infrared light detector based on epitaxial Ge/Si

Abstract: In this letter we report on a metal–semiconductor–metal photodetector based on thick relaxed Ge layers, epitaxially grown on silicon after insertion of a low-temperature-grown Ge buffer layer. The detector shows a good responsivity at normal incidence at both 1.3 and 1.55 μm, with a maximum responsivity of 0.24 A/W at 1.3 μm under a 1 V bias. A response time of about 2 ns has been measured.

High performance germanium-on-silicon detectors for optical communications

Abstract: We demonstrate fast and efficient germanium-on-silicon p-i-n photodetectors for optical communications, with responsivities as high as 0.89 and 0.75 A/W at 1.3 and 1.55 μm, respectively, time response 2.5 Gb/s integrated receivers for the second and third fiber spectral windows.

Ge-on-Si approaches to the detection of near-infrared light

Abstract: We review our recent results on Ge-based near-infrared photodetectors grown on silicon. We fabricated metal-semiconductor-metal photodetectors based on epitaxial pure-Ge grown on silicon by chemical vapor deposition. Material characterization and device performances are illustrated and discussed. Exploiting a novel approach based on evaporation of polycrystalline-Ge on silicon, we also realized efficient near-infrared photodiodes with good speed and sensitivity. Finally, multiple-element devices were designed, fabricated, and tested, such as a voltage-tunable wavelength-selective photodetector based on a SiGe superlattice and a linear array of 16 photodetectors in poly-Ge on Si.

PbS Colloidal Quantum Dot Photodetectors operating in the near infrared.

Abstract: Colloidal quantum dots have recently attracted lot of interest in the fabrication of optoelectronic devices due to their unique optical properties and their simple and low cost fabrication. PbS nanocrystals emerged as the most advanced colloidal material for near infrared photodetectors. In this work we report on the fabrication and characterization of PbS colloidal quantum dot photoconductors. In order to make devices suitable for the monolithic integration with silicon electronics, we propose a simple and low cost process for the fabrication of photodetectors and investigate their operation at very low voltage bias. Our photoconductors feature high responsivity and detectivity at 1.3 μm and 1 V bias with maximum values of 30 A/W and 2·1010 cmHz1/2W−1, respectively. Detectivity close to 1011 cmHz1/2W−1 has been obtained resorting to bridge sensor readout.

Device Requirements for Optical Interconnects to Silicon Chips

Abstract: We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects for future high-performance silicon chips. Optics has potential benefits in interconnect density, energy, and timing. The necessity of low interconnect energy imposes low limits especially on the energy of the optical output devices, with a ~ 10 fJ/bit device energy target emerging. Some optical modulators and radical laser approaches may meet this requirement. Low (e.g., a few femtofarads or less) photodetector capacitance is important. Very compact wavelength splitters are essential for connecting the information to fibers. Dense waveguides are necessary on-chip or on boards for guided wave optical approaches, especially if very high clock rates or dense wavelength-division multiplexing (WDM) is to be avoided. Free-space optics potentially can handle the necessary bandwidths even without fast clocks or WDM. With such technology, however, optics may enable the continued scaling of interconnect capacity required by future chips.

Alternative Plasmonic Materials: Beyond Gold and Silver

Abstract: Materials research plays a vital role in transforming breakthrough scientific ideas into next-generation technology. Similar to the way silicon revolutionized the microelectronics industry, the proper materials can greatly impact the field of plasmonics and metamaterials. Currently, research in plasmonics and metamaterials lacks good material building blocks in order to realize useful devices. Such devices suffer from many drawbacks arising from the undesirable properties of their material building blocks, especially metals. There are many materials, other than conventional metallic components such as gold and silver, that exhibit metallic properties and provide advantages in device performance, design flexibility, fabrication, integration, and tunability. This review explores different material classes for plasmonic and metamaterial applications, such as conventional semiconductors, transparent conducting oxides, perovskite oxides, metal nitrides, silicides, germanides, and 2D materials such as graphene. This review provides a summary of the recent developments in the search for better plasmonic materials and an outlook of further research directions.

High-performance Ge-on-Si photodetectors

Abstract: The past decade has seen rapid progress in research into high-performance Ge-on-Si photodetectors. Owing to their excellent optoelectronic properties, which include high responsivity from visible to near-infrared wavelengths, high bandwidths and compatibility with silicon complementary metal–oxide–semiconductor circuits, these devices can be monolithically integrated with silicon-based read-out circuits for applications such as high-performance photonic data links and infrared imaging at low cost and low power consumption. This Review summarizes the major developments in Ge-on-Si photodetectors, including epitaxial growth and strain engineering, free-space and waveguide-integrated devices, as well as recent progress in Ge-on-Si avalanche photodetectors. Owing to their excellent optoelectronic properties, Ge-on-Si photodetector can be monolithically integrated with silicon-based read-out circuits for applications such as high-performance photonic data links and low-cost infrared imaging at low power consumption. This Review covers the major developments in Ge-on-Si photodetectors, including epitaxial growth and strain engineering, free-space and waveguide-integrated devices, as well as recent progress in Ge-on-Si avalanche photodetectors.

Guiding, modulating, and emitting light on Silicon-challenges and opportunities

Abstract: Silicon photonics could enable a chip-scale platform for monolithic integration of optics and microelectronics for applications of optical interconnects in which high data streams are required in a small footprint. This paper discusses mechanisms in silicon photonics for waveguiding, modulating, light amplification, and emission. These mechanisms, together with recent advances of fabrication techniques, have enabled the demonstration of ultracompact passive and active silicon photonic components with very low loss.

High-quality Ge epilayers on Si with low threading-dislocation densities

Abstract: High-quality Ge epilayers on Si with low threading-dislocation densities were achieved by a two-step ultrahigh vacuum/chemical-vapor-deposition process followed by cyclic thermal annealing. On large Si wafers, Ge on Si with threading-dislocation density of 2.3×107 cm−2 was obtained. Combining selective area growth with cyclic thermal annealing produced an average threading-dislocation density of 2.3×106 cm−2.We also demonstrated small mesas of Ge on Si with no threading dislocations. The process described in this letter for making high-quality Ge on Si is uncomplicated and can be easily integrated with standard Si processes.