M. Shatzkes

Bio: M. Shatzkes is an academic researcher from IBM. The author has contributed to research in topics: Electron scattering & Boltzmann equation. The author has an hindex of 1, co-authored 1 publications receiving 1720 citations.

Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces

Abstract: In this paper, the total resistivity of a thin metal film is calculated from a model in which three types of electron scattering mechanisms are simultaneously operative: an isotropic background scattering (due to the combined effects of phonons and point defects), scattering due to a distribution of planar potentials (grain boundaries), and scattering due to the external surfaces. The intrinsic or bulk resistivity is obtained by solving a Boltzmann equation in which both grain-boundary and background scattering are accounted for. The total resistivity is obtained by imposing boundary conditions due to the external surfaces (as in the Fuchs theory) on this Boltzmann equation. Interpretation of published data on grain-boundary scattering in bulk materials in terms of the calculated intrinsic resistivity, and of thin-film data in terms of the calculated total resistivity suggests that (i) the grain-boundary reflection coefficient in Al is \ensuremath{\approx} 0.15, while it is somewhat higher in Cu; (ii) the observed thickness dependence of the resistivity in thin films is due to grain-boundary scattering as well as to the Fuchs size effect; and (iii) the common observation that single-crystal films possess lower resistivities than polycrystalline films may be accounted for by grain-boundary effects rather than by differences in the nature of surface scattering.

Past achievements and future challenges in the development of optically transparent electrodes

Abstract: Increasing demand for raw materials means that alternatives to indium-tin oxide are desired for optically transparent electrode applications. Carbon nanotube, metal nanowire networks and regular metal grids have been investigated as possible options. In this review, these materials and recently rediscovered graphene are compared with the usual transparent conductive oxides.

Anisotropic magnetoresistance in ferromagnetic 3d alloys

Abstract: The anisotropic magnetoresistance effect in 3d transition metals and alloys is reviewed. This effect, found in ferromagnets, depends on the orientation of the magnetization with respect to the electric current direction in the material. At room temperature, the anisotropic resistance in alloys of Ni-Fe and Ni-Co can be greater than 5%. The theoretical basis takes into account spin orbit coupling and d band splitting. Other properties such as permeability, magnetostriction, and Hall voltage have no simple relationship to magnetoresistance. Anisotropic magnetoresistance has an important use as a magnetic field detector for digital recording and magnetic bubbles. Such detectors because of their small size are fabricated using thin film technology. Film studies show that thickness, grain size, and deposition parameters play a significant role in determining the percentage change in magnetoresistance. In general, the change is smaller in films than bulk materials. Several tables and graphs that list bulk and film data are presented.

Tin doped indium oxide thin films: Electrical properties

Abstract: Tin doped indium oxide (ITO) films are highly transparent in the visible region, exhibiting high reflectance in the infrared region, and having nearly metallic conductivity. Owing to this unusual combination of electrical and optical properties, this material is widely applied in optoelectronic devices. The association of these properties in a single material explains the vast domain of its applicability and the diverse production methods which have emerged. Although the different properties of tin doped indium oxide in the film form are interdependent, this article mainly focuses on the electrical aspects. Detailed description of the conduction mechanism and the main parameters that control the conductivity is presented. On account of the large varieties and differences in the fabrication techniques, the electrical properties of ITO films are discussed and compared within each technique.

Electron mean free path in elemental metals

Abstract: The electron mean free path λ and carrier relaxation time τ of the twenty most conductive elemental metals are determined by numerical integration over the Fermi surface obtained from first-principles, using constant λ or τ approximations and wave-vector dependent Fermi velocities vf (k). The average vf deviates considerably from the free-electron prediction, even for elements with spherical Fermi surfaces including Cu (29% deviation). The calculated product of the bulk resistivity times λ indicates that, in the limit of narrow wires, Rh, Ir, and Ni are 2.1, 1.8, and 1.6 times more conductive than Cu, while various metals including Mo, Co, and Ru approximately match the Cu resistivity, suggesting that these metals are promising candidates to replace Cu for narrow interconnect lines.

Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller

Abstract: Copper wires were prepared in a silicon oxide matrix using the methods of semiconductor manufacturing and were electrically characterized. The width of the smallest structure was 40 nm and of the largest, 1000 nm; the heights were 50, 155, and 230 nm. Many samples of each size have been measured in order to perform a systematic investigation. The resistivity of the sample was extracted using the temperature coefficient of resistance. A significant increase in the resistivity was found for the small structures (roughly a factor 2 for 50-nm width). A model based on physical parameters was used in the analysis of the electrical data and very good agreement was obtained. The sensitivity of the various model parameters obtained by a best-fit procedure to the experimental data has been investigated. The impact of width and height on the resistivity, the influence of electron scattering at grain boundaries compared to surface scattering, and the impact of grain sizes and impurities will be discussed in detail.