M. Nishimoto

Bio: M. Nishimoto is an academic researcher from TRW Inc.. The author has contributed to research in topics: Amplifier & Monolithic microwave integrated circuit. The author has an hindex of 12, co-authored 24 publications receiving 392 citations. Previous affiliations of M. Nishimoto include Northrop Grumman Corporation.

Power-amplifier modules covering 70-113 GHz using MMICs

Abstract: A set of W-band power amplifier (PA) modules using monolithic microwave integrated circuits (MMICs) have been developed for the local oscillators of the far-infrared and sub-millimeter telescope (FIRST). The MMIC PA chips include three driver and three PAs, designed using microstrip lines, and another two smaller driver amplifiers using coplanar waveguides, covering the entire W-band. The highest frequency PA, which covers 100-113 GHz, has a peak power of greater than 250 mW (25 dBm) at 105 GHz, which is the best output power performance for a monolithic amplifier above 100 GHz to date. These monolithic PA chips are fabricated using 0.1-/spl mu/m AlGaAs/InGaAs/GaAs pseudomorphic T-gate power high electron-mobility transistors on a 2-mil GaAs substrate. The module assembly and testing, together with the system applications, is also addressed in this paper.

Electronically programmable multimode circuit

Abstract: An electronically programmable multimode circuit is described. More particularly, the present invention is an electronically programmable multimode circuit that includes a first path and a second path wherein a mode and a signal directional flow direction is controlled through the selective biasing of the first path and the second path. A multimode circuit is produced that contains modes such as a phase shifter mode, and IQ modulation mode, an amplifier mode, a mixer mode, and a multiplier mode.

Asymmetric, optimized common-source bi-directional amplifier

Abstract: A common source, bi-directional microwave amplifier is described. More particularly, the present invention is a microwave, common source, bi-directional amplifier that includes a first amplification path and a second amplification path wherein the signal directional flow is controlled through the selective biasing of the first amplification path and the second amplification path. Each amplification path is designed to optimize desired performance. For signal flow through the first amplification path, the first amplification path is biased-on and the second path is biased-off. For signal flow through the second amplification path, the second amplification path is biased-on and the first path is biased-off.

MMIC power amplifiers as local oscillator drivers for FIRST

Abstract: The Heterodyne Instrument for the Far-Infrared and Sub- millimeter Telescope requires local oscillators well into the terahertz frequency range. The mechanism to realize the local oscillators will involve synthesizers, active multiplier chains (AMC's) with output frequencies from 71 - 112.5 GHz, power amplifiers to amplify the AMC signals, and chains of Schottky diode multipliers to achieve terahertz frequencies. We will present the latest state-of-the-art results on 70 - 115 GHz Monolithic Millimeter-wave Integrated Circuit power amplifier technology.

A 44-GHz-high IP3 InP HBT MMIC amplifier for low DC power millimeter-wave receiver applications

Abstract: This paper reports on what is believed to be the highest IP3/P/sub dc/ power linearity figure of merit achieved from a monolithic microwave integrated circuit (MMIC) amplifier at millimeter-wave frequencies. The 44 GHz amplifier is based on an InP heterojunction bipolar transistor (HBT) technology with f/sub T/'s and f/sub max/'s of 70 and 200 GHz, respectively. The 44-GHz amplifier design consists of four prematched 1/spl times/l0/spl mu/m/sup 2/ four-finger (40-/spl mu/m/sup 2/) heterojunction bipolar transistor (HBT) cells combined in parallel using a compact /spl lambda//8 four-way microstrip combiner. Over a 44-50-GHz frequency band, the amplifier obtains a gain of 5.5-6 dB and a peak gain of 6.8-7.6 dB under optimum gain bias. At a low bias current of 48 mA and a total dc power of 120 mW, the amplifier obtains a peak IP3 of 34 dBm, which corresponds to an IP3/P/sub dc/ power ratio of 21:1, a factor of two better than previous state-of-the-art MMIC's reported in this frequency range. By employing a thin, lightly doped HBT collector epitaxy design tailored for lower voltage and higher IP3, a record IP3/P/sub dc/, power ratio of 42.4:1 was also obtained and is believed to be the highest reported for an MMIC amplifier of any technology. The new high-linearity HBT's have strong implications for millimeter-wave receiver as well as low-voltage wireless applications.

Terahertz detectors and focal plane arrays

Abstract: Terahertz (THz) technology is one of emerging technologies that will change our life. A lot of attractive applications in security, medicine, biology, astronomy, and non-destructive materials testing have been demonstrated already. However, the realization of THz emitters and receivers is a challenge because the frequencies are too high for conventional electronics and the photon energies are too small for classical optics. As a result, THz radiation is resistant to the techniques commonly employed in these well established neighbouring bands.

An Overview of Solid-State Integrated Circuit Amplifiers in the Submillimeter-Wave and THz Regime

Abstract: We present an overview of solid-state integrated circuit amplifiers approaching terahertz frequencies based on the latest device technologies which have emerged in the past several years. Highlights include the best reported data from heterojunction bipolar transistor (HBT) circuits, high electron mobility transistor (HEMT) circuits, and metamorphic HEMT (mHEMT) amplifier circuits. We discuss packaging techniques for the various technologies in waveguide modules and describe the best reported noise figures measured in these technologies. A consequence of THz transistors, namely ultra-low-noise at cryogenic temperatures, will be explored and results presented. We also present a short review of power amplifier technologies for the THz regime. Finally, we discuss emerging materials for THz amplifiers into the next decade.

Technology, Capabilities, and Performance of Low Power Terahertz Sources

Abstract: New and emerging terahertz technology applications make this a very exciting time for the scientists, engineers, and technologists in the field. New sensors and detectors have been the primary driving force behind the unprecedented progress in terahertz technology, but in the last decade extraordinary developments in terahertz sources have also occurred. Driven primarily by space based missions for Earth, planetary, and astrophysical science, frequency multiplied sources have dominated the field in recent years, at least in the 2-3 THz frequency range. More recently, over the past few years terahertz quantum cascade lasers (QCLs) have made tremendous strides, finding increasing applications in terahertz systems. Vacuum electronic devices and photonic sources are not far behind either. In this article, the various technologies for terahertz sources are reviewed, and future trends are discussed.

An all-solid-state broad-band frequency multiplier chain at 1500 GHz

Abstract: We report the results of a high-performance all-solid-state broad-band frequency multiplier chain at 1500 GHz, which uses four cascaded planar Schottky-barrier varactor doublers. The multipliers are driven by monolithic-microwave integrated-circuit-based high electron-mobility transistor power amplifiers around 95 GHz with 100-150 mW of pump power. The design incorporates balanced doublers utilizing novel substrateless and membrane device fabrication technologies, achieving low-loss broad-band multipliers working in the terahertz range. For a drive power of approximately 100 mW in the 88-99-GHz range, the doublers achieved room-temperature peak efficiencies of approximately 30% at the 190-GHz stage, 20% at 375 GHz, 9% at 750 GHz, and 4% at the 1500-GHz stage. When the chain was cooled to 120 K, approximately 40 /spl mu/W of peak output power was measured for 100 mW of input pump power.

Phased array systems and phased array front-end devices

Abstract: Disclosed herein is a front-end device for a phased array system. The front-end device includes an array of horn antennas, a first set of transmission lines coupled to the horn antenna array for a first polarization, a second set of transmission lines coupled to the horn antenna array for a second polarization orthogonal to the first polarization, and a plurality of L-shaped excitation elements. Each L-shaped excitation element of the plurality of L-shaped excitation elements couples a transmission line from each of the first and second sets of transmission lines to a respective horn antenna of the horn antenna array.