M. Lazar

Bio: M. Lazar is an academic researcher from Institut national des sciences Appliquées de Lyon. The author has contributed to research in topics: Ion implantation & Neutron temperature. The author has an hindex of 11, co-authored 33 publications receiving 365 citations. Previous affiliations of M. Lazar include Claude Bernard University Lyon 1.

Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization

Abstract: Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature. In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process.

Fast Neutron Detection With 4H-SiC Based Diode Detector up to 500 °C Ambient Temperature

Abstract: In the framework of the European I-Smart project, optimal 4H-SiC based diode geometries were developed for high temperature neutron detection. Irradiation tests were conducted with 14 MeV fast neutrons supplied by a deuterium-tritium neutron generator with an average neutron yield of $4.04 \times {10^{10}} - 5.25 \times {10^{10}}\;\hbox{n/s}$ at Neutron Laboratory of the Technical University of Dresden in Germany. In this paper, we interpret the first measurements and results with 4H-SiC detector irradiated with fast neutrons from room temperature up to 500 °C. These experiments are serving also the first simulation of the harsh environmental condition measurements in the tritium breeding blanket of the ITER fusion reactor, which is one of the most prominent planned location of high temperature neutron flux characterization studies in the near future.

Effect of ion implantation parameters on Al dopant redistribution in SiC after annealing: Defect recovery and electrical properties of p-type layers

Abstract: Epilayers of 6H and 4H–SiC were Al implanted with various doses to form p-type layers after a postimplantation annealing performed at 1700 °C/30 min. Rutherford backscattering spectrometry in the channeling mode analyses carried out before and after annealing show virgin nonimplanted equivalent spectra if the implanted layers are not amorphized. The amorphous layers are recrystallized after annealing with a residual damage level of the lattice relative to the quantity of the dopant implanted. Secondary ion mass spectrometry measurements performed on the implanted samples before and after annealing illustrate a good superposition of the profiles obtained before and after the annealing on nonamorphized samples. Dopant redistribution occurs after annealing, only on amorphized layers, with an intensity that increases with the implanted dose. Deduced from sheet resistance measurements, the dopant activation increases with the implanted dose. Activation of 80%–90% is obtained from capacitance–voltage measuremen...

Radiation silicon carbide detectors based on ion implantation of boron

Abstract: Radiation detectors based on radiation-hardened semiconductor such as silicon carbide (SiC), have received considerable attention in many applications such as in outer space, high energy physics experiments, gas and oil prospection, and nuclear reactors. For the first time it was demonstrated the reliability of thermal neutron detectors realized by standard ion implantation of boron layer as a neutron converter layer. Moreover, these detectors respond to thermal neutrons and gamma rays showing different counting rates at different voltages and under different types of shielding.

A Comprehensive Review of Semiconductor Ultraviolet Photodetectors: From Thin Film to One-Dimensional Nanostructures

Abstract: Ultraviolet (UV) photodetectors have drawn extensive attention owing to their applications in industrial, environmental and even biological fields. Compared to UV-enhanced Si photodetectors, a new generation of wide bandgap semiconductors, such as (Al, In) GaN, diamond, and SiC, have the advantages of high responsivity, high thermal stability, robust radiation hardness and high response speed. On the other hand, one-dimensional (1D) nanostructure semiconductors with a wide bandgap, such as β-Ga2O3, GaN, ZnO, or other metal-oxide nanostructures, also show their potential for high-efficiency UV photodetection. In some cases such as flame detection, high-temperature thermally stable detectors with high performance are required. This article provides a comprehensive review on the state-of-the-art research activities in the UV photodetection field, including not only semiconductor thin films, but also 1D nanostructured materials, which are attracting more and more attention in the detection field. A special focus is given on the thermal stability of the developed devices, which is one of the key characteristics for the real applications.

State of the art of high temperature power electronics

Abstract: High temperature power electronics has become possible with the recent availability of silicon carbide devices. This material, as other wide-bandgap semiconductors, can operate at temperatures above 500 °C, whereas silicon is limited to 150-200 °C. Applications such as transportation or a deep oil and gas wells drilling can benefit. A few converters operating above 200 °C have been demonstrated, but work is still ongoing to design and build a power system able to operate in harsh environment (high temperature and deep thermal cycling).

Survey of High-Temperature Reliability of Power Electronics Packaging Components

Abstract: In order to take the full advantage of the high-temperature SiC and GaN operating devices, package materials able to withstand high-temperature storage and large thermal cycles have been investigated. The temperature under consideration here are higher than 200 °C. Such temperatures are required for several potential applications such as down-hole oil and gas industry for well logging, aircrafts, automotive, and space exploration. This review focuses on the reliability of a selection of potential components or materials used in the package assembly as the substrates, the die attaches, the interconnections, and the encapsulation materials. It reveals that, substrates with low coefficient of thermal expansion (CTE) conductors or with higher fracture resistant ceramics are potential candidates for high temperatures. Die attaches and interconnections reliable solutions are also available with the use of compatible metallization schemes. At this level, the reliability can also be improved by reducing the CTE mismatch between assembled materials. The encapsulation remains the most limiting packaging component since hard materials present thermomechanical reliability issues, while soft materials have low degradation temperatures. The review allows identifying reliable components and materials for high-temperature wide bandgap semiconductors and is expected to be very useful for researchers working for the development on high-temperature electronics.