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M Y Debli

Bio: M Y Debli is an academic researcher. The author has contributed to research in topics: Solid solution & Intermetallic. The author has an hindex of 1, co-authored 1 publications receiving 33 citations.

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TL;DR: The phase diagram of magnetron sputter-deposited Al-Cu thin films is simpler than the equilibrium diagram as discussed by the authors, and the films are single?Cu phase, the microstructure consists of a mixture of the solid solution?Al phase and an intermetallic compound phase, and an unexpected (Cu3Al) phase for 49.07 to 66.64 at.%Cu films.
Abstract: The phase diagram of magnetron sputter-deposited Al-Cu thin films is simpler than the equilibrium diagram. Above 86.17 at.%Cu, the films are single ?Cu phase. Below, the microstructure consists of a mixture of the solid solution ?Al phase and an intermetallic compound phase, the previous ?(Al2Cu) phase for the 1.8 to 45.99 at.%Cu films and an unexpected (Cu3Al) phase for 49.07 to 66.64 at.%Cu films. We note the appearance of a phase separation (?Al + ?Cu + Cu3 Al) in 66.64 at.%Cu films. The microhardness and the young modulus of the sputtered films increase regularly with Cu concentration reaching a maximum (H ? 8000 MPa and E ? 200 GPa). This phenomenon of strengthening of aluminium by means of copper is essentially due to a combination of solid solution effects and grain size refinement.

38 citations


Cited by
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TL;DR: In this paper, a soft chemical synthesis to aluminum nanoparticles based on the hydrogenolysis of the metastable organoaluminum (I) compound (AlCp*)4 (1) in mesitylene at 150 °C and 3 bar H2.
Abstract: In this work, we present a novel soft chemical synthesis to aluminum nanoparticles based on the hydrogenolysis of the metastable organoaluminum (I) compound (AlCp*)4 (1) in mesitylene at 150 °C and 3 bar H2. Aiming at the development of a general wet-chemical, nonaqueous route to M/E intermetallic nanophases (E = Al, Ga, In), we studied the co-hydrogenolysis of 1 with [CpCu(PMe3)] (2) as the model case aiming at Cu/Al alloyed nanoparticles. One equivalent of 1 combined with 2 equiv of 2 yields the nanocrystalline intermetallic θ-CuAl2 phase (Cu0.33Al0.67), as revealed by elemental analysis, powder X-ray diffraction, transmission electron microscopy (TEM), and energy-dispersive X-ray analysis. The obtained Cu0.33Al0.67 material was also characterized by the 27Al Knight Shift resonance. Alloy particles Cu1-xAlx (0.10 ≤ x ≤ 0.50), typically 15 ± 5 nm (TEM) in size, are accessible as colloidal solutions by variation of the molar ratio of 1 and 2 and by the addition of poly(2,6-dimethyl-1,4-phenylene oxide) du...

35 citations

Journal ArticleDOI
TL;DR: The lattice parameter of aluminium in the solid solution of the sputtered Al−Fe films is [Al-a (A)=4.052−6.6×10−3Y].
Abstract: Solid-solution formation in binary aluminium-based alloys is due essentially to the combined effects of the size and valence of solvent and solute atoms, as expected by the four Hume-Rothery rules. The lattice parameter of aluminium in the solid solution of the sputtered Al−Fe films is [Al-a (A)=4.052−6.6×10−3Y]. The increasing and decreasing evolution of the lattice parameter of copper [Cu-a (A)=3.612+1.8×10−3Z] and aluminium [Al-a (A)=4.048−1.6×10−3X] in the sputtered Al-1.8 to 92.5 at. % Cu films is a result of the difference in size between the aluminium and copper atoms. The low solubility of copper in aluminium (<1.8 at % Cu) is due to the valences of solvent and solute atoms in contrast with other sputtered films prepared under similar conditions, such as Al−Mg (20 at. % Mg), Al−Ti (27 at. % Ti), Al−Cr (5at. % Cr) and Al−Fe (5.5 at. % Fe) where the solubility is due to the difference in size.

19 citations

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TL;DR: A series of aluminum-boron (Al-B) alloy films with the addition of various levels of B content were synthesized by magnetron co-sputtering of Al and B targets as mentioned in this paper.

18 citations

Journal ArticleDOI
TL;DR: In this article, two thermal processes were used: heating the film at 400°C in a single step and heating the films in sequential steps at 100, 200, 300, and 400 °C.

15 citations

Journal ArticleDOI
TL;DR: Large area and deep sub-wavelength interference patterns are realized experimentally by using odd surface plasmon modes in the metal/insulator/metal structure, providing a cost-effective way for large area and nano-scale fabrication.
Abstract: In this paper, large area and deep sub-wavelength interference patterns are realized experimentally by using odd surface plasmon modes in the metal/insulator/metal structure. Theoretical investigation shows that the odd modes possesses much higher transversal wave vector and great inhibition of tangential electric field components, facilitating surface plasmon interference fringes with high resolution and contrast in the measure of electric field intensity. Interference resist patterns with 45 nm (∼λ/8) half-pitch, 50 nm depth and area size up to 20 mm × 20 mm were obtained by using 20 nm Al/50 nm photo resist/50 nm Al films with greatly reduced surface roughness and 180 nm pitch exciting grating fabricated with conventional laser interference lithography. Much deeper resolution down to 19.5 nm is also feasible by decreasing the thickness of PR. Considering that no requirement of expensive EBL or FIB tools are employed, it provides a cost-effective way for large area and nano-scale fabrication.

15 citations