M. J. Li

Bio: M. J. Li is an academic researcher from Goddard Space Flight Center. The author has contributed to research in topics: Calorimeter & Superconducting tunnel junction. The author has an hindex of 4, co-authored 9 publications receiving 43 citations.

Performance of Mo/Au TES microcalorimeters

Abstract: We are developing X-ray calorimeters to meet the specifications of the Constellation-X mission. Each calorimeter consists of a transition-edge-sensor (TES) thermometer, which is suspended on a silicon-nitride membrane. Our TES thermometers are Mo/Au bilayer films that are biased in the sharp phase transition between the superconducting and normal-metal states. These calorimeters have demonstrated very good energy resolutions: 2.4 eV at 1.5 keV and 3.7 eV at 3.3 keV. The energy resolutions are limited by thermal noise and Johnson noise (which are intrinsic to any resistive calorimeter) plus excess noise. The excess noise, which is several times larger than the Johnson noise, is consistent with frequency-independent voltage noise in the TES. Detailed measurements of one Mo/Au TES demonstrate that the excess noise is independent of the voltage applied to the TES over a range of biases at the same TES resistance. The magnitude of the excess noise is smallest at the high-resistance end of the phase transition. We also compared noise in square Mo/Au TES’s ranging in size from 300 microns to 600 microns to learn how the excess noise is affected by the geometry of the TES.

Development of ultra-low impedance Through-wafer Micro-vias

Abstract: Concurrent with our microcalorimeter array fabrication for Constellation-X technology development, we are developing ultra-low impedance Through-Wafer Micro-Vias (TWMV) as electrical interconnects for superconducting circuits. The TWMV will enable the electrical contacts of each detector to be routed to contacts on the backside of the array. There, they can be bump-bonded to a wiring fan-out board which interfaces with the front-end Superconducting Quantum Interference Device readout. We are concentrating our developmental efforts on ultra-low impedance copper and superconducting aluminum TWMV in 300–400 micron thick silicon wafers. For both schemes, a periodic pulse-reverse electroplating process is used to fill or coat micron-scale through-wafer holes of aspect ratios up to 20. Here we discuss the design, fabrication process, and recent electro-mechanical test results of Al and Cu TWMV at room and cryogenic temperatures.

Detailed characterization of Mo/Au TES microcalorimeters

Abstract: We are optimizing Mo/Au transition-edge-sensor (TES) calorimeters to meet the specifications of NASA’s Constellation-X mission. Our calorimeters have already demonstrated very good energy resolution of X rays (2.4 eV at 1.5 keV). We wish to further improve the energy resolution by reducing excess noise in the calorimeters. Development of a detailed model and understanding of the noise is instrumental to reaching this goal. Towards that end, we employ a linear model that describes the response of a calorimeter to signal and various sources of noise. The model is based on detailed measurements of the parameters that affect the calorimeter’s performance, such as current-voltage characteristics of the TES, thermal conductance of our silicon-nitride membranes, and inductance in the electronic circuit used to bias the TES. We determine the sharpness of the superconducting phase transition by fitting the model to the measured responsivity of the calorimeter. The model relates sources of noise, such as phonon noi...

Fabrication of tunnel junctions for direct detector arrays with single-electron transistor readout using electron-beam lithography

Abstract: This paper describes the fabrication of small aluminum tunnel junctions for applications in astronomy. Antenna-coupled superconducting tunnel junctions with integrated single-electron transistor readout have the potential for photon-counting sensitivity at sub-mm wavelengths. The junctions for the detector and single-electron transistor can be made with electron-beam lithography and a standard self-aligned double-angle deposition process. However, high yield and uniformity of the junctions is required for large-format detector arrays. This paper describes how measurement and modification of the sensitivity ratio in the resist bilayer was used to greatly improve the reliability of forming devices with uniform, sub-micron size, low-leakage junctions.

First results from Position-Sensitive quantum calorimeters using Mo/Au Transition-Edge Sensors

Abstract: We report the first results from a high-energy-resolution imaging spectrometer called a Position-Sensitive Transition-Edge Sensor (PoST). A PoST is a quantum calorimeter consisting of two Transition Edge Sensors (TESs) on the ends of a long absorber to do one dimensional imaging spectroscopy. Comparing rise time and energy information, the position of the event in the PoST is determined. Energy is inferred from the sum of the two pulses. We have fabricated 7- and 15-pixel PoSTs using Mo-Au TESs and Au absorbers. We have achieved 32 eV FWHM energy resolution at 1.5 keV with a 7-pixel PoST calorimeter.

Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance

Abstract: Closed-form expressions of the resistance, capacitance, and inductance for interplane 3-D vias are presented in this paper. The closed-form expressions account for the 3-D via length, diameter, dielectric thickness, and spacing to ground. A 3-D numerical simulation is used to extract electromagnetic solutions of the resistance, capacitance, and inductance for comparison with the closed-form expressions, revealing good agreement between simulation and the physical models. The maximum error for the resistance, capacitance, and inductance is less than 8%.

Impedance measurements and modeling of a transition-edge-sensor calorimeter

Abstract: We describe a method for measuring the complex impedance of transition-edge-sensor (TES) calorimeters. Using this technique, we measured the impedance of a Mo/Au superconducting transition-edge-sensor calorimeter. The impedance data are in good agreement with our linear calorimeter model. From these measurements, we obtained measurements of unprecedented accuracy of the heat capacity and the gradient of resistance with respect to temperature and current of a TES calorimeter throughout the phase transition. The measurements probe the internal state of the superconductor in the phase transition and are useful for characterizing the calorimeter.

Development of a virtual probe tip with an application to high aspect ratio microscale features

Abstract: Nondestructive measurement of microscale features remains a challenging metrology problem. For example, to assess a high aspect ratio small hole it is currently common to cut a cross section and measure the features of interest using an atomic force microscope, scanning probe microscope, or scanning electron microscope. Typically, these metrology tools may be suitable for surface finish measurement but often lack the capability for dimensional metrology. The aim of this article is to discuss the development of a high aspect-ratio microscale probe for measurement of microscale features. A 700:1 high aspect ratio probe shank is fabricated with a 7μm diameter, and attached at one end to an oscillator. The oscillator produces a standing wave in the oscillating probe shank as opposed to conventional probes that use a microscale sphere on the end of a comparatively rigid shank. As a result of the standing wave formed in steady state vibration, the free end of the shank generates an amplitude of oscillation grea...

Electrical modeling and characterization of 3-D vias

Abstract: Electrical characterization of the resistance, capacitance, and inductance of inter-plane 3-D vias is presented in this paper. Both capacitive and inductive coupling between multiple 3-D vias is described as a function of the separation distance and plane location. The effects of placing a third shield via between two signal vias is investigated as a means to limit the capacitive coupling. The location of the return path is examined to determine the best placement of a 3-D via to reduce the overall loop inductance. Based on the extracted resistance, capacitance, and inductance, the L/R time constant is shown to be much larger than the RC time constant, demonstrating that the 3-D via structure investigated in this paper is inductively limited rather than capacitively limited.

Architecture-Level Exploration of Alternative Interconnection Schemes Targeting 3D FPGAs: A Software-Supported Methodology

Abstract: In current reconfigurable architectures, the interconnection structures increasingly contribute more to the delay and power consumption. The demand for increased clock frequencies and logic density (smaller area footprint) makes the problem even more important. Three-dimensional (3D) architectures are able to alleviate this problem by accommodating a number of functional layers, each of which might be fabricated in different technology. However, the benefits of such integration technology have not been sufficiently explored yet. In this paper, we propose a software-supported methodology for exploring and evaluating alternative interconnection schemes for 3D FPGAs. In order to support the proposed methodology, three new CAD tools were developed (part of the 3D MEANDER Design Framework). During our exploration, we study the impact of vertical interconnection between functional layers in a number of design parameters. More specifically, the average gains in operation frequency, power consumption, and wirelength are 35%, 32%, and 13%, respectively, compared to existing 2D FPGAs with identical logic resources. Also, we achieve higher utilization ratio for the vertical interconnections compared to existing approaches by 8% for designing 3D FPGAs, leading to cheaper and more reliable devices.